A vapor deposition mask includes a mask main body and a support joined to the mask main body. The mask main body has a first alignment mark whereas the support has a second alignment mark. The first alignment mark and the second alignment are provided at such positions as to overlap with each other in plan view, and either one of the alignment marks is larger than the other of the alignment marks.

A shielding film having a multi-layered metal structure is provided, including an insulating layer and a multi-layered metal compounded on the insulating layer, wherein the thickness of each layer of metal is 0.05-5 μm, the multi-layered metal has 2-10 layers, and a conductive bonding layer is disposed between the multi-layered metal. In the present application, the thickness of each layer of metal is controlled by providing a multi-layered metal, and a conductive bonding layer is bonded between the layers of metal such that the shielding film has good flexibility and shielding effect. Additionally, the conductive bonding layer is used so that the binding force between the layers of metal is good, and a high-frequency signal shielding performance of greater than 80db@10ghz is ensured so that the shielding film has good flexibility and meets flexibility requirements for flexible circuit boards while also having good high-temperature resistance.

A shielding film having a multi-layered metal structure is provided, including an insulating layer and a multi-layered metal compounded on the insulating layer, wherein the thickness of each layer of metal is 0.05-5 μm, the multi-layered metal has 2-10 layers, and a conductive bonding layer is disposed between the multi-layered metal. In the present application, the thickness of each layer of metal is controlled by providing a multi-layered metal, and a conductive bonding layer is bonded between the layers of metal such that the shielding film has good flexibility and shielding effect. Additionally, the conductive bonding layer is used so that the binding force between the layers of metal is good, and a high-frequency signal shielding performance of greater than 80db@10ghz is ensured so that the shielding film has good flexibility and meets flexibility requirements for flexible circuit boards while also having good high-temperature resistance.

Provided is a vacuum coating device, comprising a crucible (13), an induction heater (15) arranged on the outer side of the crucible (13); a flow distribution box connected to the top of the crucible (13) through a steam pipeline (16); a pressure regulating valve (18) and a diverter valve (19) sequentially arranged in a direction in which the steam pipeline (16) is in communication with the flow distribution box; a horizontal pressure stabilizing plate (20) arranged in the flow distribution box, a plurality of sub-nozzles (21) connected to the top of the flow distribution box; wherein a plurality of air flow distribution chambers are arranged in the diverter valve (19); a ratio of a total area of the air flow distribution chambers (S.sub.distribution) to an area of the steam pipeline (16) in the radial direction (S.sub.pipeline) is greater than or equal to 0.1, i.e.: S.sub.diversion/S.sub.pipeline≥0.1. According to the device, a uniform spray flow can be formed, a uniform coating (23) is formed on the surface of a steel plate (100) when high temperature steam is in contact with a low temperature steel plate, the spray flow formed by the sub-nozzles (21) arranged at the rear portion continuously covers the deposited metal layer that has been formed, so as to achieve efficient coating of strip steel under vacuum conditions.

Provided is a vacuum coating device, comprising a crucible (13), an induction heater (15) arranged on the outer side of the crucible (13); a flow distribution box connected to the top of the crucible (13) through a steam pipeline (16); a pressure regulating valve (18) and a diverter valve (19) sequentially arranged in a direction in which the steam pipeline (16) is in communication with the flow distribution box; a horizontal pressure stabilizing plate (20) arranged in the flow distribution box, a plurality of sub-nozzles (21) connected to the top of the flow distribution box; wherein a plurality of air flow distribution chambers are arranged in the diverter valve (19); a ratio of a total area of the air flow distribution chambers (S.sub.distribution) to an area of the steam pipeline (16) in the radial direction (S.sub.pipeline) is greater than or equal to 0.1, i.e.: S.sub.diversion/S.sub.pipeline≥0.1. According to the device, a uniform spray flow can be formed, a uniform coating (23) is formed on the surface of a steel plate (100) when high temperature steam is in contact with a low temperature steel plate, the spray flow formed by the sub-nozzles (21) arranged at the rear portion continuously covers the deposited metal layer that has been formed, so as to achieve efficient coating of strip steel under vacuum conditions.

A Method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber; a substrate coated with at least one metal on both sides of the substrate having an average thickness, wherein the coating is deposited homogenously such that the maximum thickness of the coating can exceed the average thickness of 15% maximum. A vacuum deposition facility also is provided.

A Method for continuously depositing, on a running substrate, coatings formed from at least one metal inside a vacuum deposition facility including a vacuum chamber; a substrate coated with at least one metal on both sides of the substrate having an average thickness, wherein the coating is deposited homogenously such that the maximum thickness of the coating can exceed the average thickness of 15% maximum. A vacuum deposition facility also is provided.

The present invention relates to the field of display technology, and discloses a method for preparing an array substrate, a display panel and an evaporation apparatus. A method for preparing an array substrate comprises: fixing a base substrate to an evaporation stage; attaching a shielding sheet to the base substrate to cover at least a preset area of the base substrate; arranging and aligning an open mask in association with the base substrate; and evaporating to form a evaporation material layer on the base substrate, to which the shielding sheet is attached, with the open mask.

The present invention relates to the field of display technology, and discloses a method for preparing an array substrate, a display panel and an evaporation apparatus. A method for preparing an array substrate comprises: fixing a base substrate to an evaporation stage; attaching a shielding sheet to the base substrate to cover at least a preset area of the base substrate; arranging and aligning an open mask in association with the base substrate; and evaporating to form a evaporation material layer on the base substrate, to which the shielding sheet is attached, with the open mask.

Methods for making solid-state laminate electrode assemblies include methods of forming a solid electrolyte interphase (SEI) by ion implanting nitrogen and/or phosphorous into the glass surface by ion implantation.