A method for use in a physical vapor deposition coating process includes depositing a ceramic coating material from a plume onto at least one substrate to form a ceramic coating thereon, and during the deposition, rotating the at least one substrate at rotational speed selected with respect to deposition rate of the ceramic coating material onto the at least one substrate.

A system and method for reducing attractive forces between a deposition mask and a substrate is provided that enables high-resolution direct deposition of a patterned layer of material on a substrate using electrostatic chucks for holding the substrate and the shadow mask. A charge-dissipating shadow mask is utilized that comprises a thin conductive layer on the surface of the membrane of the shadow mask. The conductive layer helps to dissipate the charge that accumulates on the membrane of the shadow mask, thereby reducing the attractive forces between the substrate and the shadow mask. As a result, the shadow mask and substrate can be placed in closer proximity to each other than would be possible without the charge-dissipating shadow mask, thereby reducing feathering effects and enabling higher resolution direct deposition.

A system and method for reducing attractive forces between a deposition mask and a substrate is provided that enables high-resolution direct deposition of a patterned layer of material on a substrate using electrostatic chucks for holding the substrate and the shadow mask. A charge-dissipating shadow mask is utilized that comprises a thin conductive layer on the surface of the membrane of the shadow mask. The conductive layer helps to dissipate the charge that accumulates on the membrane of the shadow mask, thereby reducing the attractive forces between the substrate and the shadow mask. As a result, the shadow mask and substrate can be placed in closer proximity to each other than would be possible without the charge-dissipating shadow mask, thereby reducing feathering effects and enabling higher resolution direct deposition.

To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

To reduce pumping time of a vacuum treatment chamber served by a transport arrangement in a transport chamber. The vacuum treatment chamber is split in a workpiece treatment compartment and in a pumping compartment in mutual free flow communication and arranged opposite each other with respect to a movement path of the transport arrangement serving the vacuum treatment chamber. The pumping compartment allows providing a pumping port of a flow cross-section area freely selectable independently from the geometry of the treatment compartment.

The present invention relates to a technical field of display, and discloses a substrate carrying apparatus. The apparatus comprises: a vertical bearing plate and an upper holding base; one side surface of the vertical bearing plate is a bearing surface, the upper holding base is provided at the upside of the bearing surface; the upper holding base is provided with a plurality of holder for holding the substrate; the left and right sides of the bearing surface are provided with a plurality of positioning clips for positioning the substrate from the left and right ends of the substrate. The substrate carrying apparatus of the present invention provides a holder on the upper holding base, and during loading of the substrate, after the substrate is transported in place by a manipulator, the substrate is held and hanged by the holder, and the substrate would not undergo a falling process, reducing the risk of substrate damage. The present invention further provides a sputtering device comprising one or more of the substrate carrying apparatuses.

The present invention relates to a technical field of display, and discloses a substrate carrying apparatus. The apparatus comprises: a vertical bearing plate and an upper holding base; one side surface of the vertical bearing plate is a bearing surface, the upper holding base is provided at the upside of the bearing surface; the upper holding base is provided with a plurality of holder for holding the substrate; the left and right sides of the bearing surface are provided with a plurality of positioning clips for positioning the substrate from the left and right ends of the substrate. The substrate carrying apparatus of the present invention provides a holder on the upper holding base, and during loading of the substrate, after the substrate is transported in place by a manipulator, the substrate is held and hanged by the holder, and the substrate would not undergo a falling process, reducing the risk of substrate damage. The present invention further provides a sputtering device comprising one or more of the substrate carrying apparatuses.

A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

An embodiment of a method includes retaining a first workpiece and a second workpiece selectively on a workpiece fixture disposed within a deposition chamber. The workpiece fixture includes tooling including a first workpiece holder, a second workpiece holder, and a first hollow wall. The first workpiece is separated from the second workpiece using the first hollow wall. Energy is selectively applied and directed within the deposition chamber, from an energy source toward a first crucible, the first crucible including a plurality of walls defining an upper recess contiguous with, and disposed directly above a first lower recess, at least the upper recess open to an interior of the deposition chamber. During the step of selectively applying and directing energy, a gas valve is controlled to maintain a partial vacuum in the deposition chamber of greater than 2 Pa to control a size and overlap of at least one coating zone formed around each of the at least one workpiece.