A method for temperature detection and an electronic circuit for temperature detection are described. The method comprises providing a first temperature-dependent signal (Vctat) having a first temperature coefficient; providing a second temperature-dependent signal (Iptat) having a second temperature coefficient; generating a plurality of comparison signals (Vptat(1)-Vptat(n)) on the basis of the second temperature-dependent signal (Iptat), wherein each of the plurality of comparison signals Vptat(i)) represents a respective temperature (T(1)-T(n)); comparing the first temperature-dependent signal (Vctat) with at least one of the plurality of comparison signals (Vptat(1)-Vptat(n)); and outputting temperature information (TEMP) on the basis of the comparing.

A method for temperature detection and an electronic circuit for temperature detection are described. The method comprises providing a first temperature-dependent signal (Vctat) having a first temperature coefficient; providing a second temperature-dependent signal (Iptat) having a second temperature coefficient; generating a plurality of comparison signals (Vptat(1)-Vptat(n)) on the basis of the second temperature-dependent signal (Iptat), wherein each of the plurality of comparison signals Vptat(i)) represents a respective temperature (T(1)-T(n)); comparing the first temperature-dependent signal (Vctat) with at least one of the plurality of comparison signals (Vptat(1)-Vptat(n)); and outputting temperature information (TEMP) on the basis of the comparing.

In described examples, a measurement circuit includes an isolated power supply that generates an output signal in response to an input signal. A signal processing circuit is coupled to the isolated power supply and generates a first signal in response to a sense signal. A load manipulator circuit is coupled to the signal processing circuit and the isolated power supply. The load manipulator circuit receives the first signal. A detect circuit is coupled to the isolated power supply and generates a second signal in response to the input signal.

In described examples, a measurement circuit includes an isolated power supply that generates an output signal in response to an input signal. A signal processing circuit is coupled to the isolated power supply and generates a first signal in response to a sense signal. A load manipulator circuit is coupled to the signal processing circuit and the isolated power supply. The load manipulator circuit receives the first signal. A detect circuit is coupled to the isolated power supply and generates a second signal in response to the input signal.

A temperature monitoring system for monitoring a temperature status of an item from a location different than a location at which the item is located is disclosed. The temperature monitoring system includes a base having a top surface and a bottom surface, and a first unit removably engageable with the top surface of the base in at least a first orientation and a second orientation. The first unit is configured to monitor a measured temperature, to display information regarding the measured temperature, and/or to transmit temperature information to a user device. The temperature monitoring system may also include at least one thermal or temperature probe configured to measure the temperature of the item, including a probe tip, probe wire, and probe plug. The temperature monitoring system may also include one or more probe supports configured to releasably attach to the base and configured to releasably retain a thermal probe thereon.

A multi-core thermocouple includes a plurality of wires, an insulation core surrounding the plurality of wires, a sheath surrounding the insulation core, and a plurality of electrical junctions. The plurality of electrical junctions may include a first electrical junction formed between a first wire of the plurality of wires and the sheath at a first axial mid-section of the multi-core thermocouple, the first electrical junction including a first swaged axial mid-section of the sheath and a second electrical junction formed between a second wire of the plurality of wires and the sheath at a second, different axial mid-section of the multi-core thermocouple, the second electrical junction including a second swaged axial mid-section of the sheath.

A power control device is contained within a housing and has an electric current sensor configured to measure current passing through an electric outlet during a time period, a proximity sensor configured to detect a distance of an object relative to the electric outlet during the time period, a relay switch that can open or close to stop or conduct current through a circuit in the electric outlet in response to a command, and a wireless network interface in communication with the electric current sensor and the proximity sensor, the wireless network interface configured to transmit and receive data from the current sensor and the proximity sensor, to transmit commands to the relay switch, transmit the data to a computing device, and receive commands from the computing device.

In a described example, an apparatus includes: at least one electrode having a base on a first surface of a substrate and extending away from the base to an end; a counter-electrode spaced from the end of the at least one electrode, having a first conductive surface facing the end; and a package having a cavity containing the at least one electrode, the substrate, and the counter-electrode, the package having at least one opening configured to allow an atmosphere to enter the cavity.

In a described example, an apparatus includes: at least one electrode having a base on a first surface of a substrate and extending away from the base to an end; a counter-electrode spaced from the end of the at least one electrode, having a first conductive surface facing the end; and a package having a cavity containing the at least one electrode, the substrate, and the counter-electrode, the package having at least one opening configured to allow an atmosphere to enter the cavity.

A method can include, in response to a power supply voltage transition, setting a temperature window to a first temperature range by operation of a temperature circuit formed on a semiconductor device. In response to a temperature of the semiconductor device being determined to be outside of the first temperature range, changing the temperature range of the temperature window until the temperature of the semiconductor device is determined to be within the temperature window.