A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

An electrical product including: an electrical component; a first power supply member and a second power supply member; and an insulating plate provided between the first power supply member and the second power supply member. The first power supply member is formed with a fixing hole which penetrates the first power supply member. The insulating plate is formed with a protrusion inserted into the fixing hole. The product is manufactured by preparing a jig with a recessed hole; placing the first power supply member on the jig; placing the insulating plate on the first power supply member so that the protrusion penetrates the fixing hole and the recessed hole.

An electrical product including: an electrical component; a first power supply member and a second power supply member; and an insulating plate provided between the first power supply member and the second power supply member. The first power supply member is formed with a fixing hole which penetrates the first power supply member. The insulating plate is formed with a protrusion inserted into the fixing hole. The product is manufactured by preparing a jig with a recessed hole; placing the first power supply member on the jig; placing the insulating plate on the first power supply member so that the protrusion penetrates the fixing hole and the recessed hole.

A second busbar is provided that has a second electrode terminal and a second connection terminal. A first busbar is provided that has a first electrode terminal, a lateral side coupler, an overhang, and a first connection terminal. The first electrode terminal and/or the second electrode terminal has a protruding piece for connection (connecting protrusion). This protruding piece is elastically depressible in response to contact with an electrode surface of a capacitor element unit inserted from an opposite side of the lateral side coupler across a space between the first and second electrode terminals.

An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W.sub.1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W.sub.2 that is greater than the width W.sub.1 so surfaces of the channel at the narrowest section defined by width W.sub.1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.

[Problem] Upon application or film formation of a particulate matter to/on an object, the particulate matter moving with a speed is heated in a time duration from a suction port for particulate matter to the object, thereby softening or melting at least some of the particulate matter when the particulate matter is applied to the object.

[Solution] A particulate matter is heated by means of induction heating or laser in a time duration from a suction port for particulate matter to an object, so that at least some of the particulate matter is softened or melted at a relatively low temperature on the object in synergy with the collision energy of the particulate matter with the object, thereby enabling the application or film formation of the particulate matter.

An electronic component manufacturing method comprising: a first step of moving an electronic component body in a first direction relative to a dip layer of a conductive paste to immerse the electronic component body in the dip layer; a second step of moving the electronic component body relative to the dip layer in a second direction that is opposite to the first direction, thereby separating the electronic component body from the dip layer; a third step of forcibly cutting a connection between the conductive paste coated on the end portions of the electronic component body and the dip layer, using a contact with a solid or fluid cutter; and a fourth step of removing excess paste from the conductive paste coated on the end portions of the electronic component body. The third and fourth steps may be conducted simultaneously by cutting and removing the paste with the paste removal member.

A capacitor aging apparatus that includes continuity check pads configured to be electrically connected to positive electrodes of a plurality of capacitors in one-to-one correspondence to check electrical continuity with the plurality of capacitors a plurality of first terminals electrically connected to the plurality of continuity check pads; a plurality of second terminals electrically connected to the plurality of first terminals in one-to-one correspondence; and a plurality of connectors configured to be electrically connected to and disconnected from the plurality of first terminals and the plurality of second terminals, and configured to electrically connect the positive electrodes of the plurality of capacitors, the plurality of connectors each allowing a second terminal corresponding to one capacitor of corresponding two capacitors among the plurality of capacitors to be electrically connected to a first terminal corresponding to another capacitor.

An apparatus and a method for processing a capacitor according to the present disclosure may include a clamping module grabbing or releasing a capacitor to transport the capacitor, and a first processing module and a second processing module matched with each other to process and test leads of the capacitor, and simultaneously perform various processes through different processing units formed in the first processing module and symmetrical processing units formed in the second processing module and corresponding to be matched with the processing units. By providing the apparatus and method for processing the capacitor, it is possible to process a larger amount of capacitors assembled to a capacitor assembly and identify and remove the electrical defect before assembled to the assembly.

There is provided a multilayer electronic component in which a short circuit between the internal electrodes, a decrease in capacitance, a decrease in breakdown voltage, and the like, may be suppressed by controlling an area fraction occupied by a region in which an intensity of brightness in a capacitance formation portion is 110% or more and 126% or less of an average value of an intensity of brightness of a cover portion.