An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

An apparatus for thermal interface material detection includes a heatsink stack up with a heatsink, a thermal interface material, a heat generating component, and a printed circuit board. The heatsink is disposed on the thermal interface material, the thermal interface material is disposed on the heat generating component, and the heat generating component is disposed on the printed circuit board. A channel in a body of the heatsink is configured for insertion of a compression probe, where a first end of the channel leads to a lower surface of the body of the heatsink and a second end of the channels leads to an upper surface of the body of the heatsink.

A method and an assembly for testing a shipping package are described. The assembly includes a scuff test sub-assembly, a belt burn test sub-assembly, and multiple conveyors positioned between to the sub-assemblies to convey a shipping package through the assembly. The scuff test sub-assembly includes an inclined plane and multiple objects which extend outward from the inclined plane. The belt burn test sub-assembly includes a plate that moves over a portion of one of the conveyors. The plate moves between a first position which obstructs movement of the shipping package but permits movement of the one of the conveyors relative to the shipping package and a second position where movement of the shipping package along the conveyor is not obstructed. At least two of the conveyors meet at a junction to change an orientation of the shipping package as the shipping package is conveyed across the junction.

A method and an assembly for testing a shipping package are described. The assembly includes a scuff test sub-assembly, a belt burn test sub-assembly, and multiple conveyors positioned between to the sub-assemblies to convey a shipping package through the assembly. The scuff test sub-assembly includes an inclined plane and multiple objects which extend outward from the inclined plane. The belt burn test sub-assembly includes a plate that moves over a portion of one of the conveyors. The plate moves between a first position which obstructs movement of the shipping package but permits movement of the one of the conveyors relative to the shipping package and a second position where movement of the shipping package along the conveyor is not obstructed. At least two of the conveyors meet at a junction to change an orientation of the shipping package as the shipping package is conveyed across the junction.

A sensor module includes a sensor configured to detect a specific substance in a sample, a first channel, and a second channel The first channel supplies a first fluid as the sample to the sensor. The second channel supplies a second fluid different from the first fluid to the sensor. The second channel includes a second fluid buffer tank for holding the second fluid for a fixed time interval.

Safety systems and material testing systems including safety systems are disclosed. An example material testing system includes: an actuator configured to control an operator-accessible component of the material testing system; an actuator disabling circuit configured to disable the actuator; and one or more processors configured to: control the actuator based on a material testing process; monitor a plurality of inputs associated with operation of the material testing system; determine, based on the plurality of inputs and the material testing process, a state of the material testing system from a plurality of predetermined states, the predetermined states comprising one or more unrestricted states and one or more restricted states; and control the actuator disabling circuit based on the determined state.

A mobile-platform imaging device uses compression of the target region to generate an image of an object. A tactile sensor has an optical waveguide with a flexible, transparent first layer. Light is directed into the waveguide. Light is scattered out of the first layer when the first layer is deformed. The first layer is deformed by the tactile sensor being pressed against the object. A force sensor detects a force pressing the tactile sensor against the object and outputs corresponding force information. A first communication unit receives the force information from the force sensor. A receptacle holds a mobile device with a second communication unit and an imager that can generate image information using light scattered out of the first layer. The first communication unit communicates with the second communication unit and the mobile device communicates with an external network.

A mobile-platform imaging device uses compression of the target region to generate an image of an object. A tactile sensor has an optical waveguide with a flexible, transparent first layer. Light is directed into the waveguide. Light is scattered out of the first layer when the first layer is deformed. The first layer is deformed by the tactile sensor being pressed against the object. A force sensor detects a force pressing the tactile sensor against the object and outputs corresponding force information. A first communication unit receives the force information from the force sensor. A receptacle holds a mobile device with a second communication unit and an imager that can generate image information using light scattered out of the first layer. The first communication unit communicates with the second communication unit and the mobile device communicates with an external network.

The present invention provides an analysis kit including a membrane-type surface stress sensor that can obtain a strong electrical signal as compared with a membrane-type surface stress sensor having a binding substance capable of binding to a target immobilized thereon. A target analysis kit of the present invention includes: a first binding substance that binds to a target; and a membrane-type surface stress sensor, wherein the membrane-type surface stress sensor includes: a second binding substance; a membrane; and a sensor substrate, wherein the second binding substance is a substance that binds to a target and is immobilized to the membrane, the membrane is a membrane that deforms upon binding of the target to the second binding substance, the sensor substrate has a support region, the support region supports the membrane and has a piezoresistive element, and the piezoresistive element is an element for detecting deformation of the membrane.

The present invention provides an analysis kit including a membrane-type surface stress sensor that can obtain a strong electrical signal as compared with a membrane-type surface stress sensor having a binding substance capable of binding to a target immobilized thereon. A target analysis kit of the present invention includes: a first binding substance that binds to a target; and a membrane-type surface stress sensor, wherein the membrane-type surface stress sensor includes: a second binding substance; a membrane; and a sensor substrate, wherein the second binding substance is a substance that binds to a target and is immobilized to the membrane, the membrane is a membrane that deforms upon binding of the target to the second binding substance, the sensor substrate has a support region, the support region supports the membrane and has a piezoresistive element, and the piezoresistive element is an element for detecting deformation of the membrane.