A doping system is configured to dope an active material included in an electrode with an alkali metal. The doping system includes a doping bath, a conveyor unit, a connection unit, and a drying unit. The doping bath is configured to store a solution containing alkali metal ion and a counter electrode unit. The conveyor unit is configured to convey the electrode along a path that passes through the doping bath. The connection unit includes an electrically conductive electric power supply roller that contacts the electrode, and is configured to couple the electrode to the counter electrode unit. The drying unit is configured to spray a gas onto the electrode that passes through the doping bath and is being conveyed to the electric power supply roller.

An inspection device (20) for inspecting a structure body (10) including a pair of electrodes and a separator disposed between the pair of electrodes is provided, the inspection device (20) includes: a measurement unit (30) including a direct-current constant voltage generator (32) that generates a constant inspection voltage applied to the pair of electrodes, and a detection circuit (34) that detects a current value between the pair of electrodes resulting from the application of the inspection voltage; and a processing unit (50) that determines whether the structure body (10) is defective or non-defective based on the detected current value, and the processing unit (50) has a function that, if two or more points at which a ratio (ΔI/Δt) of a current value variation amount (ΔI) to a time variation amount (Δt) varies from a value of no less than 0 to a negative value are observed or no point at which the ratio (ΔI/Δt) varies from a value of no less than 0 to a negative value is observed during a period of time immediately after the application of the inspection voltage until the current value becomes constant, determines the structure body (10) as a defective product, and an auxiliary function that obtains a peak current value I.sub.peak, a peak current appearing time t.sub.peak and a current area S.sub.I of a current waveform representing variation in current value I over passage of time t, and if any one of the peak current value I.sub.peak, the peak current appearing time t.sub.peak and the current area S.sub.I deviates from a preset threshold value including an upper limit value and a lower limit value, determines the structure body as a defective product.

A method includes processes of (a processing part 8) calculating an estimated heat generation temperature by using drive conditions (22, a storage part 6) at least including drive timing information (18) and drive current value information (20), and temperature change characteristic information (24) of a capacitor, calculating state change information (28) of the capacitor after elapse of a reference time by using the estimated heat generation temperature, and calculating a lifespan estimation value (lifespan estimation result 30) of the capacitor by using the state change information. This enables capacitor lifespan estimation corresponding to fluctuations of a drive current value flowing through the capacitor, the applicability of the capacitor is confirmed, and the safety of equipment using the capacitor is improved.

A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1<H<D+L1+L2 and D<H hold.

A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1<H<D+L1+L2 and D<H hold.

In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.

A MIM structure and manufacturing method thereof are provided. The MIM structure includes a substrate having a first surface and a metallization structure over the substrate. The metallization structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, a top electrode layer on the ferroelectric layer, a first contact electrically coupled to the top electrode layer, and a second contact penetrating the dielectric layer and the ferroelectric layer, electrically coupled to the bottom electrode layer.

A MIM structure and manufacturing method thereof are provided. The MIM structure includes a substrate having a first surface and a metallization structure over the substrate. The metallization structure includes a bottom electrode layer, a dielectric layer on the bottom electrode layer, a ferroelectric layer on the dielectric layer, a top electrode layer on the ferroelectric layer, a first contact electrically coupled to the top electrode layer, and a second contact penetrating the dielectric layer and the ferroelectric layer, electrically coupled to the bottom electrode layer.

A pre-press process includes a first step for bonding a first end portion of each of a plurality of electronic component bodies to a bonding surface of a flat plate material disposed in a jig, a second step for moving the jig relative to a surface plate, a third step for bringing a second end portions of each of the plurality of electronic component bodies into contact with the surface plate while the flat plate material is in a softened state so that the flat plate material is deformed to align respective positions of end surfaces of the second end portions, a fourth step for curing the flat plate material, and then a fifth step for moving the jig relative to the surface plate to separate from the surface plate the plurality of electronic component bodies in which the respective positions of the end surfaces are aligned.

A pre-press process includes a first step for bonding a first end portion of each of a plurality of electronic component bodies to a bonding surface of a flat plate material disposed in a jig, a second step for moving the jig relative to a surface plate, a third step for bringing a second end portions of each of the plurality of electronic component bodies into contact with the surface plate while the flat plate material is in a softened state so that the flat plate material is deformed to align respective positions of end surfaces of the second end portions, a fourth step for curing the flat plate material, and then a fifth step for moving the jig relative to the surface plate to separate from the surface plate the plurality of electronic component bodies in which the respective positions of the end surfaces are aligned.