H01F3/00

Solenoid low friction bearing liner

The present disclosure relates to a low friction bearing liner for a solenoid that may include a core layer, a first outer layer overlying a first surface of the core layer, a second outer layer overlying the first outer layer, a first inner layer overlying a second surface of the core layer that is opposite of the first surface of the core layer, and a second inner layer overlying the first inner layer. The first outer layer and the first inner layer may include a fluoropolymer material and may have a melt flow rate of at least about 2 g/10 min at 372° C. The second outer layer and the second inner layer may include a fluoropolymer material distinct from the fluoropolymer material of the first outer layer and may have a surface coefficient of friction of not greater than about 0.2.

Voltage regulator module

A voltage regulator module with a vertical layout structure includes a circuit board assembly, an electroplated region and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. The printed circuit board includes a first surface, a second surface, a plurality of lateral surfaces, an accommodation space and a conductive structure. The switch element is disposed on the first surface. A conduction part is formed on the second surface. The conductive structure is perpendicular to the printed circuit board and disposed within the accommodation space. The electroplated region is formed on the corresponding lateral surface, arranged between the conduction part and the first surface, and electrically connected with the conduction part and the switch element. The magnetic core assembly is accommodated within the accommodation space. Consequently, an inductor is defined by the conductive structure and the magnetic core assembly collaboratively.

Voltage regulator module

A voltage regulator module with a vertical layout structure includes a circuit board assembly, an electroplated region and a magnetic core assembly. The circuit board assembly includes a printed circuit board and at least one switch element. The printed circuit board includes a first surface, a second surface, a plurality of lateral surfaces, an accommodation space and a conductive structure. The switch element is disposed on the first surface. A conduction part is formed on the second surface. The conductive structure is perpendicular to the printed circuit board and disposed within the accommodation space. The electroplated region is formed on the corresponding lateral surface, arranged between the conduction part and the first surface, and electrically connected with the conduction part and the switch element. The magnetic core assembly is accommodated within the accommodation space. Consequently, an inductor is defined by the conductive structure and the magnetic core assembly collaboratively.

TRANSFORMER ARRANGEMENT
20220406509 · 2022-12-22 ·

The present disclosure relates to a transformer arrangement (1) for mounting in an electrical power unit of a vehicle. The arrangement (1) comprising a transformer core (2) and a thermal shell (3) in contact with said transformer core (2). The transformer core (2) comprises a plurality of winding portions (4) extending from a common centre portion (c1) of said core (2), along a first axis (x1), a second axis (x2) and a third axis, (x3) each axis (x1, x2, x3) being orthogonal relative to each of the other axis (x1, x2, x3). Furthermore, each winding portion (4) comprises a conductive coil arrangement (5) wound around each winding portion (4).

TRANSFORMER ARRANGEMENT
20220406509 · 2022-12-22 ·

The present disclosure relates to a transformer arrangement (1) for mounting in an electrical power unit of a vehicle. The arrangement (1) comprising a transformer core (2) and a thermal shell (3) in contact with said transformer core (2). The transformer core (2) comprises a plurality of winding portions (4) extending from a common centre portion (c1) of said core (2), along a first axis (x1), a second axis (x2) and a third axis, (x3) each axis (x1, x2, x3) being orthogonal relative to each of the other axis (x1, x2, x3). Furthermore, each winding portion (4) comprises a conductive coil arrangement (5) wound around each winding portion (4).

Superconductor magnetic field effect transistor with solenoid
11525878 · 2022-12-13 · ·

A superconductor magnetic field effect transistor. The superconductor magnetic field effect transistor may include a sheet of a superconducting material; and a solenoid. The sheet may be substantially flat, and the solenoid may include a plurality of turns, each of the turns being substantially parallel to the sheet. The superconducting material may be a type-II superconducting material.

ELECTRICAL ASSEMBLY

An electrical assembly may include an electrically conductive first member, a magnetic second member, and/or a housing molded on the first member and the second member. A method of assembling an electrical assembly may include disposing the first member in contact with a first mold, disposing the second member in contact with the first mold, moving a second mold into contact with the first mold, and/or inserting a housing material (e.g., liquid plastic) into the first mold and the second mold to form the housing.

Method and Apparatus for Plating Metal and Metal Oxide Layer Cores
20230082177 · 2023-03-16 ·

An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

Method and Apparatus for Plating Metal and Metal Oxide Layer Cores
20230082177 · 2023-03-16 ·

An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.

Electromagnetic system including electromagnetic cells and an electromagnetic plate
11482363 · 2022-10-25 ·

Disclosed are electromagnetic cells assembled together. The plurality of Electromagnetic Cells are arranged in an electromagnetic plate, the electromagnetic plate can float or hover. The Electromagnetic Plate comprises an enclosure of a first set of alternating layers of electric and dielectric materials. The plurality of electromagnetic cells, each arranged in an individual socket embedded in the holding element inside the Electromagnetic plate, and each electromagnetic cell is comprised of a second set of alternating layers of electric and dielectric materials, and a holding cup cover that screws in to provide structural integrity and an electromagnetic core including a metal tube and electromagnetic coil. At the opening of the Electromagnetic Cell, a tube mechanism can be added which would allow certain liquids to be inserted inside of the cell. The cells heats up as a result of the electric current flowing through the coil inside of the cell, thus resulting in an increased temperature of such liquid.