A fluid distributor comprises a first conduit extending along a first elongated axis and a second conduit circumscribing the first conduit. A first area comprises a cross-sectional flow area of the first conduit taken perpendicular to the first elongated axis. The first conduit comprises a first plurality of orifices comprising a first combined cross-sectional area. The second conduit comprises a second plurality of orifices comprising a second combined cross-sectional area. A first ratio of the first area to the first combined cross-sectional area can be about 2 or more. A second ratio of the first combined cross-sectional area to the second combined cross-sectional area can be about 2 or more. An angle between a direction of an orifice axis of a first orifice of the first plurality of orifices and a direction of an orifice axis of a first orifice of the second plurality of orifices can be from about 45° to 180°.

Provided is a surface treatment facility in which both surfaces of a material are subjected to continuous film deposition by PVD as the material is conveyed in the longitudinal direction, wherein flutter of the material subjected to coating can be suppressed. This surface treatment facility comprises a chamber configured to continuously deposit a film by PVD on both surfaces of a material as the material is conveyed in the longitudinal direction through the chamber; a conveyance mechanism for conveying the material subjected to coating; a blowing mechanism for blowing film-forming gas in the longitudinal direction on both sides of the material present in the chamber; and has an X/Y ratio within a range of 0.4 to 3.0 where X is the film-forming gas blowing speed, and Y is the conveyance speed of the material subjected to coating, and where the unit of measurement of X and Y is m/min.

Embodiments of the disclosed subject matter provide a device including a nozzle, a source of material to be deposited on a substrate in fluid communication with the nozzle, a delivery gas source in fluid communication with the source of material to be deposited with the nozzle, an exhaust channel disposed adjacent to the nozzle, and a confinement gas source in fluid communication with the nozzle and the exhaust channel, and disposed adjacent to the exhaust channel.

A method of mask-free printing of dry nanoparticles, the method comprising generating a dry nanoparticle stream from a feedstock material in an atmospheric gas flow using a laser ablation system at atmospheric pressure, the dry nanoparticle stream uncontaminated by a fluidic carrier medium, wherein the dry nanoparticles uncontaminated by a fluidic carrier medium are directed to a substrate through a nozzle by the gas flow in a dry state and adhere to the substrate.

A degassing chamber and a semiconductor processing apparatus are provided. The degassing chamber includes a chamber; a substrate container, movable within the chamber in a vertical direction; and a heating component, disposed within the chamber. A substrate transferring opening is formed through a sidewall of the chamber for transferring substrates into or out of the chamber. The heating component includes a first light source component and a second light source component. The chamber is divided into a first chamber and a second chamber by the substrate transferring opening. The first light source component is located in the first chamber, and the second light source component is located in the second chamber. The first light source component and the second light source component are provided for heating a substrate in the substrate container.

A deposition apparatus (20) comprising: a chamber (22); a process gas source (62) coupled to the chamber; a vacuum pump (52) coupled to the chamber; at least two electron guns (26); one or more power supplies (30) coupled to the electron guns; a plurality of crucibles (32,33,34) positioned or positionable in an operative position within a field of view of at least one said electron gun; and a part holder (170) having at least one operative position for holding parts spaced above the crucibles by a standoff height H. The standoff height H is adjustable in a range including at least 22 inches.

A chuck for holding a workpiece in a deposition system is provided, which includes a base having a base surface with a flatness tolerance of not greater than 30 .Math.m and a clamp having a surface configured to be attached to a substrate, which has a flatness tolerance of not greater than 30 .Math.m. The clamp also includes a substrate holder configured to hold a substrate above the second clamp surface.

A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.

An apparatus for coating a surface of a substrate includes an evaporant source disposed within an open environment including air at atmospheric pressure. The evaporant source includes a coating material. The apparatus further includes an energy beam source disposed within the open environment and configured to emit at least one energy beam that impinges on an emission region of the evaporant source to form a vapour plume at the emission region. The vapour plume includes the coating material of the evaporant source. The apparatus further includes a fixture configured to position the evaporant source relative to the substrate within the open environment, such that a maximum distance between the emission region of the evaporant source and the surface of the substrate is less than or equal to 10 cm.

Embodiments of the disclosed subject matter provide a vapor distribution manifold that ejects organic vapor laden gas into a chamber and withdraws chamber gas, where vapor ejected from the manifold is incident on, and condenses onto, a deposition surface within the chamber that moves relative to one or more print heads in a direction orthogonal to a platen normal and a linear extent of the manifold. The volumetric flow of gas withdrawn by the manifold from the chamber may be greater than the volumetric flow of gas injected into the chamber by the manifold. The net outflow of gas from the chamber through the manifold may prevent organic vapor from diffusing beyond the extent of the gap between the manifold and deposition surface. The manifold may be configured so that long axes of delivery and exhaust apertures are perpendicular to a print direction.