A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.

The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.

The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.

An apparatus for manufacturing a semiconductor device may include a chamber, a chuck provided in the chamber, and a biased power supply physically connected with the chuck. The apparatus may include a target component provided over the chuck and the biased power supply, and a magnetron assembly provided over the target component. The magnetron assembly may include a plurality of outer magnetrons and a plurality of inner magnetrons, and a spacing between each adjacent magnetrons of the plurality of outer magnetrons may be different from a spacing between each adjacent magnetrons of the plurality of inner magnetrons.

A design of an integrated computational element (ICE) includes specification of a substrate and a plurality of layers, their respective constitutive materials, target thicknesses and refractive indices, where refractive indices of respective materials of adjacent layers are different from each other, and a notional ICE fabricated in accordance with the ICE design is related to a characteristic of a sample. One or more layers of the plurality of layers of an ICE are formed based on the ICE design, such that the formed layer(s) includes(e) corresponding material(s) from among the specified constitutive materials of the ICE. Characteristics of probe-light interacted with the formed layer(s) are measured at two or more temperatures. Temperature dependence(ies) of one or more refractive indices of the corresponding material(s) of the formed layers is(are) determined using the measured characteristics. The received ICE design is updated based on the determined temperature dependence(ies) of the refractive index(ices).

A design of an integrated computational element (ICE) includes specification of a substrate and a plurality of layers, their respective constitutive materials, target thicknesses and refractive indices, where refractive indices of respective materials of adjacent layers are different from each other, and a notional ICE fabricated in accordance with the ICE design is related to a characteristic of a sample. One or more layers of the plurality of layers of an ICE are formed based on the ICE design, such that the formed layer(s) includes(e) corresponding material(s) from among the specified constitutive materials of the ICE. Characteristics of probe-light interacted with the formed layer(s) are measured at two or more temperatures. Temperature dependence(ies) of one or more refractive indices of the corresponding material(s) of the formed layers is(are) determined using the measured characteristics. The received ICE design is updated based on the determined temperature dependence(ies) of the refractive index(ices).

Embodiments of the invention provide a bearing device and a plasma processing apparatus. According to at least one embodiment, the bearing device includes a base, a base driving mechanism, a pressing ring and a baffle ring. The base is used for bearing a workpiece to be processed; the base driving mechanism is used for driving the base to move up to a process position or down to a loading and unloading position; the pressing ring is used for clamping an edge region of the workpiece to be processed on the base when the base is at the process position; the baffle ring surrounds an outer peripheral wall of the base and is located under the pressing ring; surfaces of the pressing ring and the baffle ring opposite to each other include a pair of guiding tori, which are inclined outwardly at a same angle with respect to a centerline of the base in a vertical direction; and, during the process of driving the base to move up by the base driving mechanism, the guiding tori contact and move toward each other, so as to achieve positioning of the pressing ring and the base.

Embodiments of the invention provide a bearing device and a plasma processing apparatus. According to at least one embodiment, the bearing device includes a base, a base driving mechanism, a pressing ring and a baffle ring. The base is used for bearing a workpiece to be processed; the base driving mechanism is used for driving the base to move up to a process position or down to a loading and unloading position; the pressing ring is used for clamping an edge region of the workpiece to be processed on the base when the base is at the process position; the baffle ring surrounds an outer peripheral wall of the base and is located under the pressing ring; surfaces of the pressing ring and the baffle ring opposite to each other include a pair of guiding tori, which are inclined outwardly at a same angle with respect to a centerline of the base in a vertical direction; and, during the process of driving the base to move up by the base driving mechanism, the guiding tori contact and move toward each other, so as to achieve positioning of the pressing ring and the base.

A method for fabricating a perovskite film includes the steps of: placing a substrate on a substrate stage in a chamber, the substrate stage configured to rotate around its central axis at a rotation speed; depositing first source materials on the substrate from a first set of evaporation units, each coupled to the side section or the bottom section of the chamber; depositing second source materials on the substrate from a second set of evaporation units coupled to the bottom section, wherein the chamber includes a shield defining two or more zones having respective horizontal cross-sectional areas, which are open and facing the substrate, designated for the two or more evaporation units in the second set. The perovskite film includes multiple unit layers each being formed by one rotation of the substrate stage, and having composition and thickness thereof controlled by adjusting evaporation rates, rotation speed and horizontal cross-sectional areas.

The present disclosure discloses a fixing apparatus for fixing a substrate to be processed below a bearing base during an evaporation process, the substrate to be processed includes a base substrate, a ferromagnetic material is formed on a front surface or a back surface of the base substrate, and a magnetic field generator is disposed on a back surface of the bearing base at a location corresponding to the ferromagnetic material; the magnetic field generator is configured to generate a magnetic field so that the ferromagnetic material and the magnetic field generator are approaching to each other under an effect of the magnetic field generated by the magnetic field generator to fix a front surface of the bearing base with the back surface of the base substrate. An evaporation method is further disclosed.