H01B12/00

Suspended superconducting transmission lines

Power transmission systems with cooling mechanisms, and methods of operating the same, are described. A power transmission system can include multiple support tower assemblies. Each of the support tower assemblies includes a support tower. One or more of the support tower assemblies includes a termination (i.e., a connection point via which electrical current and/or coolant can enter the transmission line and/or exit the transmission line). The power transmission system also includes multiple conductor assemblies suspended above a surface of the earth. Each conductor assembly includes an electrical conductor and is positioned between, and mechanically supported by, a pair of the support towers. The power transmission system also includes a coolant supply system that delivers a coolant fluid, during operation of the power transmission system, to at least one of the terminations, for cooling of the conductor assemblies.

SUPERCONDUCTING WIRE AND SUPERCONDUCTING COIL

The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca, Sr, Ba, and rare earth elements in a total of 3 ppm by mass to 400 ppm by mass; a balance being Cu and inevitable impurities, and in which a total concentration of the inevitable impurities excluding O, H, C, N, and S which are gas components is 5 ppm by mass to 100 ppm by mass.

OXIDE SUPERCONDUCTING BULK MAGNET

An oxide superconducting bulk magnet able to prevent breakage of a superconducting bulk member and able to give a sufficient amount of total magnetic flux at a superconducting bulk member surface even under high magnetic field strength conditions, comprising an oxide superconducting bulk laminate formed from sheet-shaped oxide superconducting bulk members and high strength reinforcing members arranged between the stacked oxide superconducting bulk members, the outer circumference of the oxide superconducting bulk laminate being provided with an outer circumference reinforcing member.

Above room temperature type II superconductor
11710584 · 2023-07-25 · ·

A Type II superconductor includes a perforated carbonaceous material with an activating material on at least one surface. The activating material a non-polar liquid that does not incorporate Pi-bonding in its structure. The superconductor is manufactured by perforating a carbonaceous material to produce voids and coating at least one surface of the carbonaceous material with the activating material. A superconductive cable includes wires with a perforated carbonaceous material wetted with the activating material on a non-conductive substrate interspersed with non-conducting spacers and surrounded by an insulation layer. The superconductor conducts current at room temperature and above.

Semiconductor memory structure and method for manufacturing the same
11700724 · 2023-07-11 · ·

A semiconductor structure includes a semiconductor substrate including a first active region and a chop region. The semiconductor structure also includes a source/drain region disposed in the first active region, an isolation structure disposed in the chop region, and a gate structure extending at least across the isolation structure in the chop region. The gate structure includes a gate electrode layer and a gate lining layer lining on the gate electrode layer. The gate lining layer includes a first portion having an upper surface that is lower than a bottom surface of the source/drain region.

MGB2 superconducting wire material and manufacturing method therefor

The purpose of the present invention is to provide a method for causing sufficient deformation in precursor particles even when a soft high-purity metal is used for an outer layer material in mechanical milling, and manufacturing an MgB.sub.2 superconducting wire. A method for manufacturing an MgB.sub.2 superconducting wire in which an MgB.sub.2 filament is covered by an outer layer material, the method comprising: subjecting magnesium powder and boron powder to a shock that is insufficient for MgB.sub.2 to be clearly produced, and producing precursor particles in which boron particles are dispersed inside a magnesium matrix; filling a metal tub with the precursor particles; processing the metal tube filled with precursor particles to form a wire; and heat-treating the wire to synthesize the MgB.sub.2; wherein the method is characterized in that a portion of the wire-drawing step includes swaging.

MGB2 superconducting wire material and manufacturing method therefor

The purpose of the present invention is to provide a method for causing sufficient deformation in precursor particles even when a soft high-purity metal is used for an outer layer material in mechanical milling, and manufacturing an MgB.sub.2 superconducting wire. A method for manufacturing an MgB.sub.2 superconducting wire in which an MgB.sub.2 filament is covered by an outer layer material, the method comprising: subjecting magnesium powder and boron powder to a shock that is insufficient for MgB.sub.2 to be clearly produced, and producing precursor particles in which boron particles are dispersed inside a magnesium matrix; filling a metal tub with the precursor particles; processing the metal tube filled with precursor particles to form a wire; and heat-treating the wire to synthesize the MgB.sub.2; wherein the method is characterized in that a portion of the wire-drawing step includes swaging.

Semiconductor memory structure and method for forming the same

A method for forming a semiconductor memory structure includes providing a semiconductor substrate; forming a hard mask layer on the semiconductor substrate; forming a contact opening corresponding to the pair of word lines through the hard mask layer and a portion of the semiconductor substrate; forming a pair of spacers on sidewalls of the contact opening; filling the contact opening with a conductive material to form a contact; forming a bit line directly above the contact and the pair of spacers, and forming a dielectric liner on sidewalls of the bit line. The pair of word lines is embedded in an active region of the semiconductor substrate and extends in a first direction. The bit line extends in a second direction. The first direction is perpendicular to the second direction.

Thermal-insulated multi-walled pipe for superconducting power transmission

Provided is a thermal-insulated multi-walled pipe for superconducting power transmission that highly prevents intrusion of external heat due to radiation and has excellent thermal insulation property without using a superinsulation. A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; and a multi-walled pipe that houses the superconducting cable, wherein the multi-walled pipe is composed of a plurality of straight pipes, and at least one of the plurality of straight pipes has, at a surface thereof, a zinc or zinc alloy-plated layer having an average spangle size of 2.0 mm or less.

Thermal-insulated multi-walled pipe for superconducting power transmission

Provided is a thermal-insulated multi-walled pipe for superconducting power transmission that highly prevents intrusion of external heat due to radiation and has excellent thermal insulation property without using a superinsulation. A thermal-insulated multi-walled pipe for superconducting power transmission comprises: a superconducting cable; and a multi-walled pipe that houses the superconducting cable, wherein the multi-walled pipe is composed of a plurality of straight pipes, and at least one of the plurality of straight pipes has, at a surface thereof, a zinc or zinc alloy-plated layer having an average spangle size of 2.0 mm or less.