Methods for making solid-state laminate electrode assemblies include methods of forming a solid electrolyte interphase (SEI) by ion implanting nitrogen and/or phosphorous into the glass surface by ion implantation.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

An apparatus includes a printed circuit board (PCB), a power component disposed on the PCB, the power component to generate heat, and a multilayered coating disposed over the power component and at least a portion of the PCB to dissipate heat from the power component, the multilayered including: an electrical insulation layer comprising a non-polar compound and disposed on the power component and the at least a portion of the PCB; a chromium layer disposed on the electrical insulation layer; and a copper layer disposed on the chromium layer that is at least 10 microns (μm) thick, the copper layer conformally adhered to a top of the power component and to the PCB.

A mask plate assembly is provided, including a first mask plate and multiple types of first mask strips having different effective evaporation patterns, where the first mask plate includes a first frame and a first support strip arranged between a set of opposite sides of the first frame, a first hollowed-out portion including multiple first holes is arranged in a first region of the first support strip, and the multiple first holes are used for cooperating with the multiple types of first mask strips for evaporation to form different first functional structures.

A mask plate assembly is provided, including a first mask plate and multiple types of first mask strips having different effective evaporation patterns, where the first mask plate includes a first frame and a first support strip arranged between a set of opposite sides of the first frame, a first hollowed-out portion including multiple first holes is arranged in a first region of the first support strip, and the multiple first holes are used for cooperating with the multiple types of first mask strips for evaporation to form different first functional structures.

Provided are a conductive film and a preparation method for the same, which relate to the technical field of conductive films. The preparation method for the conductive film includes: forming a metal process layer on a surface of an insulating layer by means of evaporation deposition, wet electroplating or chemical plating; forming a metal transition layer on a surface of the metal process layer facing away from the insulating layer by means of magnetron sputtering; and forming a metal functional layer on a surface of the metal transition layer facing away from the metal process layer. The conductive film obtained by this preparation method can have relatively good conductivity and density while having a relatively thick metal conductive layer.

An evaporator device incudes a crucible comprising an inlet through which solid material is introduced to the crucible, and an outlet through which vaporised material is released from the crucible. Vapours outgassed from molten material within the crucible are guided away from the outlet.

A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.

A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.

A virtual adhesion method is provided. The virtual adhesion method includes increasing a magnetic characteristic of an initial structure, supporting the initial structure on a surface of a substrate, generating a magnetic field directed such that the initial structure is forced toward the surface of the substrate and forming an encapsulation, which is bound to exposed portions of the surface, around the initial structure.