The present disclosure relates to a field of semiconductor production device, and more particularly to a cooling member and a vacuum coating device. The cooling member includes a cooling plate and a rotating mechanism. The cooling plate includes at least one cooling strip communicated with a cooling liquid pipeline. The rotating mechanism includes a driving member and a rotating shaft, the driving member is connected with one end of the rotating shaft, and the other end of the rotating shaft is connected with the at least one cooling strip. The rotating mechanism drives the cooling strip in the cooling plate to rotate. In a cooling state, the cooling strip is parallel to a substrate in a chamber, the cooling area is increased, and the cooling efficiency is increased.

Several embodiments of the present technology are directed to actively controlling a temperature of a substrate in a chamber during manufacturing of a material or thin film. In some embodiments, the method can include cooling or heating the substrate to have a temperature within a target range, depositing a material over a surface of the substrate, and controlling the temperature of the substrate while the material is being deposited. In some embodiments, controlling the temperature of the substrate can include removing thermal energy from the substrate by directing a fluid over the substrate to maintain the temperature of the substrate within a target range throughout the deposition process.

There is provided a mounting table system which includes: a mounting table rotatably installed so as to mount a substrate thereon; a plurality of heating parts installed in the mounting table, and configured to heat the mounting table; a single power source configured to supply an electric power to the plurality of heating parts; and a power switching part configured to switch from a first heating part among the plurality of heating parts to which the electric power is supplied from the single power source, to a second heating part among the plurality of heating parts, depending on a rotational angle of the mounting table.

A method for producing a medical instrument, the method includes coupling a balloon-based distal end of the medical instrument to a jig that sets the distal end to an expanded position. While the distal end is coupled to the jig, one or more electrodes are disposed on an outer surface of the distal end, one or more openings are formed in a wall of the distal end, and are threaded through the openings respective leads coupled to at least one of respective sensors and electrodes that are mounted on the outer surface of the distal end. One or more patches that cover the openings and couple the at least one of respective sensors and electrodes to the outer surface of the distal end, are coupled on the outer surface of the distal end.

Embodiments of the present disclosure relate to a rotatable electrostatic chuck. In some embodiments, a rotatable electrostatic chuck includes a dielectric disk having at least one chucking electrode and a plurality of coolant channels; a cryogenic manifold coupled to the dielectric disk and having a coolant inlet and a coolant outlet both of which are fluidly coupled to the plurality of coolant channels; a shaft assembly coupled to the cryogenic manifold; a cryogenic supply chamber coupled to the shaft assembly; a supply tube coupled to the cryogenic supply chamber and to the coolant inlet to supply the cryogenic medium to the plurality of coolant channels, wherein the supply tube extends through the central opening of the shaft assembly; and a return tube coupled to the coolant outlet and to the cryogenic supply chamber, wherein the supply tube is disposed within the return tube.

A method and a system for film deposition, the system comprising a substrate and a negatively biased target, the target being mounted on a magnetron sputtering cathode and located at a distance from the substrate, wherein a laser beam from a pulsed laser is focused on the target, thereby triggering a magnetron plasma or ejecting vaporized and ionized material from the target in an existing magnetron plasma, the magnetron plasma sputtering material from the target depositing on the substrate.

The disclosed embodiments include a system and method for manufacturing an integrated computational element (ICE) core. The method comprises varying a distance between a thermal component relative to a substrate holder that holds at least one substrate during a thin film deposition process to improve uniformity of the ICE core. In one embodiment, varying the distance between the thermal component relative to the substrate holder that holds at least one substrate includes moving at least a portion of the substrate holder in at least one direction relative to the thermal component and also moving the thermal component in at least one direction relative to the substrate holder during the thin film deposition process.

An evaporation method and an evaporation device for an organic light-emitting diode substrate are proposed. The evaporation method includes: step 1, regulating a distance between a supporting module for supporting a substrate and a crucible platform of an evaporation device; step 2, adjusting a direction of opening of a crucible disposed on the crucible platform; and step 3, placing a substrate to be evaporated on the supporting module and volatizing an evaporation source in the crucible and attaching the volatized evaporation source onto a surface of the substrate.

An evaporation method and an evaporation device for an organic light-emitting diode substrate are proposed. The evaporation method includes: step 1, regulating a distance between a supporting module for supporting a substrate and a crucible platform of an evaporation device; step 2, adjusting a direction of opening of a crucible disposed on the crucible platform; and step 3, placing a substrate to be evaporated on the supporting module and volatizing an evaporation source in the crucible and attaching the volatized evaporation source onto a surface of the substrate.

A substrate treatment apparatus for treating substrates has a plate-shaped substrate carrier and at least one plate-shaped tempering device, which is arranged parallel to the substrate carrier. The substrate carrier has a substrate carrier front side for supporting at least one laminar substrate and a substrate carrier back side, which faces the tempering device. The object of the present invention is to provide a substrate treatment apparatus which enables a heat distribution as evenly as possible in the substrate carrier. For that purpose, there is provided at least one spacer element for forming a distance between the substrate carrier and the tempering device at the substrate carrier back side and/or a surface of the tempering device facing the substrate carrier.