An environmental frequency sensing device, includes logic that performs signal strength (SS) level separation on a received band of frequencies to produce SS level separated frequencies. The logic performs frequency grouping on the SS level separated frequencies for each signal strength level to produce magnitude information for each grouping. The logic generates peak data by detecting peaks of the produced magnitude information. The logic generates an edge event indicating a signal edge based on arrival or departure of a given peak and compares, on a frequency basis, generated edges to stored fingerprint data of a signal of interest. Based on the comparison, the logic provides detected signal data indicating current use of a range of frequencies in an environment.

An integrated circuit capable of on-chip jitter tolerance measurement includes a jitter generator circuit to produce a controlled amount of jitter that is injected into at least one clock signal, and a receive circuit to sample an input signal according to the at least one clock signal. The sampled data values output from the receiver are used to evaluate the integrated circuit's jitter tolerance.

A multi-stage process for the production of an ISO 8217 Table 2 residual marine fuel Product Heavy Marine Fuel Oil from a Feedstock Heavy Marine Fuel Oil that is ISO 8217:2017 Table 2 compliant except for the Environmental Contaminants involves a Reaction System composed of one or more reactor vessels selected from a group reactor wherein said one or more reactor vessels contains one or more reaction sections configured to promote the transformation of the Feedstock Heavy Marine Fuel Oil to the Product Heavy Marine Fuel Oil. The Product Heavy Marine Fuel Oil has an Environmental Contaminant level less than 0.5 wt % and preferably a maximum sulfur content (ISO 14596 or ISO 8754) between the range of 0.05 mass % to 0.5 mass %. A process plant for conducting the process for conducting the process is also disclosed.

A balanced on-wafer load pull tuner system includes an intelligent, independent and universal mechanical balancing and contact controlling device, supporting automatic microwave single or multi-probe slide screw tuners. It allows contacting and stable on-wafer testing of sub-micrometric devices. Ultra-low loss rigid airlines (bend-lines) used to connect the tuner with the semiconductor chips, in order to improve the tuning range at the DUT reference plane, transfer mechanical movements of the wafer probes attached to the rigid bend-lines, when the tuner mobile carriages move horizontally. A precisely controlled counter-weight allows contacting the DUT and balanced load pull operation by controlling the center of gravity of the assembly.

Systems, methods, and apparatuses for magnetic field sensors with self-test include a detection circuit to detect speed and direction of a target. One or more circuits to test accuracy of the detected speed and direction may be included. One or more circuits to test accuracy of an oscillator may also be included. One or more circuits to test the accuracy of an analog-to-digital converter may also be included. Additionally, one or more IDDQ and/or built-in-self test (BIST) circuits may be included.

The implementation of modal processors, which involve the parallel combination resonant filters, may be costly for applications such as artificial reverberation that can require thousands of modes. In one embodiment, the input signal is decomposed into a plurality of subbands, the outputs of which are downsampled. In each downsampled band, resonant filters are applied at the downsampled sampling rate, and their output is upsampled and filtered to form the band output. In these and other embodiments, a feature of responses of the mode filters have been optimized to minimize an aspect of a residual error after a point in time.

A dampening device that can be coupled to a medical implant to eliminate harmful electrical oscillations. The device includes circuity that detects harmful electrical oscillations in the implant. The device also includes circuity that generates cancelling electrical signals that counter the detected electrical oscillations. Alternatively, in a medical implant having a taper junction such as a standard hip implant, resistance welding of the taper junction just prior to surgical implanting may be performed after the appropriately dimensioned components are selected to eliminate a metal on metal interface where corrosion is most likely to occur.

A dampening device that can be coupled to a medical implant to eliminate harmful electrical oscillations. The device includes circuity that detects harmful electrical oscillations in the implant. The device also includes circuity that generates cancelling electrical signals that counter the detected electrical oscillations. Alternatively, in a medical implant having a taper junction such as a standard hip implant, resistance welding of the taper junction just prior to surgical implanting may be performed after the appropriately dimensioned components are selected to eliminate a metal on metal interface where corrosion is most likely to occur.

The implementation of modal processors, which involve the parallel combination resonant filters, may be costly for applications such as artificial reverberation that can require thousands of modes. In one embodiment, the input signal is decomposed into a plurality of subbands, the outputs of which are downsampled. In each downsampled band, resonant filters are applied at the downsampled sampling rate, and their output is upsampled and filtered to form the band output. In these and other embodiments, a feature of responses of the mode filters have been optimized to minimize an aspect of a residual error after a point in time.

A test system of embodiments electrically connects one or more first semiconductor chips formed on a first wafer and one or more second semiconductor chips formed on a second wafer to perform tests on the one or more first and second semiconductor chips. The test system includes a test device that supplies a test signal to each of the one or more first semiconductor chips, a first probe device including a first probe to be connected to a first internal pad of each of the one or more first semiconductor chips and a first communication circuit configured to transmit and receive a signal, and a second probe device including a second probe to be connected to a second internal pad of each of the one or more second semiconductor chips and a second communication circuit configured to transmit and receive the signal to and from the first communication circuit.