Embodiments of the present disclosure generally relate to apparatus, systems, and methods for in-situ film growth rate monitoring. A thickness of a film on a substrate is monitored during a substrate processing operation that deposits the film on the substrate. The thickness is monitored while the substrate processing operation is conducted. The monitoring includes directing light in a direction toward a crystalline coupon. The direction is perpendicular to a heating direction. In one implementation, a reflectometer system to monitor film growth during substrate processing operations includes a first block that includes a first inner surface. The reflectometer system includes a light emitter disposed in the first block and oriented toward the first inner surface, and a light receiver disposed in the first block and oriented toward the first inner surface. The reflectometer system includes a second block opposing the first block.

A movement system is provided for moving a non-flat substrate across a sputter flux distribution without circumferentially exposing the non-flat substrate to the sputter flux distribution. The movement system is arranged for a first movement of translationally transporting the non-flat substrate along the sputter flux distribution, and a second movement of translating and/or rotating the non-flat substrate with respect to the sputter flux distribution.

A movement system is provided for moving a non-flat substrate across a sputter flux distribution without circumferentially exposing the non-flat substrate to the sputter flux distribution. The movement system is arranged for a first movement of translationally transporting the non-flat substrate along the sputter flux distribution, and a second movement of translating and/or rotating the non-flat substrate with respect to the sputter flux distribution.

This disclosure relates to apparatus and methods for sublimation and deposition of chemicals. In particular aspects, this disclosure relates to apparatus and methods for patterned sublimation and deposition of chemicals for use in matrix assisted laser desorption ionization imaging mass spectrometry (MALDI IMS). In specific aspects, the apparatus comprises a vacuum chamber and a template comprising a planar surface containing the chemical to be sublimed, where the template is located within the vacuum chamber.

This disclosure relates to apparatus and methods for sublimation and deposition of chemicals. In particular aspects, this disclosure relates to apparatus and methods for patterned sublimation and deposition of chemicals for use in matrix assisted laser desorption ionization imaging mass spectrometry (MALDI IMS). In specific aspects, the apparatus comprises a vacuum chamber and a template comprising a planar surface containing the chemical to be sublimed, where the template is located within the vacuum chamber.

The present disclosure provides an apparatus configured for sputter deposition on a substrate. The apparatus includes a cylindrical sputter cathode rotatable around a rotational axis, and a magnet assembly configured to provide a first plasma racetrack and a second plasma racetrack on opposite sides of the cylindrical sputter cathode, wherein the magnet assembly includes two, three or four magnets each having two poles and one or more sub-magnets, wherein the two, three or four magnets are configured for generating both the first plasma racetrack and the second plasma racetrack.

A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0.3 mm or less, and/or wherein the substrate has a size of 1.4 m.sup.2 or more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.

A method and a support for holding a substrate, wherein the support is included in a transportation system configured to transport the substrate. The method includes attaching an adhesive to the support, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the substrate to the support; and attaching the adhesive to the substrate. Moreover, the thickness of the substrate is about 0.3 mm or less, and/or wherein the substrate has a size of 1.4 m.sup.2 or more. The support includes a support body and an adhesive, wherein the material of the adhesive is a synthetic setae material and wherein the adhesive is configured to attach the support body to the substrate, wherein the support is included in a transportation system configured to transport the substrate.

According to an embodiment of the present invention, the workpiece holding body 20 for surface processing includes the holder 21 and the adhesive sheet 22. The adhesive sheet 22 includes the first surface 22a (the first adhesive layer 221) and the second surface 22b (the second adhesive layer 222), the first surface 22a (the first adhesive layer 221) being bonded to the holder 21 at a first adhesive force, the second surface 22b (the second adhesive layer 222) being capable of holding a workpiece (the component main-body 110) at a second adhesive force, the second adhesive force being higher than the first adhesive force.

According to an embodiment of the present invention, the workpiece holding body 20 for surface processing includes the holder 21 and the adhesive sheet 22. The adhesive sheet 22 includes the first surface 22a (the first adhesive layer 221) and the second surface 22b (the second adhesive layer 222), the first surface 22a (the first adhesive layer 221) being bonded to the holder 21 at a first adhesive force, the second surface 22b (the second adhesive layer 222) being capable of holding a workpiece (the component main-body 110) at a second adhesive force, the second adhesive force being higher than the first adhesive force.