Electrical connection system comprising a primary connection device and a secondary connection device, the primary connection device comprising a shielded cap and primary conductive contacts which extend at least partially inside the shielded cap, the secondary connection device comprising a secondary electrical board which has a secondary mass surface, secondary conductive contacts which extend from an installation surface of the secondary electrical board which is surrounded by the secondary mass surface, and a resilient conductive material which is attached to the secondary mass surface, the electrical connection system being arranged so that the primary conductive contacts are electrically connected to the secondary electrical contacts inside the shielded cap and the shielded cap extends on the resilient conductive material by compressing it.

Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.

An apparatus includes a body with an opening through the body, the opening corresponding to dimensions of a cable to be connected to a circuit board and a flat surface to abut the circuit board. The apparatus further includes one or more attachment mechanisms to attach the body to the circuit board.

An apparatus includes a body with an opening through the body, the opening corresponding to dimensions of a cable to be connected to a circuit board and a flat surface to abut the circuit board. The apparatus further includes one or more attachment mechanisms to attach the body to the circuit board.

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g., 661 and 663) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g., 662). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards (“PCBs”) prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a “float” for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

Provided is a communication device and a control method, according to which in a configuration in which a plurality of processing units having a master-subordinate relationship therebetween, processing for controlling an abnormality and the like that has occurred in the subordinate processing unit can be performed by the master processing unit. A communication device includes a master processing unit and a subordinate processing unit, and the subordinate processing unit performs processing regarding communication, the master processing unit controls activation of the subordinate processing unit, the subordinate processing unit periodically transmits a signal to the master processing unit, and the master processing unit controls an operation of the subordinate processing unit in accordance with the signal that is periodically transmitted by the subordinate processing unit.

A socket structure is provided and includes a circuit board, an insulating base, a pin and a conductive component. The insulating base is disposed on the circuit board and includes a first side and a second side opposite to each other. The pin is disposed between the first side and the second side. The conductive component is connected between the circuit board and the insulating base and includes a first arm, a second arm and a connecting part. The first arm and the second arm are connected to each other through the connecting part. The first arm is fixed on the second side of the insulating base and connected to the pin and includes a first fixing end connected to the circuit board. The second arm includes a second fixing end connected to the circuit board.

A compute system is provided that includes cables that are terminated to a grid array connector that is mounted on a substrate that has an integrated circuit packaged mounted thereon. The cables include conductors that are electrically connected to the integrated circuit via terminals supposed by the substrate.

A coaxial tap in a hybrid fiber coaxial cable distribution system serves subscribers with an RF signal.