A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

The present application relates to a backplate for a recording microphone, and the recording microphone, belonging to the technical field of acoustoelectric conversion. A surface, facing a diaphragm, of the backplate is a spherical surface recessed away from the diaphragm. According to the backplate for the recording microphone and the recording microphone provided by the present application, the maximum sound pressure level that the recording microphone can withstand is effectively increased, and the occurrence of attachment between the diaphragm and the backplate under the action of high-sound-pressure-level signals is reduced.

The present application relates to a backplate for a recording microphone, and the recording microphone, belonging to the technical field of acoustoelectric conversion. A surface, facing a diaphragm, of the backplate is a spherical surface recessed away from the diaphragm. According to the backplate for the recording microphone and the recording microphone provided by the present application, the maximum sound pressure level that the recording microphone can withstand is effectively increased, and the occurrence of attachment between the diaphragm and the backplate under the action of high-sound-pressure-level signals is reduced.

The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.

A double sided speaker device, comprising a magnetic conductive carrier board, a first magnetic circuit module, a second magnetic circuit module, a first voice coil, a second voice coil, a first sounding hood, and a second sounding hood. The magnetic conductive carrier board comprises a plurality of openings. The first magnetic circuit module is disposed at one side of the magnetic conductive carrier board. The second magnetic circuit module is disposed at the other side of the magnetic conductive carrier board. The first voice coil is disposed around the first magnetic circuit module. The second voice coil is disposed around the second magnetic circuit module. The first sounding hood is disposed at one side of the magnetic conductive carrier board and comprises a first accommodating space. The second sounding hood is disposed at the other side of the magnetic conductive carrier board and comprises a second accommodating space.

A double sided speaker device, comprising a magnetic conductive carrier board, a first magnetic circuit module, a second magnetic circuit module, a first voice coil, a second voice coil, a first sounding hood, and a second sounding hood. The magnetic conductive carrier board comprises a plurality of openings. The first magnetic circuit module is disposed at one side of the magnetic conductive carrier board. The second magnetic circuit module is disposed at the other side of the magnetic conductive carrier board. The first voice coil is disposed around the first magnetic circuit module. The second voice coil is disposed around the second magnetic circuit module. The first sounding hood is disposed at one side of the magnetic conductive carrier board and comprises a first accommodating space. The second sounding hood is disposed at the other side of the magnetic conductive carrier board and comprises a second accommodating space.

The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments. Various applications and implementations are described and envisaged for the audio transducer embodiments including, for example, personal audio devices such as headphones, earphones and the like.

The invention relates to audio transducers, such as loudspeaker, microphones and the like, and includes improvements in or relating to: audio transducer diaphragm structures and assemblies, audio transducer mounting systems; audio transducer diaphragm suspension systems, personal audio devices incorporating the same and any combination thereof. The embodiments of the invention include linear action and rotational action transducers. For both types of transducer, rigid and composite diaphragm constructions and unsupported diaphragm periphery designs are described. Systems and methods for mounting the transducer to a housing, such as an enclosure or baffle are also described. Furthermore, hinge systems including: rigid contact hinge systems and flexible hinge systems are also disclosed for various rotational action transducer embodiments. Various applications and implementations are described and envisaged for the audio transducer embodiments including, for example, personal audio devices such as headphones, earphones and the like.

The electronic device including the plurality of acoustic ducts according to various example embodiments may include the main body; the PCB disposed on the main body; the microphone including the microphone body connected to the PCB and the diaphragm connected to the microphone body; the main acoustic duct penetrating the main body and configured to connect the space in which the diaphragm is placed to the external space of the electronic device; and the sub acoustic duct penetrating the main body and configured to connect the external space of the electronic device to the main acoustic duct. In addition, various example embodiments are possible.

The electronic device including the plurality of acoustic ducts according to various example embodiments may include the main body; the PCB disposed on the main body; the microphone including the microphone body connected to the PCB and the diaphragm connected to the microphone body; the main acoustic duct penetrating the main body and configured to connect the space in which the diaphragm is placed to the external space of the electronic device; and the sub acoustic duct penetrating the main body and configured to connect the external space of the electronic device to the main acoustic duct. In addition, various example embodiments are possible.