A holding device for holding a carrier or a component in a vacuum chamber is described. The holding device includes one or more electric controllable holding elements, a housing for at least partially housing the one or more electric controllable holding elements, the housing having a reception for the one or more electric controllable holding elements, a sealing for providing an air-tight sealing between the housing and the one or more electric controllable holding elements being arranged in the reception; and an air-tight connection for an electric supply line for the one or more electric controllable holding elements. Further, a method of producing a holding device, an apparatus for handling a carrier in a vacuum chamber, and a vacuum deposition system are described.

A holding device for holding a carrier or a component in a vacuum chamber is described. The holding device includes one or more electric controllable holding elements, a housing for at least partially housing the one or more electric controllable holding elements, the housing having a reception for the one or more electric controllable holding elements, a sealing for providing an air-tight sealing between the housing and the one or more electric controllable holding elements being arranged in the reception; and an air-tight connection for an electric supply line for the one or more electric controllable holding elements. Further, a method of producing a holding device, an apparatus for handling a carrier in a vacuum chamber, and a vacuum deposition system are described.

A stage includes: a substrate mounting member having a mounting surface on which a target substrate is mounted; a support member configured to support the substrate mounting member; a refrigerant flow path formed inside the support member along the mounting surface, and including a ceiling surface disposed on the mounting surface side, a bottom surface opposite to the ceiling surface, and an introduction port for introducing a refrigerant formed on the bottom surface; and a heat insulating member including at least a first planar portion covering a portion of the ceiling surface, which faces the introduction port, and a second planar portion covering an inner side surface of a curved portion of the refrigerant flow path.

A scanning system includes a scanning chamber; a first rotary drive disposed in the scanning chamber and configured to rotate around a first axis; a second rotary drive disposed in the scanning chamber and configured to rotate around the first axis synchronously with the first rotary drive; and a bar-and-hinge system disposed in the scanning chamber and mechanically coupled to a substrate holder, the hinge system configured to translate a rotary motion of the first rotary drive and the second rotary drive to a planar motion of the substrate holder.

A film forming apparatus for forming a film by reactive sputtering includes a processing chamber, a sputter mechanism, a sputtered particle shielding member, a reaction chamber, a substrate support, a substrate moving mechanism, a sputtered particle passage hole, and a reactive gas introducing unit. While moving a substrate by the substrate moving mechanism, sputtered particles, that are released to the discharge space by the sputter mechanism and pass through the sputtered particle passage hole to be injected to the reaction chamber, are reacted with a reactive gas introduced into the reaction chamber, and a reactive sputtering film generated by the reaction is formed on the substrate.

A carrier for supporting a substrate or a mask in a vacuum chamber in or parallel to a first plane is provided. The carrier comprises a clamping device for fixing the carrier to an aligning device and a mechanical motion element connecting the clamping device to the carrier, the mechanical motion element allowing for relative movement of the clamping device and the carrier for at least one degree of freedom and providing a fixed connection between the clamping device and the carrier for at least another degree of freedom.

A carrier for supporting a substrate or a mask in a vacuum chamber in or parallel to a first plane is provided. The carrier comprises a clamping device for fixing the carrier to an aligning device and a mechanical motion element connecting the clamping device to the carrier, the mechanical motion element allowing for relative movement of the clamping device and the carrier for at least one degree of freedom and providing a fixed connection between the clamping device and the carrier for at least another degree of freedom.

A method includes transmitting a radiation toward an electrostatic chuck, receiving a reflection of the radiation, analyzing the reflection of the radiation, determining whether a particle is present on the electrostatic chuck based on the analyzing the reflection of the radiation, and moving a cleaning tool to a location of the particle on the electrostatic chuck when the determination determines that the particle is present.

A preparation device has a chamber, molten metal containers, a rotatable base in the chamber and having a deposition substrate, laser sets generating a dual-pulse laser, a base controller and a data collection control unit. The containers communicate with the chamber and each has a pulse pressurization apparatus pressing the molten metal into the chamber. The laser sets correspond to the containers such that beams of an emitted dual-pulse laser bombard the pulsed droplets, plasmas are generated and are sputtered and deposited on the substrate forming a multi-element alloy thin film. The unit collects base temperature and displacement information, and controls the pressurization frequency of the pulse pressurization apparatus, and the emission frequency and energy of the dual-pulse laser of the laser sets controlling the frequency and energy of the dual-pulse laser bombarding the corresponding pulsed droplets. The base controller controls the base temperature, rotation and movement.

Embodiments of the present disclosure relate to a rotatable electrostatic chuck. In some embodiments, a rotatable electrostatic chuck includes a dielectric disk having at least one chucking electrode and a plurality of coolant channels; a cryogenic manifold coupled to the dielectric disk and having a coolant inlet and a coolant outlet both of which are fluidly coupled to the plurality of coolant channels; a shaft assembly coupled to the cryogenic manifold; a cryogenic supply chamber coupled to the shaft assembly; a supply tube coupled to the cryogenic supply chamber and to the coolant inlet to supply the cryogenic medium to the plurality of coolant channels, wherein the supply tube extends through the central opening of the shaft assembly; and a return tube coupled to the coolant outlet and to the cryogenic supply chamber, wherein the supply tube is disposed within the return tube.