A system for controlling a flow rate through an HVAC component is provided. The system includes a controller communicably coupled with a potentiometer and an actuator configured to drive the HVAC component between multiple positions to affect the flow rate. The controller configured to determine an actuator position setpoint based on a flow rate setpoint, drive the actuator to the actuator position setpoint using a calculated travel period, and set a current actuator position based on a voltage signal received from the potentiometer upon stopping the actuator at an expiration of the calculated travel period.

A system for controlling a flow rate through an HVAC component is provided. The system includes a controller communicably coupled with a potentiometer and an actuator configured to drive the HVAC component between multiple positions to affect the flow rate. The controller configured to determine an actuator position setpoint based on a flow rate setpoint, drive the actuator to the actuator position setpoint using a calculated travel period, and set a current actuator position based on a voltage signal received from the potentiometer upon stopping the actuator at an expiration of the calculated travel period.

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body.

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body.

A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

Stacks of electrically resistive materials and related apparatuses, electrical systems, and methods are disclosed. An apparatus includes one or more resistor devices including a substrate, first and second electrically resistive materials, and an electrically insulating material between the first and second electrically resistive materials. The substrate includes a semiconductor material. A stepped trench is defined in the substrate by sidewalls and horizontal surfaces of the semiconductor material. The first electrically resistive material and the second electrically resistive material are within the stepped trench. A method of manufacturing a resistor device includes forming a stepped trench in the substrate, forming an etch stop material within the stepped trench, disposing an electrically resistive material within the stepped trench, disposing an electrically insulating material on the electrically resistive material, and repeating the disposing the electrically resistive material and the disposing the electrically insulating material operations a predetermined number of times.

Stacks of electrically resistive materials and related apparatuses, electrical systems, and methods are disclosed. An apparatus includes one or more resistor devices including a substrate, first and second electrically resistive materials, and an electrically insulating material between the first and second electrically resistive materials. The substrate includes a semiconductor material. A stepped trench is defined in the substrate by sidewalls and horizontal surfaces of the semiconductor material. The first electrically resistive material and the second electrically resistive material are within the stepped trench. A method of manufacturing a resistor device includes forming a stepped trench in the substrate, forming an etch stop material within the stepped trench, disposing an electrically resistive material within the stepped trench, disposing an electrically insulating material on the electrically resistive material, and repeating the disposing the electrically resistive material and the disposing the electrically insulating material operations a predetermined number of times.

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body.

An electrical component having a layered structure including first and second electrodes each having first and second electrode portions located in a plane and at least partially embedded in a dielectric body, each of the first and second electrode portions separated by a gap and substantially isolated by the dielectric, the first electrode substantially parallel to and at least partially overlapping the second electrode, wherein the first and second electrodes are electrically isolated and separated by the dielectric body.

A method of fabricating a magnetoresistive device may comprise forming an electrically conductive region and forming a first seed region on one side of the electrically conductive region. A surface of the first seed region may be treated by exposing the surface to a gas. A second seed region may be formed on the treated surface of the first seed region. The method may also comprise forming a magnetically fixed region on one side of the second seed region.