The present disclosure provides an evaporation carrier plate and an evaporation device. The evaporation carrier plate includes a carrier plate body. The carrier plate body includes a glass-carrying surface and a plurality of pin holes for pins to extend through. The evaporation carrier plate further includes a cover plate arranged on a surface of the carrier plate body away from the glass-carrying surface and configured to move relative to the carrier plate body to cover or open the pin holes.

The present disclosure provides an evaporation carrier plate and an evaporation device. The evaporation carrier plate includes a carrier plate body. The carrier plate body includes a glass-carrying surface and a plurality of pin holes for pins to extend through. The evaporation carrier plate further includes a cover plate arranged on a surface of the carrier plate body away from the glass-carrying surface and configured to move relative to the carrier plate body to cover or open the pin holes.

Vapor deposition apparatuses, systems, and methods for selectively coating, with one or more functional layers, a substrate through the use of moveable shutters are described. Embodiments of the present disclosure can be useful for coating eyeglass lenses. Still other embodiments are described.

An ion beam irradiation device is provided and including: a substrate holder that holds a substrate; a rotating mechanism that rotates the substrate holder about a center portion of the substrate being held; a reciprocating mechanism that reciprocates the substrate holder and the rotating mechanism in the moving direction; an ion beam irradiator that irradiates the substrate with an ion beam; and a control device that controls the rotating mechanism and the reciprocating mechanism. The ion beam has a center region where the beam current density is a predetermined value or more in the moving direction, and a peripheral region where the beam current density is less than the predetermined value, a center region size in the direction orthogonal to the moving direction is larger than a substrate size in the direction orthogonal to the moving direction.

EC film stacks and different layers within the EC film stacks arc disclosed. Methods of manufacturing these layers are also disclosed. In one embodiment, an EC layer comprises nanostructured EC layer. These layers may be manufactured by various methods, including, including, but not limited to glancing angle deposition, oblique angle deposition, electrophoresis, electrolyte deposition, and atomic layer deposition. The nanostructured EC layers have a high specific surface area, improved response times, and higher color efficiency.

Embodiments herein include a halo having varied conductance. In some embodiments, a halo surrounding a semiconductor workpiece may include a first side opposite a second side, and a first end opposite a second end, wherein the first side is operable to receive an ion beam from an ion source. The halo may further include a plurality of apertures extending between the first side and the second side, wherein the plurality of apertures permit passage of a portion of the ion beam to pass therethrough, and wherein the halo has a varied conductance between the first and second ends. In some embodiments, at least a group of apertures of the plurality of apertures vary in at least one of: pitch, and diameter. In some embodiments, a thickness of the halo between the first side and the second side varies along a height extending between the first end and the second end.

Embodiments of improved methods and apparatus for maintaining low non-uniformity over the course of the life of a target are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition chamber includes: disposing a substrate atop a substrate support having a cover ring that surrounds the substrate support such that an upper surface of the substrate is positioned at a first distance above an upper surface of the cover ring; sputtering a source material from a target disposed opposite the substrate support to deposit a film atop the substrate while maintaining the first distance; and lowering the substrate support with respect to the cover ring and sputtering the source material from the target to deposit films atop subsequent substrates over a life of the target.

Embodiments of improved methods and apparatus for maintaining low non-uniformity over the course of the life of a target are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition chamber includes: disposing a substrate atop a substrate support having a cover ring that surrounds the substrate support such that an upper surface of the substrate is positioned at a first distance above an upper surface of the cover ring; sputtering a source material from a target disposed opposite the substrate support to deposit a film atop the substrate while maintaining the first distance; and lowering the substrate support with respect to the cover ring and sputtering the source material from the target to deposit films atop subsequent substrates over a life of the target.

An apparatus and method for metallizing parts in an efficient manner. The apparatus includes a plurality of plates stacked together and spaced from one another in a manner that enables placement thereon of a plurality of part supports, which are affixed to the plates. Spindles are coupled to the part supports, wherein the spindles are configured to allow for rotation of the parts. The plates are also configured for rotation so that parts may be moved to a metallizer station and rotated at the metallizer station. The plates are supported by centered or offset plate supports. The part supports may be pins to which the spindles are coupled. The pins may be configured to rotate or the spindles may be configured to rotate on the pins. The stacked plates may be moved between a metallizer and parts loading and unloading stations in a convenient manner.

A coating deposition assembly includes a substrate having an outer surface with a contoured geometry, a mesh mask having a plurality of apertures and being disposed over a subset of the outer surface of the substrate and spaced apart from the outer surface, and a tool secured to the substrate. The tool is configured to move the substrate and the mesh mask relative to a coating material source such that the mesh mask maintains a fixed spatial relationship with the substrate.