The present application provides a method of manufacturing a resonant panel (200) of a flat panel loudspeaker. The method comprises: pressing a resonant panel blank between a first pressing surface (302) and a second pressing surface of a press, whereby to form the resonant panel (200) of the flat panel loudspeaker. The second pressing surface substantially opposes the first pressing surface (302). The first pressing surface (302) comprises at least one tool relief region (306, 312, 314, 316, 318), whereby to form at least one corresponding respective panel relief region (206, 212, 214, 216, 218) in a surface of the resonant panel (200).

Systems and methods for acoustic simulation in accordance with embodiments of the invention are illustrated. One embodiment includes a method for simulating acoustic responses, including obtaining a digital model of an object, calculating a plurality of vibrational modes of the object, conflating the plurality of vibrational modes into a plurality of chords, where each chord includes a subset of the plurality of vibrational modes, calculating, for each chord, a chord sound field in the time domain, where the chord sound field describes acoustic pressure surrounding the object when the object oscillates in accordance with the subset of the plurality of vibrational modes, deconflating each chord sound field into a plurality of modal sound fields, where each modal sound field describes acoustic pressure surrounding the object when the object oscillates in accordance with a single vibrational mode, and storing each modal sound field in a far-field acoustic transfer (FFAT) map.

The present application provides a method of manufacturing a resonant panel (200) of a flat panel loudspeaker. The method comprises: pressing a resonant panel blank between a first pressing surface (302) and a second pressing surface of a press, whereby to form the resonant panel (200) of the flat panel loudspeaker. The second pressing surface substantially opposes the first pressing surface (302). The first pressing surface (302) comprises at least one tool relief region (306, 312, 314, 316, 318), whereby to form at least one corresponding respective panel relief region (206, 212, 214, 216, 218) in a surface of the resonant panel (200).

A method of making a monolithic multi-tone audio speaker cover and the product made thereby. The method involves creating a hole pattern in a blank; providing a ditch inside a periphery of the blank; forming a shape in the blank to make a shaped blank; treating or painting at least some of the surface of the shaped blank with a primary treatment or color to prepare a treated or painted shaped blank; masking an area of the treated or painted shaped blank with a masking material along a portion of the ditch to cover at least a portion of the treated or painted shaped blank; and applying a secondary color to the unprotected area. The audio speaker cover made thereby has a distinct unwavering separation between the respective treated areas that is visually pleasing.

The present application provides a method of manufacturing a resonant panel (200) of a flat panel loudspeaker. The method comprises: pressing a resonant panel blank between a first pressing surface (302) and a second pressing surface of a press, whereby to form the resonant panel (200) of the flat panel loudspeaker. The second pressing surface substantially opposes the first pressing surface (302). The first pressing surface (302) comprises at least one tool relief region (306, 312, 314, 316, 318), whereby to form at least one corresponding respective panel relief region (206, 212, 214, 216, 218) in a surface of the resonant panel (200).

Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

The present application provides a method of manufacturing a resonant panel (200) of a flat panel loudspeaker. The method comprises: pressing a resonant panel blank between a first pressing surface (302) and a second pressing surface of a press, whereby to form the resonant panel (200) of the flat panel loudspeaker. The second pressing surface substantially opposes the first pressing surface (302). The first pressing surface (302) comprises at least one tool relief region (306, 312, 314, 316, 318), whereby to form at least one corresponding respective panel relief region (206, 212, 214, 216, 218) in a surface of the resonant panel (200).

The present invention relates to a diaphragm, and stethoscopes provided with the same. The diaphragm having a plate-shaped vibratable portion, and the vibratable portion has a first surface. The diaphragm further comprises a compliant structural layer disposed on the first surface. When the diaphragm is assembled with a sound collecting head, the compliant structural layer is in contact with the sound collecting head to enhance the airtightness between the diaphragm and the sound collecting head to prevent the acoustic vibration energy from dissipating. The invention also relates to methods for manufacturing the diaphragm which can quickly produce a large number of diaphragms by simple processes.

A piezoelectric microphone includes a plate, a support portion that is provided around the plate, connection portions that connect the plate and the support portion on two or more sides of the plate, and a detection portion including a lower electrode, a piezoelectric film, and an upper electrode which are stacked in this order. The detection portion is stacked on the connection portion . An inflection point of a cross-sectional deformation curve in a case in which the plate and the connection portion are deformed by sound pressure is present in a region in which the detection portion is not stacked.

A piezoelectric microphone includes a plate, a support portion that is provided around the plate, connection portions that connect the plate and the support portion on two or more sides of the plate, and a detection portion including a lower electrode, a piezoelectric film, and an upper electrode which are stacked in this order. The detection portion is stacked on the connection portion . An inflection point of a cross-sectional deformation curve in a case in which the plate and the connection portion are deformed by sound pressure is present in a region in which the detection portion is not stacked.