A method of fabricating a capacitive micromechanical electrical system (MEMS) pressure sensor includes the steps of forming a backing wafer, forming a diaphragm wafer that includes a diaphragm configured to deflect from an applied force and a pressure cavity configured to produce on the diaphragm the applied force which is indicative of a system pressure; fusing the diaphragm wafer to the backing wafer thereby forming a base wafer, forming a top wafer, joining the top wafer to the base wafer, thereby forming a detector wafer. The diaphragm defines a first capacitor surface and the top wafer defines a second capacitor surface. A void separates the second capacitor surface from the first capacitor surface by a separation distance which is a capacitor gap. A capacitive MEMS pressure sensor is also disclosed.

Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

A pressure sensor to measure low pressures, including: a body extending in a plane, the body including a measurement zone situated at an end of the body, a connection zone situated at another end of the body, the measurement zone including a cavity delimited by a wall, that is deformable under effect of a difference in pressure between inside of the cavity and an external environment, the deformable wall situated at rest in a plane parallel to the plane of the sensor; a mechanism measuring deformation of the deformable wall, the measurement mechanism situated in the cavity; an electrical connection connecting the measurement mechanism to the connection zone, the electrical connection arranged in the body.

According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

The present invention discloses a pump for measuring a pressure of fluid to be transferred, a fluid transport system using the same, and a method for operating the system. The pump includes a pumping portion alternately generating a positive pressure and a negative pressure; a first diaphragm which is provided on one side of the pumping portion and of which a shape is changed as the positive pressure and the negative pressure are alternately generated; a transport chamber which sucks and discharges a transport target fluid corresponding to the deformation of the first diaphragm; a second diaphragm which is provided on the other side of the pumping portion; a monitoring chamber which is provided on one side of the second diaphragm and of which a pressure changes corresponding to the deformation of the second diaphragm; and a pressure measuring portion measuring a pressure change of the monitoring chamber.

A pressure sensor includes a diaphragm having a first principal surface and a second principal surface, a semiconductor chip in which resistors constituting a strain gauge are formed, a first structural body having one end coupled to a center of a second principal surface of the diaphragm and the other end coupled to the other surface of the semiconductor chip, and at least two second structural bodies disposed in two straight lines, orthogonal to each other, that pass through the center of the diaphragm in plan view so as to be disposed separately from the first structural body, and having one ends coupled to the second principal surface and the other ends coupled to the other surface of the semiconductor chip, in which the resistors are formed in regions between the first structural body and the second structural bodies in plan view in the semiconductor chip.

To suppress variations in the shift amount of the zero point of a sensor output when a pipe is connected to a pressure sensor via a clamp. A pressure sensor includes two semiconductor chips in two straight lines, orthogonal to each other, that pass through a center of a diaphragm in plan view, two resistors in the region between two supporting members supporting one semiconductor chip, and two other resistors in the region between two other supporting members supporting the other semiconductor chip.

A pressure sensor system with at least two absolute pressure sensors can have an external sensor with a pressure sensitive surface in contact with atmospheric pressure (proximal) and internal sensors each with a pressure sensitive surface in contact with one or more regions at an unknown pressure (distal). The unknown pressure is determined by a means to calculate the difference between the first sensor and the internal sensors.

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

A pressure sensor for a pipe includes: a flexible strip; at least one strain sensing element; and a tensioning device. A first end of the flexible strip passes through a second end of the flexible strip. Between the first end of the flexible strip and the second end of the flexible strip, the flexible strip includes the at least one strain sensing element. The pressure sensor is attachable to the pipe. The first end of the flexible strip extends through or past the second end of the flexible strip. The tensioning device tensions the pressure sensor around the pipe.