Embodiments of the disclosure include an electrostatic chuck assembly, a processing chamber and a method of maintaining a temperature of a substrate is provided. In one embodiment, an electrostatic chuck assembly is provided that includes an electrostatic chuck, a cooling plate and a gas box. The cooling plate includes a gas channel formed therein. The gas box is operable to control a flow of cooling gas through the gas channel.

A deposition system comprises a vacuum chamber having a cylindrical inner wall, a cylindrical parts carousel disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and one or more deposition sources arranged to flow deposition material onto the cylindrical parts carousel. A cylindrical shutter assembly is disposed concentrically inside the cylindrical inner wall of the vacuum chamber, and has (1) a shuttered position in which the cylindrical shutter assembly blocks the one or more deposition sources from depositing onto the parts carousel and (2) an unshuttered position in which the cylindrical shutter assembly does not block the one or more deposition sources from depositing onto the parts carousel. A drive train rotates the cylindrical shutter assembly between the shuttered and unshuttered positions. The drive train not operatively connected to rotate the cylindrical parts carousel. The deposition sources may include inner and outer sputter sources.

A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

A process for sputtering a plurality of integrated circuit (IC) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.

A process for sputtering a plurality of integrated circuit (IC) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.

In accordance with various embodiments, provision is made of a substrate holding device, wherein the latter may comprise a carrier plate with a recess, the recess extending from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate, a holding frame, which has a frame opening and a support area, surrounding the frame opening, for holding a substrate in the recess, wherein the holding frame inserted into the recess lies on the carrier plate in sections.

In accordance with various embodiments, provision is made of a substrate holding device, wherein the latter may comprise a carrier plate with a recess, the recess extending from an upper side of the carrier plate to a lower side of the carrier plate through the carrier plate, a holding frame, which has a frame opening and a support area, surrounding the frame opening, for holding a substrate in the recess, wherein the holding frame inserted into the recess lies on the carrier plate in sections.

The invention relates to a device for vacuum coating substrates in a vacuum chamber, comprising an elongated evaporator array having a plurality of evaporator elements arranged along a longitudinal axis and a first substrate carrier unit which is associated with the evaporator array and has a first pylon that can be rotated about a first axis and contains retaining means for substrates, wherein an angular offset of less than 10 is present between the longitudinal axis and the first rotational axis. The device is characterised in that at least one second substrate carrier unit is provided, which is associated with the evaporator array and has a second pylon that can be rotated about a second axis and contains retaining means for substrates, wherein an angular offset of less than 10 is present between the longitudinal axis and the second rotational axis. At least one second substrate carrier unit (22, 122, 222) which is associated with the evaporator array (10, 110, 110a) and has a second pylon that can be rotated about a second rotational axis (42, 242) and contains retaining means for substrates is provided, wherein the axes of the pylons are designed to be fixed relative to the longitudinal axis (40) of the evaporator array, an angular offset of less than 10 is present between the longitudinal axis (40) and second rotational axis (42, 242), and a geometric configuration of the evaporator array (10, 110, 110a) and of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) is provided such that substrates of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) can be coated with the same quality by means of the evaporator array (10). The invention further relates to a method for vacuum coating by means of the device.

The invention relates to a device for vacuum coating substrates in a vacuum chamber, comprising an elongated evaporator array having a plurality of evaporator elements arranged along a longitudinal axis and a first substrate carrier unit which is associated with the evaporator array and has a first pylon that can be rotated about a first axis and contains retaining means for substrates, wherein an angular offset of less than 10 is present between the longitudinal axis and the first rotational axis. The device is characterised in that at least one second substrate carrier unit is provided, which is associated with the evaporator array and has a second pylon that can be rotated about a second axis and contains retaining means for substrates, wherein an angular offset of less than 10 is present between the longitudinal axis and the second rotational axis. At least one second substrate carrier unit (22, 122, 222) which is associated with the evaporator array (10, 110, 110a) and has a second pylon that can be rotated about a second rotational axis (42, 242) and contains retaining means for substrates is provided, wherein the axes of the pylons are designed to be fixed relative to the longitudinal axis (40) of the evaporator array, an angular offset of less than 10 is present between the longitudinal axis (40) and second rotational axis (42, 242), and a geometric configuration of the evaporator array (10, 110, 110a) and of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) is provided such that substrates of the first (21, 121, 221) and the at least second substrate carrier units (22, 122, 222) can be coated with the same quality by means of the evaporator array (10). The invention further relates to a method for vacuum coating by means of the device.