Patent classifications
C23C14/50
DEPOSITION SOURCE AND DEPOSITION APPARATUS INCLUDING THE SAME
A deposition source includes a first crucible, a second crucible disposed inside the first crucible, a block disposed inside the first crucible, the block being disposed on at least a portion of the second crucible, and a cover covering a top surface of the first crucible, the cover being disposed on the block.
DEPOSITION SOURCE AND DEPOSITION APPARATUS INCLUDING THE SAME
A deposition source includes a first crucible, a second crucible disposed inside the first crucible, a block disposed inside the first crucible, the block being disposed on at least a portion of the second crucible, and a cover covering a top surface of the first crucible, the cover being disposed on the block.
ELECTROSTATIC CHUCK UNIT AND DEPOSITING APPARATUS INCLUDING THE SAME
An electrostatic chuck unit includes: a first plate having a first surface and a second surface facing each other and a first hole extending from the first surface to the second surface; a second plate on the first surface of the first plate and having a groove corresponding to the first hole; a coupling bolt inserted into the first hole and the groove; and a height adjusting member spaced apart from the coupling bolt in a plan view.
ELECTROSTATIC CHUCK UNIT AND DEPOSITING APPARATUS INCLUDING THE SAME
An electrostatic chuck unit includes: a first plate having a first surface and a second surface facing each other and a first hole extending from the first surface to the second surface; a second plate on the first surface of the first plate and having a groove corresponding to the first hole; a coupling bolt inserted into the first hole and the groove; and a height adjusting member spaced apart from the coupling bolt in a plan view.
Film formation apparatus and film-formed workpiece manufacturing method
A film formation apparatus and a film-formed workpiece manufacturing method which are capable of forming a film with a uniform thickness on a workpiece like a three-dimensional object that includes a plurality of surfaces by a simple structure are provided. A film formation apparatus includes a target 21 that is a film formation material including a plane SU3, a power supply unit 3 applying power to the target 21, a rotating unit 4 rotating a workpiece W that is a film formation object around a rotation axis AX1, and a revolving unit 5 revolving the rotating unit 4 around a revolution axis AX2 separate from the rotation axis AX1 to repeatedly make the workpiece W to come close to and move apart from the target 21.
Vapor deposition apparatus, vapor deposition method and method of manufacturing organic el display apparatus
Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).
Vapor deposition apparatus, vapor deposition method and method of manufacturing organic el display apparatus
Provided are a vapor deposition apparatus, a vapor deposition method, and a method of manufacturing an organic EL display apparatus which can prevent heat generation of a magnet chuck by using the magnet chuck that strongly attracts a deposition mask to dispose a substrate for vapor deposition and the deposition mask in proximity to each other during vapor deposition, while being less influenced by any magnetic field during alignment between the substrate for vapor deposition and the deposition mask. In the vapor deposition apparatus, a magnet chuck (3) includes a permanent magnet (3A) and an electromagnet (3B).
PARTICLE REDUCTION DURING SPUTTERING DEPOSITION
Described herein are apparatuses and methods for holding a substrate in a position that minimizes particle contamination of the substrate when the substrate is being coated. Along with the apparatus, processes for reducing particle reduction on substrates are provided. The articles and processes described herein are useful in making coated glass substrates, such as used in electrochromic, photochromic, or photovoltaic technologies.
PARTICLE REDUCTION DURING SPUTTERING DEPOSITION
Described herein are apparatuses and methods for holding a substrate in a position that minimizes particle contamination of the substrate when the substrate is being coated. Along with the apparatus, processes for reducing particle reduction on substrates are provided. The articles and processes described herein are useful in making coated glass substrates, such as used in electrochromic, photochromic, or photovoltaic technologies.
INTEGRATED 3D METALLIZER
An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked vertically and spaced from one another, wherein each plate has an outer perimeter. There is a plurality of part supports arranged about the outer perimeter of each plate. A support frame is secured to the plurality of plates such that it may rotate about the outer perimeter of the plates while maintaining substantially the same distance from the outer perimeter of each plate. There is one or more rotation drive systems attached to the support frame and positioned such that one or more compliant drive fingers are in close proximity to the outer perimeter of each plate. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.