Patent classifications
Y10S257/00
Hybrid computing module
An electro-optic module provides electro-optic signal drivers formed upon a semiconductor carrier having electrically conducting traces and passive circuit network filtering elements of electroceramic material with the electro-optic signal drivers being in electrical communication with the passive circuit elements and interface the module within a larger computing or communications system.
Hybrid computing module
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
An electro-optic module provides electro-optic signal drivers formed upon a semiconductor carrier having electrically conducting traces and passive circuit network filtering elements of electroceramic material with the electro-optic signal drivers being in electrical communication with the passive circuit elements and interface the module within a larger computing or communications system.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
Hybrid computing module
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby supporting the transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
Hybrid computing module
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.
Hybrid computing module
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the transfer of data between off-chip physical memory and processor die.
Hybrid computing module
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the transfer of data between off-chip physical memory and processor die.
HYBRID COMPUTING MODULE
A hybrid system-on-chip provides a plurality of memory and processor die mounted on a semiconductor carrier chip that contains a fully integrated power management system that switches DC power at speeds that match or approach processor core clock speeds, thereby allowing the efficient transfer of data between off-chip physical memory and processor die.