Patent classifications
G01B15/00
Method and apparatus for detecting deposits in a pipe system of an apparatus
A method for detecting deposits in a pipe system of an apparatus is proposed, the apparatus being flowed through by a fluid. In the method it is provided that at least one microwave probe is introduced into the pipe system in such a way that the fluid flows against a window (102) of the microwave probe that is transparent to microwave radiation, and that microwaves are coupled into the pipe system by way of at least one microwave probe, wherein a reflection measurement is carried out with one or two microwave probes, and/or at least two microwave probes are introduced into the pipe system at a distance from one another and a transmission measurement is carried out, wherein a comparison of measurement data with a reference or a previous measurement is used to deduce a constriction in the pipe system segment and the free cross-section at the constriction is determined, the detection of a constriction being used to deduce the presence of deposits. Further aspects of the invention relate to a microwave probe for coupling microwave radiation into the pipe system of an apparatus and to a measuring device for carrying out the method that comprises at least one such microwave probe.
Method and apparatus for detecting deposits in a pipe system of an apparatus
A method for detecting deposits in a pipe system of an apparatus is proposed, the apparatus being flowed through by a fluid. In the method it is provided that at least one microwave probe is introduced into the pipe system in such a way that the fluid flows against a window (102) of the microwave probe that is transparent to microwave radiation, and that microwaves are coupled into the pipe system by way of at least one microwave probe, wherein a reflection measurement is carried out with one or two microwave probes, and/or at least two microwave probes are introduced into the pipe system at a distance from one another and a transmission measurement is carried out, wherein a comparison of measurement data with a reference or a previous measurement is used to deduce a constriction in the pipe system segment and the free cross-section at the constriction is determined, the detection of a constriction being used to deduce the presence of deposits. Further aspects of the invention relate to a microwave probe for coupling microwave radiation into the pipe system of an apparatus and to a measuring device for carrying out the method that comprises at least one such microwave probe.
Pattern Matching Device and Computer Program for Pattern Matching
The purpose of the present invention is to provide a pattern matching device and computer program that carry out highly accurate positioning even if edge positions and numbers change. The present invention proposes a computer program and a pattern matching device wherein a plurality of edges included in first pattern data to be matched and a plurality of edges included in second pattern data to be matched with the first pattern data are associated, a plurality of different association combinations are prepared, the plurality of association combinations are evaluated using index values for the plurality of edges, and matching processing is carried out using the association combinations selected through the evaluation.
METHOD AND SYSTEM FOR DETERMINING THE POSITION OF A RADIATION SOURCE
The present invention refers to a method for determining a position of a divergent radiation source (1), comprising Irradiating a pixel detector (2) with a predetermined intensity distribution of radiation with wavelength λ originated from the radiation source (1), wherein the pixel detector (2) comprises a plurality of pixels with pixel coordinates (x.sub.i, y.sub.i, z.sub.i); Detecting, for each of the plurality of pixels, an intensity of the incident radiation (10); Determining, for each of the plurality of pixels, an incidence direction of the incident radiation using information on an orientation of an internal periodic structure at the pixel and the predetermined intensity distribution, wavelength λ and the detected intensity; and Determining the position (x.sub.p, y.sub.p, z.sub.p) of the radiation source (1) using the pixel coordinates (x.sub.i, y.sub.i, z.sub.i) and the incidence direction for each of the plurality of pixels. The invention further refers to a system, a computer-related product and a sample (8) for performing such method and to the use of a pixel detector (2) for determining a position of a divergent radiation source (1)
METHOD AND SYSTEM FOR DETERMINING THE POSITION OF A RADIATION SOURCE
The present invention refers to a method for determining a position of a divergent radiation source (1), comprising Irradiating a pixel detector (2) with a predetermined intensity distribution of radiation with wavelength λ originated from the radiation source (1), wherein the pixel detector (2) comprises a plurality of pixels with pixel coordinates (x.sub.i, y.sub.i, z.sub.i); Detecting, for each of the plurality of pixels, an intensity of the incident radiation (10); Determining, for each of the plurality of pixels, an incidence direction of the incident radiation using information on an orientation of an internal periodic structure at the pixel and the predetermined intensity distribution, wavelength λ and the detected intensity; and Determining the position (x.sub.p, y.sub.p, z.sub.p) of the radiation source (1) using the pixel coordinates (x.sub.i, y.sub.i, z.sub.i) and the incidence direction for each of the plurality of pixels. The invention further refers to a system, a computer-related product and a sample (8) for performing such method and to the use of a pixel detector (2) for determining a position of a divergent radiation source (1)
Dimension measurement method using projection image obtained by X-ray CT apparatus
In measuring a dimension of an object to be measured W made of a single material, a plurality of transmission images of the object to be measured W are obtained by using an X-ray CT apparatus, and then respective projection images are generated. The projection images are registered with CAD data used in designing the object to be measured W. The dimension of the object to be measured W is calculated by using a relationship between the registered CAD data and projection images. In such a manner, high-precision dimension measurement is achieved by using several tens of projection images and design information without performing CT reconstruction.
SCALE-AWARE SELF-SUPERVISED MONOCULAR DEPTH WITH SPARSE RADAR SUPERVISION
Systems and methods are provided for training a depth model to recover scale factor for self-supervised depth estimation in monocular images. According to some embodiments, a method comprises receiving an image representing a scene of an environment; deriving a depth map for the image based on a depth model, the depth map comprising depth values for pixels of the image; estimating a first scale for the image based the depth values; receiving depth data captured by a range sensor, the depth data comprising a point cloud representing the scene of the environment, the point cloud comprising depth measures; determining a second scale for the point cloud based on the depth measures; determining a scale factor based the second scale and the first scale; and updating the depth model based on the scale factor, wherein the depth model generates metrically accurate depth estimates based on the scale factor.
SCALE-AWARE SELF-SUPERVISED MONOCULAR DEPTH WITH SPARSE RADAR SUPERVISION
Systems and methods are provided for training a depth model to recover scale factor for self-supervised depth estimation in monocular images. According to some embodiments, a method comprises receiving an image representing a scene of an environment; deriving a depth map for the image based on a depth model, the depth map comprising depth values for pixels of the image; estimating a first scale for the image based the depth values; receiving depth data captured by a range sensor, the depth data comprising a point cloud representing the scene of the environment, the point cloud comprising depth measures; determining a second scale for the point cloud based on the depth measures; determining a scale factor based the second scale and the first scale; and updating the depth model based on the scale factor, wherein the depth model generates metrically accurate depth estimates based on the scale factor.
Methods and systems for overlay measurement based on soft X-ray Scatterometry
Methods and systems for performing overlay and edge placement errors based on Soft X-Ray (SXR) scatterometry measurement data are presented herein. Short wavelength SXR radiation focused over a small illumination spot size enables measurement of design rule targets or in-die active device structures. In some embodiments, SXR scatterometry measurements are performed with SXR radiation having energy in a range from 10 to 5,000 electronvolts. As a result, measurements at SXR wavelengths permit target design at process design rules that closely represents actual device overlay. In some embodiments, SXR scatterometry measurements of overlay and shape parameters are performed simultaneously from the same metrology target to enable accurate measurement of Edge Placement Errors. In another aspect, overlay of aperiodic device structures is estimated based on SXR measurements of design rule targets by calibrating the SXR measurements to reference measurements of the actual device target.
Methods and systems for overlay measurement based on soft X-ray Scatterometry
Methods and systems for performing overlay and edge placement errors based on Soft X-Ray (SXR) scatterometry measurement data are presented herein. Short wavelength SXR radiation focused over a small illumination spot size enables measurement of design rule targets or in-die active device structures. In some embodiments, SXR scatterometry measurements are performed with SXR radiation having energy in a range from 10 to 5,000 electronvolts. As a result, measurements at SXR wavelengths permit target design at process design rules that closely represents actual device overlay. In some embodiments, SXR scatterometry measurements of overlay and shape parameters are performed simultaneously from the same metrology target to enable accurate measurement of Edge Placement Errors. In another aspect, overlay of aperiodic device structures is estimated based on SXR measurements of design rule targets by calibrating the SXR measurements to reference measurements of the actual device target.