Some embodiments relate to constructing a heat exchanger using nanoink as a thermal bond interface between portions of the heat exchanger. The heat exchanger may comprise fins and at least one base. A nanoink may be applied to at least a portion of the fins. The pieces of the heat exchanger may be sintered such that the nanoink melts and forms a bond between the pieces of the heat exchanger. Some embodiments include a second base. Some embodiments incorporate dissimilar materials within the heat exchanger construction.

A heat exchanger may include a tubular housing, a flange ring, two bases, and heat exchanger tubes that run through the housing and are each held in the bases at a longitudinal end side. A first flow channel may be formed in the heat exchanger tubes, and a second flow channel may be formed between the heat exchanger tubes and the housing. The housing may be formed from two one-piece and pot-shaped housing parts. Each housing part may have a housing section, a flange ring section, and a base. The two housing parts may be connectable to one another via the two flange ring sections.

A method of forming a refrigeration heat exchanger comprising a suction line and a capillary line includes juxtaposing at least a portion of the suction and capillary lines to form a juxtaposed portion, at least partially enveloping the juxtaposed portion with a metal material, and encapsulating the capillary line to the suction line along at least a portion of the juxtaposed portion.

A vapor chamber structure includes a first board body, a second board body and a working fluid. The first board body has a hooked section. The second board body has a hook section. The hook section and the hooked section contact and hook and connect with each other. The vapor chamber structure has no additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber structure can be both thinned and lightweight.

Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.

A microchannel heat exchanger (MCHX) includes an air-passage layer including a plurality of air-passage microchannels, a working fluid layer including a plurality of working fluid microchannels, and a sealing layer coupled to the working fluid layer to provide a working/sealing layer set. The working/sealing layer set includes an arrangement of raised pedestals. The raised pedestals may extend from the working fluid layer to the sealing layer and contact the sealing layer.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A heat exchanger for cooling intake air with a coolant is provided with a shell and first and second front faces, wherein one of the front faces is an inlet and the other an outlet for intake air. The shell has at least one coupling element disposed along a circumferential line of the shell that is spaced apart from the first front face by a predetermined distance. The shell has a port as an inlet or outlet for the coolant. The port is arranged at a spacing from the first front face. The spacing is larger than the predetermined distance. The shell has an insertion section between first front face and circumferential line. The shell has an internal duct system connected to the port for guiding the coolant into the insertion section. The coupling element can fixedly couple with at least one corresponding coupling element of an air duct.

A method for producing a shrink-fitted member by arranging a hollow type pillar shaped ceramic body inside a metal pipe and shrink-fitting them, the hollow type pillar shaped ceramic body including: an outer peripheral surface and an inner peripheral surface in a direction substantially parallel to an axial direction; and a first end face and a second end face in a direction substantially perpendicular to the axial direction. The method includes arranging the hollow type pillar shaped ceramic body inside the metal pipe while gripping the hollow type pillar shaped ceramic body using a chuck mechanism.

The invention relates to a header tank (5) for a mechanically assembled heat exchanger, notably for a motor vehicle, said exchanger (1) comprising a mechanically assembled heat-exchange core bundle (3) and comprising at least one row of tubes (31) with two end tubes (31) one at each end of said at least one row, the tubes (31) respectively comprising an end (311) intended to open into an interior volume of the header tank (5). According to the invention, the header tank (5) comprises at least one end stop (55) configured to be positioned facing an internal surface of the end (311) of an associated end tube (31) and to collaborate with said internal surface in such a way as to prevent said tube (31) from moving in the direction of the interior volume of the header tank (5).