A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

A first memory device includes a first magnetoresistive cell having a plurality of deposition layers. A second memory device includes a second magnetoresistive cell having a plurality of deposition layers. Each of the plurality of deposition layers of the second magnetoresistive cell corresponds to one of the plurality of deposition layers of the first magnetoresistive cell. One of the plurality of deposition layers of the second magnetoresistive cell is thinner than a corresponding deposition layer of the plurality of deposition layers of the first magnetoresistive cell.

An apparatus for use in a physical vapor deposition coating process includes a chamber, a crucible configured to hold a ceramic coating material in the chamber, an energy source operable to heat the interior of the chamber, a fixture for holding at least one substrate in the chamber, an actuator operable to rotate the fixture, and a controller configured to establish a plume of the ceramic coating material in the chamber to deposit the ceramic coating material from the plume onto the at least one substrate and form a ceramic coating thereon, and during the deposition, rotate the at least one substrate at a rotational speed selected with respect to deposition rate of the ceramic coating material onto the at least one substrate.

A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.

The present disclosure provides a film thickness test apparatus and method, and a vapor deposition device. The film thickness test apparatus is arranged for one process cavity, and the film thickness test apparatus comprises: a test assembly; a transport assembly configured to, when moving towards the process cavity, drive the test assembly into the process cavity so that the test assembly is vapor deposited in the process cavity to form a test film, and, when moving away from the process cavity, drive the test assembly out of the process cavity; and a drive assembly configured to drive the transport assembly to move along a direction towards/away from the process cavity.

The present disclosure provides a film thickness test apparatus and method, and a vapor deposition device. The film thickness test apparatus is arranged for one process cavity, and the film thickness test apparatus comprises: a test assembly; a transport assembly configured to, when moving towards the process cavity, drive the test assembly into the process cavity so that the test assembly is vapor deposited in the process cavity to form a test film, and, when moving away from the process cavity, drive the test assembly out of the process cavity; and a drive assembly configured to drive the transport assembly to move along a direction towards/away from the process cavity.

A substrate support apparatus includes a housing and a plurality of spherical supports. The housing has a top surface, the top surface including a plurality of openings. The housing is configured to position the plurality of spherical supports within the plurality of openings so that topmost surfaces of the plurality of spherical supports are arranged in a plane above the top surface. A spherical support of the plurality of spherical supports is rotatable within the housing.

A magnetron sputtering device is disclosed and includes a magnetic levitation track and a supporter which is levitated on the magnetic levitation track. The supporter includes a magnetic track fixed on the supporter via a plurality of pads; each of the pads includes a first insulation plate and a second insulation plate, the first insulation plate and the magnetic track are connected via a first fastener, the second insulation plate and the supporter are connected via a second fastener, and the second fastener and the first fastener are not in contact with each other; the first insulation plate and the second insulation plate are connected via a third fastener, the third fastener is not in contact with both the magnetic track and the supporter, and the third fastener is not in contact with both the first fastener and the second fastener.

A magnetron sputtering device is disclosed and includes a magnetic levitation track and a supporter which is levitated on the magnetic levitation track. The supporter includes a magnetic track fixed on the supporter via a plurality of pads; each of the pads includes a first insulation plate and a second insulation plate, the first insulation plate and the magnetic track are connected via a first fastener, the second insulation plate and the supporter are connected via a second fastener, and the second fastener and the first fastener are not in contact with each other; the first insulation plate and the second insulation plate are connected via a third fastener, the third fastener is not in contact with both the magnetic track and the supporter, and the third fastener is not in contact with both the first fastener and the second fastener.

ZnO sputtering is performed while a rolling body is housed in a basket made of a metal wire and is rotated. By setting a ratio of a mesh size of the basket to a diameter of the rolling body in a range of 40 to 95%, fine and uniform ZnO coating can be formed on a surface of the rolling body. By using the rolling body with ZnO coating prepared in this manner in a bearing which is rotated at high speed in a high-load state, a friction coefficient can significantly be lowered in comparison with a case of no coating.