A gold sputtering target has a gold purity of 99.999% or more. In such a gold sputtering target, an average value of Vickers hardness is 20 or more and less than 40, an average crystal grain size is 15 μm or more and 200 μm or less, and a {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Provided is a sputtering target, the sputtering target containing 0.05 at % or more of Bi and having a total content of metal oxides of from 10 vol % to 60 vol %, the balance containing at least Co and Pt.

The present disclosure provides an improvement to razor blade coating by a physical vapor deposition method, by forming a hard coating layer as a thin coating layer in which chromium boride, which is a nanocrystalline structure having high hardness, is dispersed in an amorphous mixture of chromium and boron, thereby improving the strength and hardness of the thin coating layer and securing the bonding force by chromium in the amorphous mixture between the hard coating layer and a blade substrate on which an edge of the razor blade is formed.

The present disclosure provides an improvement to razor blade coating by a physical vapor deposition method, by forming a hard coating layer as a thin coating layer in which chromium boride, which is a nanocrystalline structure having high hardness, is dispersed in an amorphous mixture of chromium and boron, thereby improving the strength and hardness of the thin coating layer and securing the bonding force by chromium in the amorphous mixture between the hard coating layer and a blade substrate on which an edge of the razor blade is formed.

A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating are provided. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 μm and 3 μm, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.

A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating are provided. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 μm and 3 μm, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.

A method for forming a film of an oxide of In, Ga, and Zn, having a spinel crystalline phase comprises providing a substrate in a chamber; providing a sputtering target in said chamber, the target comprising an oxide of In, Ga, and Zn, wherein: In, Ga, and Zn represent together at least 95 at % of the elements other than oxygen, In represents from 0.6 to 44 at % of In, Ga, and Zn, Ga represents from 22 to 66 at % of In, Ga, and Zn, and Zn represents from 20 to 46 at % of In, Ga, and Zn; and forming a film on the substrate, the substrate being at a temperature of from 125° C. to 250° C., by sputtering the target with a sputtering gas comprising O.sub.2, the sputtering being performed at a sputtering power of at least 200 W.

A sputtering target according to the present invention contains Co and Pt as metal components, wherein a molar ratio of a content of Pt to a content of Co is from 5/100 to 45/100, and wherein the sputtering target contains Nb.sub.2O.sub.5 as a metal oxide component.

A method of manufacturing an electronic component including a substrate is provided. The method includes generating a plasma remote from a sputter target, generating sputtered material from the sputter target using the plasma, and depositing the sputtered material on a substrate as a crystalline layer.

A part includes a base material, a colored layer on the base material, and a surface layer on the colored layer, wherein the colored layer contains Zr, and optionally, C and/or N, a ratio (H.sub.Zr .sub.oxide/H.sub.Zr) of a peak height derived from Zr oxide (H.sub.Zr oxide) to a peak height of Zr (H.sub.Zr) at an interface of the colored layer on the side of the surface layer is more than 0 and less than 4.5, the interface is a point where Zr is detected by sputtering the part from the side of the surface layer with an XPS depth direction analysis, and the ratio (H.sub.Zr oxide/H.sub.Zr) at a point where Ar sputtering is performed for 5 minutes from the interface of the colored layer on the side of the surface layer with the XPS depth direction analysis is 0 to less than 3. The surface layer is water-repellent and exhibits a sputtering time of 5 minutes or less