Patent classifications
C23C14/52
Portable sputtering apparatus and method
A portable sputtering apparatus for repairing the damaged surface on aircrafts comprises: a cylindrical chamber, having a top chamber plate and a bottom chamber plate. The cylindrical chamber comprises a welded flange for attachment to a high vacuum system and a first tube and flange assembly for attachment to an inert gas bottle. The top chamber plate comprises a cathode housing, comprising a cathode coated with the material to be sputtered onto the surface of the aircraft, and a second tube and flange assembly for discharge of pressure within the chamber. The bottom chamber plate comprises a second housing that attaches to the surface of an aircraft. Within the second housing is a metal sheet, having an aperture that allows sputtered material to flow onto the surface of the aircraft. The material to be sputtered may be carbon composite or copper.
Portable sputtering apparatus and method
A portable sputtering apparatus for repairing the damaged surface on aircrafts comprises: a cylindrical chamber, having a top chamber plate and a bottom chamber plate. The cylindrical chamber comprises a welded flange for attachment to a high vacuum system and a first tube and flange assembly for attachment to an inert gas bottle. The top chamber plate comprises a cathode housing, comprising a cathode coated with the material to be sputtered onto the surface of the aircraft, and a second tube and flange assembly for discharge of pressure within the chamber. The bottom chamber plate comprises a second housing that attaches to the surface of an aircraft. Within the second housing is a metal sheet, having an aperture that allows sputtered material to flow onto the surface of the aircraft. The material to be sputtered may be carbon composite or copper.
Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
A cathode assembly for a physical vapor deposition (PVD) system includes a target holder and a thickness detector. The target holder is for holding a target, in which the target has a first major surface and a second major surface. The first major surface and the second major surface are respectively proximal and distal to the target holder. The thickness detector is disposed on the target holder. At least one portion of the first major surface is exposed to the thickness detector for allowing the thickness detector to detect the thickness of the target through the first major surface.
Cathode assembly, physical vapor deposition system, and method for physical vapor deposition
A cathode assembly for a physical vapor deposition (PVD) system includes a target holder and a thickness detector. The target holder is for holding a target, in which the target has a first major surface and a second major surface. The first major surface and the second major surface are respectively proximal and distal to the target holder. The thickness detector is disposed on the target holder. At least one portion of the first major surface is exposed to the thickness detector for allowing the thickness detector to detect the thickness of the target through the first major surface.
Evaporation device and evaporation method using the same
The present disclosure provides an evaporation device and an evaporation method using the same. The evaporation device includes at least one evaporation line, a first delivery track, and a tray. The evaporation line includes an evaporation chamber including a plurality of evaporation sub-chambers connected in sequence, an inlet of the evaporation line is formed at one end of the evaporation chamber, an outlet is formed at the other end, and an evaporation source component is provided in the evaporation sub-chamber; a track arranged between the inlet and outlet of evaporation line, the first delivery is located above the evaporation source component; and a tray for placing a workpiece, the tray being movably provided on the first delivery track can be movable between the inlet and the outlet of the evaporation line to deliver the workpiece so as to form deposition on the workpiece by evaporation source component.
Evaporation device and evaporation method using the same
The present disclosure provides an evaporation device and an evaporation method using the same. The evaporation device includes at least one evaporation line, a first delivery track, and a tray. The evaporation line includes an evaporation chamber including a plurality of evaporation sub-chambers connected in sequence, an inlet of the evaporation line is formed at one end of the evaporation chamber, an outlet is formed at the other end, and an evaporation source component is provided in the evaporation sub-chamber; a track arranged between the inlet and outlet of evaporation line, the first delivery is located above the evaporation source component; and a tray for placing a workpiece, the tray being movably provided on the first delivery track can be movable between the inlet and the outlet of the evaporation line to deliver the workpiece so as to form deposition on the workpiece by evaporation source component.
METHOD AND APPARATUS FOR DEPOSITION OF METAL NITRIDES
A structure including a metal nitride layer is formed on a workpiece by pre-conditioning a chamber that includes a metal target by flowing nitrogen gas and an inert gas at a first flow rate ratio into the chamber and igniting a plasma in the chamber before placing the workpiece in the chamber, evacuating the chamber after the preconditioning, placing the workpiece on a workpiece support in the chamber after the preconditioning, and performing physical vapor deposition of a metal nitride layer on the workpiece in the chamber by flowing nitrogen gas and the inert gas at a second flow rate ratio into the chamber and igniting a plasma in the chamber. The second flow rate ratio is less than the first flow rate ratio.
Sensor head for crystal oscillator type of film thickness monitor
A sensor head has: a sensor head main body which has disposed therein the stepping motor; a holder which has disposed on an upper surface thereof a plurality of crystal oscillators and which is driven for rotation by the stepping motor; and a mask body which is mounted on the sensor head main body so as to cover an upper surface of the holder and which has opened therein a film-forming window faced by one of the crystal oscillators. The sensor head also has: a first electrode fixed to that portion of the sensor head main body which is located right under the film-forming window; and second electrodes which are in electrical conduction with each of the crystal oscillators and which are disposed to protrude under a lower surface of the holder.
Sensor head for crystal oscillator type of film thickness monitor
A sensor head has: a sensor head main body which has disposed therein the stepping motor; a holder which has disposed on an upper surface thereof a plurality of crystal oscillators and which is driven for rotation by the stepping motor; and a mask body which is mounted on the sensor head main body so as to cover an upper surface of the holder and which has opened therein a film-forming window faced by one of the crystal oscillators. The sensor head also has: a first electrode fixed to that portion of the sensor head main body which is located right under the film-forming window; and second electrodes which are in electrical conduction with each of the crystal oscillators and which are disposed to protrude under a lower surface of the holder.
Wireless camera wafer for vacuum chamber diagnostics
In some embodiments, the present disclosure relates to a process tool which includes a housing that defines a vacuum chamber. A wafer chuck is in the housing and a carrier wafer is on the wafer chuck. A camera is integrated on the wafer chuck such that the camera faces a top of the housing. The camera is configured to wirelessly capture images of an object of interest within the housing. Outside of the housing is a wireless receiver. The wireless receiver is configured to receive the images from the camera while the vacuum chamber is sealed.