C23C14/10

CMAS-resistant protective layer

The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

CMAS-resistant protective layer

The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

Anti-reflective sputtering stack with low Rv and low Ruv
11592597 · 2023-02-28 · ·

The present invention provides a UV antireflective coating stack for ophthalmic lenses. The antireflective coating stack is deposited by sputtering, which lowers the reflectivity of the antireflective stack in the UV range and maintains low reflectivity in the visible range. The antireflective coating stack offers improved thermo-mechanical performance as compared to evaporation-based UV antireflective stacks.

Anti-reflective sputtering stack with low Rv and low Ruv
11592597 · 2023-02-28 · ·

The present invention provides a UV antireflective coating stack for ophthalmic lenses. The antireflective coating stack is deposited by sputtering, which lowers the reflectivity of the antireflective stack in the UV range and maintains low reflectivity in the visible range. The antireflective coating stack offers improved thermo-mechanical performance as compared to evaporation-based UV antireflective stacks.

Fabric coloring method and colored fabric

The present application provides a fabric coloring method and a colored fabric, where the fabric coloring method includes: performing radiation drying on a base cloth; sequentially forming an adhesive layer and at least one color-generating layer on a surface of the base cloth after the radiation drying by vacuum deposition, where the adhesive layer contains at least one of Ti, Cr, Si and Ni, and a thickness of the adhesive layer ranges from 1 nm to 2000 nm; the color-generating layer contains at least one of Al, Ti, Cu, Fe, Mo, Zn, Ag, Au, and Mg, and the total thickness of the color-generating layer ranges from 1 nm to 4000 nm. The fabric coloring method can not only produce rich colors and make the colored fabric have good color fastness, but also reduce the sensitivity of color of the colored fabric to thickness of the film, thus improving the industrial operability.

Fabric coloring method and colored fabric

The present application provides a fabric coloring method and a colored fabric, where the fabric coloring method includes: performing radiation drying on a base cloth; sequentially forming an adhesive layer and at least one color-generating layer on a surface of the base cloth after the radiation drying by vacuum deposition, where the adhesive layer contains at least one of Ti, Cr, Si and Ni, and a thickness of the adhesive layer ranges from 1 nm to 2000 nm; the color-generating layer contains at least one of Al, Ti, Cu, Fe, Mo, Zn, Ag, Au, and Mg, and the total thickness of the color-generating layer ranges from 1 nm to 4000 nm. The fabric coloring method can not only produce rich colors and make the colored fabric have good color fastness, but also reduce the sensitivity of color of the colored fabric to thickness of the film, thus improving the industrial operability.

Reactive sputter deposition of dielectric films
11584982 · 2023-02-21 · ·

Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film.

Reactive sputter deposition of dielectric films
11584982 · 2023-02-21 · ·

Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film.

Display substrate, manufacturing method thereof, and display apparatus

A display substrate includes a supporting material layer having at least one flexible material sub-layer and at least one blocking sub-layer, which can be alternately and successively arranged in layers. One blocking sub-layer is at a topmost sub-layer of the supporting material layer, and is provided with a well, located in a display area and configured for accommodating a display component therewithin. One or more of the at least one flexible material sub-layer or the at least one blocking sub-layer is configured as a target material layer. The target material layer includes a planar portion and a protruding portion over the planar portion. An orthographic projection of the protruding portion on a bottom surface of the supporting material layer forms a ring-like structure having an opening that covers an orthographic projection of a bottom surface of the well on the bottom surface of the supporting material layer.

FILM FORMING APPARATUS AND FILM FORMING METHOD
20230097539 · 2023-03-30 ·

A film forming apparatus comprising: a processing container for accommodating a plurality of substrates, a substrate holder provided in the processing container and configured to hold the substrates such that the plurality of substrates are arranged along a circumferential direction; a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve the plurality of substrates on the substrate holder along the circumferential direction; and a sputtered particle emitting mechanism configured to emit sputtered particles to the plurality of substrates held by the substrate holder. Sputtering film formation is performed by emitting the sputtered particles from the sputtered particle emitting mechanism while rotating and revolving the plurality of substrates held by the substrate holder using the rotating and revolving mechanism.