A MicroElectroMechanical System (MEMS) includes a MEMS device; a feature extraction component coupled to an output of the MEMS device, wherein the feature extraction component is configured to provide a plurality of features of an output signal of the MEMS device; and a low data rate interface coupled to the feature extraction components, wherein the low data rate interface is configured to transmit the plurality of features of the output signal of the MEMS device, and wherein a low data rate of the low data rate interface is determined by a number of the plurality of features transmitted, wherein the MEMS device, the feature extraction component, and the low data rate interface are packaged together in a semiconductor package.

A MEMS transducer for interacting with a volume flow of a fluid includes a substrate which includes a layer stack having a plurality of layers which form a plurality of substrate planes, and which includes a cavity within the layer stack. The MEMS transducer includes an electromechanical transducer connected to the substrate within the cavity and including an element which is deformable within at least one plane of movement of the plurality of substrate planes, deformation of the deformable element within the plane of movement and the volume flow of the fluid being causally correlated. The MEMS transducer includes an electronic circuit arranged within a layer of the layer stack, the electronic circuit being connected to the electromechanical transducer and being configured to provide a conversion between a deformation of the deformable element and an electric signal.

An electret includes a composite oxide having an ABO.sub.3 type perovskite structure containing two different metal elements A and B. The composite oxide is in a polarized state, at least a part of one of the metal elements A and B is substituted with a dopant element having a lower valence than the one of the metal elements A and B, and the composite oxide has a bandgap energy of 4 eV or more.

A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and corrugations defined in the piezoelectric element about the perimeter of the piezoelectric element to release residual stress and improve sensitivity of the piezoelectric microelectromechanical system microphone.

According to one embodiment, a strain and pressure sensing device includes a semiconductor circuit unit and a sensing unit. The semiconductor circuit unit includes a semiconductor substrate and a transistor. The transistor is provided on a semiconductor substrate. The sensing unit is provided on the semiconductor circuit unit, and has space and non-space portions. The non-space portion is juxtaposed with the space portion. The sensing unit further includes a movable beam, a strain sensing element unit, and first and second buried interconnects. The movable beam has fixed and movable portions, and includes first and second interconnect layers. The fixed portion is fixed to the non-space portion. The movable portion is separated from the transistor and extends from the fixed portion into the space portion. The strain sensing element unit is fixed to the movable portion. The first and second buried interconnects are provided in the non-space portion.

A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.

A laminated structure includes a frame body having a first surface and a second surface facing in mutually opposite directions in a thickness direction, the frame body including a film body supported by the frame body and a hollow portion opening at the second surface and being located between the film body and the second surface; and a lid body attached to the frame body, including cavity located on the film body and an opening which communicates with the cavity and being formed at a positon at which at least a part of the film body is exposed to an external space of the laminated structure. The lid body includes a groove portion formed in a surface (a back surface) of the lid body facing the frame body, and the cavity and the external space of the laminated structure communicate with each other through the groove portion.

The present invention provides a MEMS speaker including a substrate sidewall enclosing a cavity. The substrate sidewall includes a first surface and a second surface, a sounding assembly that is arranged on the first surface of the substrate sidewall and also seals the cavity at the opening of the first surface, and a bracket disposed in the cavity. The sounding assembly includes a first sounding assembly and the second sounding assembly. Each sounding assembly includes a driving part and a flexible diaphragm. The flexible diaphragm closes the gap formed between the free ends of adjacent driving parts and between the free ends of the driving parts and the substrate sidewall. The present invention also provides a manufacturing method of MEMS speaker. The MEMS speakers provided by the present invention have high-quality acoustic performance.

Described herein is a MEMS acoustic transducer device provided with a micromechanical detection structure that detects acoustic-pressure waves and supplies a transduced electrical quantity, and with an integrated circuit operatively coupled to the micromechanical detection structure and having a reading module that generates at output an audio signal as a function of the transduced electrical quantity. The integrated circuit is further provided with a recognition module, which recognizes a of sound activity event associated to the transduced electrical quantity. The MEMS acoustic transducer has an output that supplies at output a data signal that carries information regarding recognition of the sound activity event.

In one embodiment, a method of manufacturing a semiconductor device includes oxidizing a substrate to form local oxide regions that extend above a top surface of the substrate. A membrane layer is formed over the local oxide regions and the top surface of the substrate. A portion of the substrate under the membrane layer is removed. The local oxide regions under the membrane layer are removed.