The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of −30 μm/50 mm to 700 μm/50 mm.

A resistance element includes a plurality of resistance chips stacked vertically, each of the plurality of resistance chips including a semiconductor substrate, one or more resistance layers on a field insulating film, a pad forming electrode on electrically connected to the one or more resistance layers, a relay wiring on the interlayer insulating film, laterally separated from the pad forming electrode, electrically connected to another end of at least one of the one or more resistance layers on one end and to a semiconductor substrate on another end, and a back surface electrode at a bottom of the semiconductor substrate, making ohmic contact with the semiconductor substrate, wherein the plurality of resistance chips have the same planar outer shape, and are stacked one over another so as to constitute a resistor as a whole.

Resistive elements are formed in belt shape in regions sandwiched between secondary division prediction lines set onto a large substrate and extending in a direction orthogonal to primary division prediction lines, a plurality of front electrodes disposed facing each other at predetermined intervals on the resistive elements are formed so as to be across the primary division prediction lines, a glass coat layer covering each of the resistive elements and extending in the direction orthogonal to the secondary division prediction lines is formed, a resin coat layer covering an entire surface of the large substrate from a top of the glass coat layer is formed, and after that, the large substrate is diced along the primary division prediction lines and the secondary division prediction lines to obtain individual chip base bodies.

A thermistor-based thermal probe includes a thermistor die having a thermistor thereon with first and second bond pads coupled across the thermistor, and first and second die interconnects coupled to the respective bond pads. First and second wires W1, W2 that extend beyond the thermistor die are attached to the first and to the second die interconnects, respectively. An encapsulant material encapsulates the thermistor die and a die end of the first and second wires.

A method is provided for forming a thin film resistor (TFR) in an integrated circuit (IC) device. A TFR film is formed and annealed over an IC structure including IC elements and IC element contacts. At least one TFR cap layer is formed, and a TFR etch defines a TFR element from the TFR film. A TFR contact etch forms TFR contact openings over the TFR element, and a metal layer is formed over the IC structure and extending into the TFR contact openings to form metal contacts to the IC element contacts and the TFR element. The TFR cap layer(s), e.g., SiN cap and/or oxide cap formed over the TFR film, may (a) provide an etch stop during the TFR contact etch and/or (b) provide a hardmask during the TFR etch, which may eliminate the use of a photomask and thereby eliminate post-etch removal of photomask polymer.

A lead wire straightening device including a control device that disposes a lead wire of a lead component that is held by a holding section between a first claw section and a second claw section. The control device causes an opening/closing driving section of a straightening unit to clamp and straighten the lead wire by the first and second claw sections. After the lead wire is clamped, the control device causes a driving section to rotate at least one of the holding section and the straightening unit to thereby change positions of the first and second claw sections relative to the lead wire. Then, after changing the positions of the first and second claw sections relative to the lead wire, the control device causes the first and second claw sections to clamp the lead wire again to straighten the lead wire.

A method of calibrating a control system based on a parametric value of a component. The method includes receiving a current from a component of the control system. The component is communicatively coupled to a controller and has a parametric resistor with a parametric resistance value correlating to a parametric value associated with the component. The method further includes determining the resistance value of the parametric resistor by measuring a parametric voltage rating from the current. The method further includes mapping the resistance value to the parametric value associated with the component. The method further includes generating a calibration data set. The calibration data set is based on calibrating the control system to calibrate for the parametric value. The method further includes transmitting a signal to the component. The signal is based on the calibration data set and is configured to calibrate operation of the component.

A method of calibrating a control system based on a parametric value of a component. The method includes receiving a current from a component of the control system. The component is communicatively coupled to a controller and has a parametric resistor with a parametric resistance value correlating to a parametric value associated with the component. The method further includes determining the resistance value of the parametric resistor by measuring a parametric voltage rating from the current. The method further includes mapping the resistance value to the parametric value associated with the component. The method further includes generating a calibration data set. The calibration data set is based on calibrating the control system to calibrate for the parametric value. The method further includes transmitting a signal to the component. The signal is based on the calibration data set and is configured to calibrate operation of the component.

An electronic smoking article includes an outer tube extending in a longitudinal direction, an inner tube within the outer tube and including a pair of opposing slots, a liquid supply comprising a liquid material, a coil heater, a wick and a mouth end insert. The coil heater is located in the inner tube. The coil heater is formed of an iron-free, nickel-chromium alloy and has substantially uniformly spaced windings. The wick is surrounded by the coil heater such that the wick delivers liquid material to the coil heater and the coil heater heats the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol in the inner tube.

An electronic smoking article includes an outer tube extending in a longitudinal direction, an inner tube within the outer tube and including a pair of opposing slots, a liquid supply comprising a liquid material, a coil heater, a wick and a mouth end insert. The coil heater is located in the inner tube. The coil heater is formed of an iron-free, nickel-chromium alloy and has substantially uniformly spaced windings. The wick is surrounded by the coil heater such that the wick delivers liquid material to the coil heater and the coil heater heats the liquid material to a temperature sufficient to vaporize the liquid material and form an aerosol in the inner tube.