Patent classifications
H
H10
H10P
14/00
H10P14/6346
SEMICONDUCTOR DEVICE PACKAGE THERMAL CONDUIT
20260107709
·
2026-04-16
·
A method comprises: covering at least part of the integrated circuit with a material, the material including an opening that penetrates through the material; and forming a layer of nanoparticles on at least part of an internal wall of the opening and over at least part of the integrated circuit.