Patent classifications
H01G7/00
Methods and apparatuses for use in tuning reactance in a circuit device
Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.
Methods and apparatuses for use in tuning reactance in a circuit device
Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.
Nonvolatile tunable capacitive processing unit
In an approach for forming a nonvolatile tunable capacitor device, a first electrode layer is formed distally opposed from a second electrode layer, the first electrode layer configured to make a first electrical connection and the second electrode layer configured to make a second electrical connection. A dielectric layer is posited between the first electrode layer and adjacent to the second electrode layer. A phase change material (PCM) layer is posited between the first electrode layer and the second electrode layer adjacent to the dielectric layer. An energizing component is provided to heat the PCM layer to change a phase of the PCM layer. The energizing component may include a heating element or electrical probe in direct contact with the PCM layer, that when energized is configured to apply heat to the PCM layer. The phase of the PCM layer is changeable between an amorphous phase and a crystalline phase.
Electrostatic capacitance element and resonance circuit
A capacitance element body is configured by two or more capacitors, the capacitors being formed of a dielectric layer and at least three internal electrodes, the internal electrodes each being laminated via the dielectric layer and arranged to allow a center of gravity of an electrode body forming electrostatic capacitance to be arranged on a straight line in a lamination direction. In the capacitance element body, said two or more capacitors are serially connected in a lamination direction of the internal electrodes. Furthermore, external terminals, each being electrically connected to an electrode body forming electrostatic capacitance, are formed in side surfaces of the capacitance element body.
Electrostatic capacitance element and resonance circuit
A capacitance element body is configured by two or more capacitors, the capacitors being formed of a dielectric layer and at least three internal electrodes, the internal electrodes each being laminated via the dielectric layer and arranged to allow a center of gravity of an electrode body forming electrostatic capacitance to be arranged on a straight line in a lamination direction. In the capacitance element body, said two or more capacitors are serially connected in a lamination direction of the internal electrodes. Furthermore, external terminals, each being electrically connected to an electrode body forming electrostatic capacitance, are formed in side surfaces of the capacitance element body.
Method for stacking electronic components
A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.
BST capacitor control
A circuit for controlling a capacitor having a capacitance adjustable by biasing, including an amplifier for delivering a D.C. bias voltage, having a feedback slowed down by a resistive and capacitive cell.
BST capacitor control
A circuit for controlling a capacitor having a capacitance adjustable by biasing, including an amplifier for delivering a D.C. bias voltage, having a feedback slowed down by a resistive and capacitive cell.
MEMS variable capacitor and method for driving the same
Disclosed herein is an MEMS variable capacitor and its driving method, the MEMS variable capacitor including, a first electrode, a second electrode floating over the first electrode upper part, a fixed electrode separated at the second electrode side surface, and a drifting electrode placed between the second electrode and the fixed electrode, connected to the second electrode, and physically contacting the fixed electrode by a voltage applied to the fixed electrode.
Method of manufacturing terminal-attached electric wire and terminal-attached electric wire
A method of manufacturing a terminal-attached electric wire includes: installing an electric wire including a core wire including a plurality of element wires to a terminal having a conductor coupling part having a pair of barrel pieces, the core wire being installed between the pair of barrel pieces; bending the pair of barrel pieces to cause the pair of barrel pieces to wrap around and cover the core wire in a circumferential direction to form a slit extending in an axial direction between the pair of barrel pieces, with respect to the circumferential direction; melting the element wires of the core wire by emitting laser light toward the core wire through the slit; and adhering the element wires melted with the laser light to the conductor coupling part.