A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

A method for attaching two electronics boards, e.g., a testing PCB and a space transformer, comprises rack welding resin prepreg and a mylar film to a testing PCB; laser drilling via holes in the resin prepreg and mylar film such that the holes are aligned on one side of the resin prepreg with connection/capture pads on the testing PCB and aligned (after attachment) on the other side of the resin prepreg with connection capture pads on a space transformer, filling the via holes with sintering paste; applying a pressure treatment to remove air, bubbles, and voids from the sintering paste; removing the mylar film; and using a lamination press cycle to attach a space transformer to the resin prepreg.

A socket assembly with liquid cooling frame for a semiconductor integrated circuit (IC) chip is provided. The socket assembly includes a liquid cooling socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path. The socket assembly also includes a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.

A method for automatically cleaning a probe card includes the following operations. A first wafer is tested in a chamber of a testing machine. A yield of the first wafer is monitored by a tool online monitor system (TOMS). An instruction file is transmitted by the TOMS to a tester, in which the instruction file compiles a first program code of the TOMS into a second program code of the tester. The second program code of the tester is received by the tester. A general purpose interface bus (GPIB) command is transferred to a testing machine by the tester. A cleaning operation is performed by the testing machine.

A method for automatically cleaning a probe card includes the following operations. A first wafer is tested in a chamber of a testing machine. A yield of the first wafer is monitored by a tool online monitor system (TOMS). An instruction file is transmitted by the TOMS to a tester, in which the instruction file compiles a first program code of the TOMS into a second program code of the tester. The second program code of the tester is received by the tester. A general purpose interface bus (GPIB) command is transferred to a testing machine by the tester. A cleaning operation is performed by the testing machine.

Proposed is an outer cylindrical spring pin including a compression spring (30), and an integrated upper probe (10) integrally provided with an upper probe portion (11) for contacting the outside, and with two upper probe side wall portions (12) which extend from the upper probe portion (11) and which surround two side surfaces facing each other, among four side surfaces of the compression spring (30). The spring pin further includes an integrated lower probe (20) integrally provided with a lower probe portion (21) for contacting the outside, and with two lower probe side wall portions (22) which extend from the lower probe portion (21) and which surround other two side surfaces between the two side surfaces. When an external force is applied, the upper and lower probe side wall portions (12 and 22) are capable of being slid on each other while being in contact with each other.

Proposed is an outer cylindrical spring pin including a compression spring (30), and an integrated upper probe (10) integrally provided with an upper probe portion (11) for contacting the outside, and with two upper probe side wall portions (12) which extend from the upper probe portion (11) and which surround two side surfaces facing each other, among four side surfaces of the compression spring (30). The spring pin further includes an integrated lower probe (20) integrally provided with a lower probe portion (21) for contacting the outside, and with two lower probe side wall portions (22) which extend from the lower probe portion (21) and which surround other two side surfaces between the two side surfaces. When an external force is applied, the upper and lower probe side wall portions (12 and 22) are capable of being slid on each other while being in contact with each other.

An input capacitance measurement circuit includes a transformer, a first capacitor, a second capacitor, and a third capacitor. A primary wire of the transformer has a first end provided so as to be connectable to an anode of the semiconductor device. The primary wire of the transformer has a second end connected to a first end of the first capacitor. A secondary wire of the transformer has a first end provided so as to be connectable to a cathode of the semiconductor device. The secondary wire of the transformer has a second end connected to a first end of the second capacitor. The third capacitor has a first end provided so as to be connectable to the cathode of the semiconductor device. A second end of the first capacitor, a second end of the second capacitor, and a second end of the third capacitor are electrically connected to each other.

An input capacitance measurement circuit includes a transformer, a first capacitor, a second capacitor, and a third capacitor. A primary wire of the transformer has a first end provided so as to be connectable to an anode of the semiconductor device. The primary wire of the transformer has a second end connected to a first end of the first capacitor. A secondary wire of the transformer has a first end provided so as to be connectable to a cathode of the semiconductor device. The secondary wire of the transformer has a second end connected to a first end of the second capacitor. The third capacitor has a first end provided so as to be connectable to the cathode of the semiconductor device. A second end of the first capacitor, a second end of the second capacitor, and a second end of the third capacitor are electrically connected to each other.

An end effector assembly for use with an electrosurgical instrument is provided. The end effector assembly has a pair of opposing jaw members. One or more of the jaw members includes a support base, an electrical jaw lead, and a sealing plate coupled to the electrical jaw lead. The sealing plate has a stainless steel layer and one or more piezo electric sensors. The jaw member also includes an insulative plate disposed between the support base and the sealing plate.