In accordance with various embodiments, a coating arrangement may comprise: an electron beam gun for providing an electron beam; a beam trap for trapping the electron beam; a control device for driving the electron beam gun and/or the beam trap, wherein the control device is configured to switch over the driving between a plurality of configurations, of which: in a first configuration, the electron beam is directed onto the beam trap; and in a second configuration, the electron beam is directed past the beam trap.

A brake disk formed of a light weight ceramic and ceramic composite materials, the brake disk having a coating overlying at least a portion of the brake disk. The brake disk includes parallel surfaces wherein at least a portion of the parallel surfaces are coated with a coating material to increase wear and decrease corrosion. The coating over the brake disk includes multiple layers of the coating material, wherein the coating material includes coating material particles configured to construct a pattern of repetition that is consistent with a lattice structure when applied over the parallel surfaces of the brake disk.

A DC magnetron sputtering apparatus is for depositing a film on a substrate. The apparatus includes a chamber, a substrate support positioned within the chamber, a DC magnetron, and an electrical signal supply device for supplying an electrical bias signal that, in use, causes ions to bombard a substrate positioned on the substrate support. The substrate support includes a central region surrounded by an edge region, the central region being raised with respect to the edge region.

A DC magnetron sputtering apparatus is for depositing a film on a substrate. The apparatus includes a chamber, a substrate support positioned within the chamber, a DC magnetron, and an electrical signal supply device for supplying an electrical bias signal that, in use, causes ions to bombard a substrate positioned on the substrate support. The substrate support includes a central region surrounded by an edge region, the central region being raised with respect to the edge region.

The present invention provides a technique to enable sufficient space saving in a transit-type vacuum processing device. The vacuum processing device 1 of the present invention has: a vacuum chamber 2 where a single vacuum ambience is formed; first and second processing regions 4 and 5 that are provided in the vacuum chamber 2 and have a processing source that performs processing on a planar process surface of a substrate 10; and a conveyance drive member 33 that forms a conveyance path for conveying the substrate 10 so as to pass through the first and second processing regions 4 and 5. The conveyance path is formed as a single annular path when the conveyance path is projected onto a plane (vertical plane) containing: a normal line of an arbitrary point on a process surface of the substrate 10 conveyed through the conveyance path, and a trajectory line drawn by the arbitrary point on the process surface of the substrate 10 when the substrate 10 passes straight through the first and second processing regions 4 and 5.

The present invention provides a technique to enable sufficient space saving in a transit-type vacuum processing device. The vacuum processing device 1 of the present invention has: a vacuum chamber 2 where a single vacuum ambience is formed; first and second processing regions 4 and 5 that are provided in the vacuum chamber 2 and have a processing source that performs processing on a planar process surface of a substrate 10; and a conveyance drive member 33 that forms a conveyance path for conveying the substrate 10 so as to pass through the first and second processing regions 4 and 5. The conveyance path is formed as a single annular path when the conveyance path is projected onto a plane (vertical plane) containing: a normal line of an arbitrary point on a process surface of the substrate 10 conveyed through the conveyance path, and a trajectory line drawn by the arbitrary point on the process surface of the substrate 10 when the substrate 10 passes straight through the first and second processing regions 4 and 5.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

Provided is a chamber system for solid free form fabrication, the chamber system having a deposition chamber, a service chamber and one or more loading/unloading chambers. The chamber system allows for a more efficient and cost effective process to service the deposition apparatus, load holding substrates, and unload workpieces without requiring having to adjust the atmosphere in the deposition chamber.

The present invention provides a substrate heating system and a substrate processing device. The substrate heating system comprises: a top plate on which a substrate is mounted; a heater that is provided to a lower surface of the top plate; a plate temperature detection part that detects the temperature of the top plate; a heater temperature detection part that detects the temperature of the heater; and a heater control part that controls the output of the heater on the basis of the detected temperature of the heater and the detected temperature of the top plate. The heater control part controls the output of the heater such that a detected temperature difference between the detected temperature of the heater and the detected temperature of the top plate does not exceed a prescribed temperature difference upper limit and such that the detected temperature of the top plate is a prescribed set temperature.

The present invention provides a substrate heating system and a substrate processing device. The substrate heating system comprises: a top plate on which a substrate is mounted; a heater that is provided to a lower surface of the top plate; a plate temperature detection part that detects the temperature of the top plate; a heater temperature detection part that detects the temperature of the heater; and a heater control part that controls the output of the heater on the basis of the detected temperature of the heater and the detected temperature of the top plate. The heater control part controls the output of the heater such that a detected temperature difference between the detected temperature of the heater and the detected temperature of the top plate does not exceed a prescribed temperature difference upper limit and such that the detected temperature of the top plate is a prescribed set temperature.