A lighting device disclosed in an embodiment of the invention includes a heat dissipation plate having a recess portion; a circuit board accommodated in the recess portion of the heat dissipation plate and having pads; a light source portion having bonding pads; connection members respectively connecting between the pads and the bonding pads; and an adhesive member that adheres the light source portion to the heat dissipation plate. The light source portion includes a support member; light emitting devices having light emitting chips and a wavelength conversion layer; and a resin member. Each of the connection members has a ribbon shape, and a width of each of the connection members is more than twice the thickness of each of the connection members, and each of the connection members may include two ends respectively connected to the bonding pads and the pads, and a center portion extending convexly between the two ends.

The present invention provides a gap-filling method whereby a structure having a gap can be appropriately inhibited from being adversely affected by edges of the gap. The present invention relates to a gap-filling method including filling a gap of a structure having the gap therein by inserting a threadlike adhesive body into and along the gap, wherein the threadlike adhesive body is inserted into the gap so as to come into contact with at least some of inner surfaces of the gap and with edges of the gap.