Patent classifications
H01H65/00
Method of forming a keypad assembly
A keypad for an electronic device is provided and includes a substrate comprising an array of dome elements, an array of frets, an array of mechanical keys disposed in rows interleaved between the frets, a first deflection web supportively disposed adjacent to the substrate and a second deflection web disposed between the frets and the keys and the first deflection web. The substrate is configured to pre-load the first and second deflection webs toward the keys.
Service plug
This service plug (1) has a connection terminal part (49), and the connection terminal part (49) has a pair of terminals (8) and an interlinking part (9) that is tailored to the spacing between the terminals (8) and joins the terminals (8) together. By removing the connection terminal part (49) from a power-supply circuit, the power-supply circuit is interrupted. The interlinking part (9) includes one or more thin interlinking plates (20) that are removably attached to the connection terminal part (49).
Method of manufacturing a switch
MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
Process of manufacturing heat resistant and low carbon plate for circuit breaker
A process of manufacturing a heat resistant and low carbon plate for a circuit breaker includes preparing a heat resistant and low carbon plate for a circuit breaker; coating the heat resistant and low carbon plate with organic material; coating the organic material with inorganic material; and heating and drying the heat resistant and low carbon plate. The process continuously grips each of heat resistant and low carbon plates conveyed on a conveyor with a coat application device being used for the coating steps. A circuit breaker having the heat resistant and low carbon plate is also provided.
Laser processing of fabric for electronic devices
An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The circuitry of the electronic device may include components mounted on a printed circuit. The components may include movable components such as keys in a keyboard. A fabric layer may overlap the keys. Border regions of the fabric layer that surround each key may be characterized by a stiffness. To ensure that the keys or other movable components in the device exhibit satisfactory stiffness levels, the keys can be tested and selected border regions or other fabric layer portions may be laser ablated or otherwise processed to locally reduce fabric layer stiffness.
Method of manufacturing a switch
MEMS switches and methods of manufacturing MEMS switches is provided. The MEMS switch having at least two cantilevered electrodes having ends which overlap and which are structured and operable to contact one another upon an application of a voltage by at least one fixed electrode.
Electronic rotary switch
An electronic switch includes a substrate and a rotator assembly. The rotator assembly is configured to prevent rotation between a first rotational configuration and a second rotational configuration in a first translational position of the rotator assembly, while the rotator assembly is configured to rotate between the first rotational configuration and the second rotational configuration in a second translational position of the rotator assembly. The second translational position of the rotator assembly is translationally offset from the first translational position of the rotator assembly. An electrical contact of the rotator assembly is configured to electrically connect an electronic input path of the substrate to an electronic output path of the substrate in the first rotational configuration and first translational position of the rotator assembly, but not to electrically connect the electronic input path to the electronic output path in the second rotational configuration of the rotator assembly or in the second translational position of the rotator assembly.
Electronic rotary switch
An electronic switch includes a substrate and a rotator assembly. The rotator assembly is configured to prevent rotation between a first rotational configuration and a second rotational configuration in a first translational position of the rotator assembly, while the rotator assembly is configured to rotate between the first rotational configuration and the second rotational configuration in a second translational position of the rotator assembly. The second translational position of the rotator assembly is translationally offset from the first translational position of the rotator assembly. An electrical contact of the rotator assembly is configured to electrically connect an electronic input path of the substrate to an electronic output path of the substrate in the first rotational configuration and first translational position of the rotator assembly, but not to electrically connect the electronic input path to the electronic output path in the second rotational configuration of the rotator assembly or in the second translational position of the rotator assembly.
Method of manufacturing a submersible electrical enclosure for a switchgear assembly
A submersible electrical enclosure is for a switchgear assembly. The switchgear assembly includes a number of electrical switching apparatus. The submersible electrical enclosure includes: a plurality of sides defining an interior, the interior receiving each of the electrical switching apparatus, each side including: a conductive polymeric layer facing away from the interior, and an insulative polymeric layer molded to the conductive polymeric layer. The insulative polymeric layer faces the interior and substantially overlays the conductive polymeric layer.
Touch sensor having au-shaped electronically conducive micromesh
A touch sensor is provided that includes a transparent, insulating substrate and at least one U-shaped electrically conductive micromesh that includes traces disposed on the substrate. The traces include an elemental metal or an alloy of elemental metal. The touch sensor may be configured to determine a location and a magnitude of a force of a touch.