An antenna package according to an embodiment includes antenna units, and a circuit board electrically connected to the antenna units. The circuit board includes a core layer, antenna feeding lines distributed on a surface of the core layer and connected to the antenna units, power/data lines distributed on the surface of the core layer, power/data ports connected to end portions of the power/data lines, and antenna feeding ports connected to end portions of the antenna feeding lines and arranged to be closer to the antenna units than the power/data ports.

An ultra-wideband electromagnetic source includes a voltage source and a pulser assembly electrically coupled to the voltage source. The pulser assembly includes a bipolar vector inversion generator (VIG) assembly, a peaking gap assembly coupled to the VIG assembly, and an oil lens assembly coupled to the peaking gap assembly. The ultra-wideband electromagnetic source also includes a balanced antenna assembly including one or more sets of antenna arms coupled to the oil lens assembly and an antenna reflector coupled to the one or more sets of antenna arms.

Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

An antenna structure according to an embodiment of the present invention includes a dielectric layer, a radiator disposed on the dielectric layer, a transmission line branching from the radiator, a signal pad electrically connected to the radiator through the transmission line on the dielectric layer, and an external circuit structure bonded to the signal pad. The signal pad includes a bonding region that is bonded to the external circuit structure and a margin region that is not bonded to the external circuit structure and is adjacent to the bonding region. An area ratio of the margin region relative to the bonding region in the signal pad is 0.05 or more and less than 0.5.

An electronic device includes a housing that includes a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the back plate and at least a portion of which is formed of a metal material. A display is viewable through the front plate, and an antenna module is positioned in the space and includes a first surface facing a third direction different from the first direction and the second direction, a second surface facing a fourth direction different from the third direction, and at least one conductive element extended in a fifth direction, which is perpendicular to the third direction and the fourth direction and faces a first portion of the side member, adjacent to the side member, and between the first surface and the second surface.

An electronic device includes a housing that includes a front plate facing a first direction, a back plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the back plate and at least a portion of which is formed of a metal material. A display is viewable through the front plate, and an antenna module is positioned in the space and includes a first surface facing a third direction different from the first direction and the second direction, a second surface facing a fourth direction different from the third direction, and at least one conductive element extended in a fifth direction, which is perpendicular to the third direction and the fourth direction and faces a first portion of the side member, adjacent to the side member, and between the first surface and the second surface.

Systems and methods for antenna impedance matching provide an integrated circuit (IC) configured to be placed proximate an antenna that includes a sensor based on a coupler having forward and reverse power detectors for detecting an impedance at the antenna and provides dynamic impedance matching. Further, exemplary aspects of the present disclosure contemplate using a single wire bus capable of supplying power and providing a bidirectional serial communication link to allow communication between the IC of the present disclosure and a control circuit (e.g., a bridge or transceiver). Further aspects of the present disclosure contemplate providing systems and methods for calibrating the IC at production. Further, the accuracy of the impedance sensor may be dependent on accurate determination of power and phase difference between forward and reverse coupled signals, and a system for removing an offset between the forward and reverse power detectors is disclosed.

A wireless communications system includes a first transceiver with a first phased array antenna panel having first circularly polarization reconfigurable receive transmit antennas, where the first circularly polarization reconfigurable receive transmit antennas form a first receive beam based on receive phase and receive amplitude information provided by a first master chip and form a first transmit beam based on transmit phase and transmit amplitude information provided by the first master chip. The wireless communications system may include a second transceiver having second circularly polarization reconfigurable receive transmit antennas where the second circularly polarization reconfigurable receive transmit antennas form a second receive beam based on receive phase and receive amplitude information provided by a second master chip, and form a second transmit beam based on transmit phase and transmit amplitude information provided by the second master chip.

A wireless communications system includes a first transceiver with a first phased array antenna panel having first circularly polarization reconfigurable receive transmit antennas, where the first circularly polarization reconfigurable receive transmit antennas form a first receive beam based on receive phase and receive amplitude information provided by a first master chip and form a first transmit beam based on transmit phase and transmit amplitude information provided by the first master chip. The wireless communications system may include a second transceiver having second circularly polarization reconfigurable receive transmit antennas where the second circularly polarization reconfigurable receive transmit antennas form a second receive beam based on receive phase and receive amplitude information provided by a second master chip, and form a second transmit beam based on transmit phase and transmit amplitude information provided by the second master chip.