An embodiment of a line-of-sight coating fixture includes a support structure, a spindle, and a shadow structure. The support structure includes a plurality of compartments disposed below a platter, each compartment having an opening on a periphery of the support structure. Each compartment is adapted to receive and secure a base of a workpiece such that a body of each workpiece to be coated is disposed about a periphery of the support structure and extends above the platter. The spindle is disposed through a center of the platter or support structure for rotating the workpieces thereabout. The shadow structure is disposed about the spindle, inside of the periphery, the shadow structure sized and adapted to shield a portion of each workpiece from line-of-sight coating material.

The present disclosure provides a method and system for controlling a deposition device, relating to the field of semiconductor technology. The method for controlling a deposition device is applied to the deposition device, the deposition device includes a reaction chamber and an electrostatic chuck arranged in the reaction chamber, the electrostatic chuck carries a wafer, and the controlling method includes: obtaining a pressure value between the wafer and the electrostatic chuck; and when the pressure value exceeds a preset range, the deposition device sending out an alarm signal, and executing a cleaning operation according to a use state of the electrostatic chuck.

The present disclosure provides a method and system for controlling a deposition device, relating to the field of semiconductor technology. The method for controlling a deposition device is applied to the deposition device, the deposition device includes a reaction chamber and an electrostatic chuck arranged in the reaction chamber, the electrostatic chuck carries a wafer, and the controlling method includes: obtaining a pressure value between the wafer and the electrostatic chuck; and when the pressure value exceeds a preset range, the deposition device sending out an alarm signal, and executing a cleaning operation according to a use state of the electrostatic chuck.

A brake disk or drum has at least one working surface which opposes a braking member such as a brake pad or shoe. A plurality of spaced, raised island formations are provided across the working surface, with channels extending between the island formations. Each raised island formation has an outer surface which contacts a brake pad or brake shoe during braking.

A deposition system includes a system housing having a housing interior, a fixture transfer assembly having a generally sloped fixture transfer rail extending through the housing interior, a plurality of sequentially ordered deposition chambers connected by the fixture transfer rail, a controller interfacing with the processing chambers and at least one fixture carrier assembly carried by the fixture transfer rail and adapted to contain at least one substrate. The fixture carrier assembly travels along the fixture transfer rail under influence of gravity. A substrate fixture contains a substrate. The substrate fixture comprises a fixture frame. The fixture frame is defined by multiple circular members adjacently joined in a circular arrangement. Each circular member has a fixture frame opening sized to receive the substrate. Lens support arms may integrate into the circular members, extending in a curved disposition into the fixture frame opening to retain the substrate. A deposition method is also disclosed.

A transparent polymer film for light redirection includes a carrier layer and a structured layer in optical contact with each other. The structured layer has a multitude of curved metallic micromirrors, which are parallel to each other and encapsulated in a transparent material and separated by a periodicity distance (p) of 10 to 1000 micrometer parallel to the film surface. 50% or more of the micromirrors’ surfaces have a cross section, perpendicular to the film surface, in the form of elliptic arcs, whose radii are from the range 5 p to 25 p, and the micromirrors are arranged in a depth (d) perpendicular to the film surface from the range 1.6 p to 3.0 p, especially 2 p to 2.5 p. Glazings can be equipped with the film.

A transparent polymer film for light redirection includes a carrier layer and a structured layer in optical contact with each other. The structured layer has a multitude of curved metallic micromirrors, which are parallel to each other and encapsulated in a transparent material and separated by a periodicity distance (p) of 10 to 1000 micrometer parallel to the film surface. 50% or more of the micromirrors’ surfaces have a cross section, perpendicular to the film surface, in the form of elliptic arcs, whose radii are from the range 5 p to 25 p, and the micromirrors are arranged in a depth (d) perpendicular to the film surface from the range 1.6 p to 3.0 p, especially 2 p to 2.5 p. Glazings can be equipped with the film.

Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

The present invention relates to a method of forming a plasma resistant oxyfluoride coating layer, including: mounting a substrate on a substrate holder provided in a chamber; causing an electron beam scanned from an electron gun to be incident on an oxide evaporation source accommodated in a first crucible, and heating, melting, and vaporizing the oxide evaporation source as the electron beam is incident on the oxide evaporation source; vaporizing a fluoride accommodated in a second crucible; and advancing an evaporation gas generated from the oxide evaporation source and a fluorine-containing gas generated from the fluoride toward the substrate, and reacting the evaporation gas generated from the oxide evaporation source and the fluorine-containing gas generated from the fluoride to deposit an oxyfluoride on the substrate. According to the present invention, it is possible to form a dense and stable oxyfluoride coating layer having excellent plasma resistance, suppressed generation of contaminant particles, and no cracks.