An in-line system for mass production of an organic optoelectronic device is disclosed. The in-line system includes a patterned holder, a first chamber, and a second chamber. The patterned holder is for holding a substrate covered with a first electrode layer and a contact electrode layer, in which the first electrode layer and the contact electrode layer are partially shielded by the patterned holder. The first chamber is for forming an organic layer on portions of the first electrode layer and the contact electrode layer that are not shielded by the patterned holder. The second chamber is aligned with the first chamber and is for forming a second electrode layer on the organic layer.

An etched logo is provided at a location within the layers. This etched section is viewable to the user on the working surface as a form of insignia (logo, trademark, letters, words, serial numbers, designs, patters, artwork, and the like) and does not wear off in normal use because of the coating layers and. Alternatively, the etching (or other slight indentation) may penetrate the 26 while still being viewable in the finished product to display the insignia. Even further, the etching may extend through the coating layers and the substrate. In this particular embodiment, the substrate includes a surface texture (also a form of insignia) viewable to a person in the finished product.

Apparatus for processing a semiconductor substrate are described herein. The apparatus include an electrostatic chuck within a physical vapor deposition process chamber. The electrostatic chuck is covered by a cover plate and has an edge ring disposed around the cover plate. The cover plate includes an alignment portion as well as a central support. An outer ring may extend from the cover plate to further support a substrate. A spacer is utilized to raise the edge ring to an appropriate height for processing of an optical device in the physical vapor deposition process chamber.

Apparatus for processing a semiconductor substrate are described herein. The apparatus include an electrostatic chuck within a physical vapor deposition process chamber. The electrostatic chuck is covered by a cover plate and has an edge ring disposed around the cover plate. The cover plate includes an alignment portion as well as a central support. An outer ring may extend from the cover plate to further support a substrate. A spacer is utilized to raise the edge ring to an appropriate height for processing of an optical device in the physical vapor deposition process chamber.

Disclosed herein are systems, methods, and devices for transporting substrates. A transport device may include a plurality of rotational bodies, where each rotational body is rotatably attached for transporting a rod-shaped workpiece. The transport device may include a rotational excitation element configured to excite rotation of the workpiece when it is supported on one of the plurality of rotational bodies.

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

A porous tool includes a mold body and an additively-manufactured film attached to a surface of the mold body. The film includes a porous layer and a nonporous support layer. The porous layer may include a surface having an array of surface pore openings, a network of interconnected passages in fluid communication with the surface pore openings, and one or more lateral edges that have an array of edge pore openings in fluid communication with the interconnected passages. Methods of forming a porous tool include depositing additive material on a build surface using a directed energy deposition system to form a film while simultaneously subtracting selected portions of the additive material from the film using laser ablation. Methods of forming a molded component include conforming a moldable material to a shape using a porous tool that includes a mold body and an additively-manufactured film, and evacuating outgas from the moldable material through a porous layer of the film.

A porous tool includes a mold body and an additively-manufactured film attached to a surface of the mold body. The film includes a porous layer and a nonporous support layer. The porous layer may include a surface having an array of surface pore openings, a network of interconnected passages in fluid communication with the surface pore openings, and one or more lateral edges that have an array of edge pore openings in fluid communication with the interconnected passages. Methods of forming a porous tool include depositing additive material on a build surface using a directed energy deposition system to form a film while simultaneously subtracting selected portions of the additive material from the film using laser ablation. Methods of forming a molded component include conforming a moldable material to a shape using a porous tool that includes a mold body and an additively-manufactured film, and evacuating outgas from the moldable material through a porous layer of the film.

Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.