An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked vertically and spaced from one another, wherein each plate has an outer perimeter. There is a plurality of part supports arranged about the outer perimeter of each plate. A support frame is secured to the plurality of plates such that it may rotate about the outer perimeter of the plates while maintaining substantially the same distance from the outer perimeter of each plate. There is one or more rotation drive systems attached to the support frame and positioned such that one or more compliant drive fingers are in close proximity to the outer perimeter of each plate. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.

A turnover mechanism and a coating production line are disclosed, the turnover mechanism includes a jacking device configured to rise or lower a carrier; and a turnover device including a first driving member and a clamping member, wherein the turnover device and the carrier are disposed above the jacking device, the carrier is configured to carry a workpiece, the clamping member is configured to clamp the carrier, and the first driveling member is connected to the clamping member and configured to drive the clamping member to telescope and rotate.

A turnover mechanism and a coating production line are disclosed, the turnover mechanism includes a jacking device configured to rise or lower a carrier; and a turnover device including a first driving member and a clamping member, wherein the turnover device and the carrier are disposed above the jacking device, the carrier is configured to carry a workpiece, the clamping member is configured to clamp the carrier, and the first driveling member is connected to the clamping member and configured to drive the clamping member to telescope and rotate.

The invention relates to an apparatus for the vapor deposition of a coating on optical articles, comprising a distribution mask (32) for controlling the vapor deposition of a coating on optical articles that is positioned in the path of some of the molecules emitted by said emitting source in the direction of the rotatable support for optical articles. The distribution mask (32) is fitted with at least one arm (34) positioned so as to mask at least one partial zone (16) of an individual housing (28) on a portion of the revolution turn, this masked partial zone (16) comprising the center of the individual housing (28).

An apparatus designed to sputter a material onto a plurality of substrates includes a rotating metal frame, a plurality of carriers, and an insulator disposed between the metal frame and the plurality of carriers. The plurality of carriers are designed to hold one or more fixtures that secure the plurality of substrates, and each of the plurality of carriers is designed to couple to the metal frame. The insulator is disposed between the metal frame and the plurality of carriers at locations where the plurality of carriers are coupled to the metal frame such that the plurality of carriers are electrically isolated from the metal frame.

An apparatus designed to sputter a material onto a plurality of substrates includes a rotating metal frame, a plurality of carriers, and an insulator disposed between the metal frame and the plurality of carriers. The plurality of carriers are designed to hold one or more fixtures that secure the plurality of substrates, and each of the plurality of carriers is designed to couple to the metal frame. The insulator is disposed between the metal frame and the plurality of carriers at locations where the plurality of carriers are coupled to the metal frame such that the plurality of carriers are electrically isolated from the metal frame.

A thin film formation method is provided, by which needless film formation due to trial film formation is omitted and film formation efficiency can be improved. This invention is a method for sputtering targets to form a film A having an intended film thickness of T1 as the first thin film on a substrate and monitor substrate held and rotated by a rotation drum and, subsequently, furthermore sputtering the targets used in forming the film A to form a film C having an intended film thickness of T3 as the second thin film, which is another thin film having the same composition as the film A; comprising film thickness monitoring steps S4 and S5, a stopping step S7, an actual time acquisition step S8, an actual rate calculating step S9 and a necessary time calculating step S24.

Methods and apparatus for physical vapor deposition (PVD) are provided herein. In some embodiments, an apparatus includes a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support for supporting the substrate at a non-perpendicular angle to the linear PVD source, and wherein the substrate support and linear PVD source are movable with respect to each other either along a plane of the support surface, or along an axis that is perpendicular to the plane of the support surface, sufficiently to cause the stream of material flux to move completely over a surface of the substrate disposed on the substrate support during operation, wherein the substrate support moves on at least one of a linear slide or shaft that is supported by and travels through a gas-cushioned bearing having an inert gas as a cushioning gas.

Methods and apparatus for physical vapor deposition (PVD) are provided herein. In some embodiments, an apparatus includes a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support for supporting the substrate at a non-perpendicular angle to the linear PVD source, and wherein the substrate support and linear PVD source are movable with respect to each other either along a plane of the support surface, or along an axis that is perpendicular to the plane of the support surface, sufficiently to cause the stream of material flux to move completely over a surface of the substrate disposed on the substrate support during operation, wherein the substrate support moves on at least one of a linear slide or shaft that is supported by and travels through a gas-cushioned bearing having an inert gas as a cushioning gas.

Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for physical vapor deposition (PVD) includes: a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support having a support surface to support the substrate at a non-perpendicular angle to the linear PVD source, wherein the substrate support and linear PVD source are movable with respect to each other along an axis that is perpendicular to a plane of the support surface of the substrate support sufficiently to cause the stream of material flux to move over a working surface of the substrate disposed on the substrate support during operation.