Disclosed aspects include a semiconductor die including a substrate having a semiconductor surface including circuitry. A top metal layer is above the semiconductor surface including top metal lines that are electrically connected through a metal stack including metal interconnects that electrically connect to the circuitry. The top metal lines are configured in a primary orientation that collectively represents at least 50% of a total length of the top metal lines in a first direction. The top metal layer includes bond pads exposed from a passivation layer. The metal features are positioned lateral to and not directly electrically connected to the top metal layer and/or are positioned on the passivation layer. At least a majority of a total area of the metal features is not over metal interconnects. The metal features have a length direction oriented in a second direction that is at least essentially perpendicular relative to the primary orientation.

Metallization structure for an integrated circuit. In one embodiment, an integrated circuit includes a metal-to-diffusion (MD) layer disposed over an active region of a cell, gates disposed over the active region of the cell, and a first metallization layer including M0 tracks disposed over the MD layer and the gates. The integrated circuit further includes a second metallization layer including M1 tracks disposed over the first metallization layer. The M1 tracks include first M1 tracks each having a first predetermined distance from an edge of the cell and second M1 tracks each having a second predetermined distance from the edge of the cell, wherein the first M1 tracks are longer than the second M1 tracks.

Disclosed is a semiconductor package structure, which includes a first substrate, a second substrate, a processor module, a chip stack structure, and a signal adapter board. The processor module is arranged on a first plane of the first substrate and connected to the first substrate; the chip stack structure is arranged on the first plane of the first substrate and connected to the first substrate, and the first substrate is configured to transmit a first-type signal between the processor module and the chip stack structure; the signal adapter board is connected to the processor module and the chip stack structure, and is configured to transmit a second-type signal between the processor module and the chip stack structure; and the second substrate is arranged parallel to the first substrate and connected to a second plane of the first substrate, and the second plane of the first substrate is parallel to and opposite to the first plane of the first substrate.