A deposition system is provided capable of controlling an amount of a target material deposited on a substrate and/or direction of the target material that is deposited on the substrate. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, wherein a length of at least one of the plurality of hollow structures is adjustable.

A deposition device including an injection block and a print die is provided, which allows for vertical movement of the injection block while still maintaining connection between the print die and external gas sources. Also disclosed is an injection block suitable for such devices, which provides improved vertical range of motion and thermal consistency compared to conventional injection block devices.

A deposition device including an injection block and a print die is provided, which allows for vertical movement of the injection block while still maintaining connection between the print die and external gas sources. Also disclosed is an injection block suitable for such devices, which provides improved vertical range of motion and thermal consistency compared to conventional injection block devices.

A film forming apparatus for forming a metal oxide film on a substrate, includes: a substrate support part configured to support the substrate; a heating mechanism configured to heat the substrate supported by the substrate support part; a processing container in which the substrate support part is provided; a holder configured to hold a metal material target inside the processing container and connected to a power source; a gas supply part configured to supply an oxygen gas into the processing container; and a controller, wherein the controller is configured to control the heating mechanism, the power source, and the gas supply part so as to execute alternately and repeatedly: forming a predetermined film on the substrate inside the processing container by reactive sputtering in a metal mode; and forming a target metal oxide film by causing the predetermined film to react with an oxygen gas inside the processing container.

A substrate processing apparatus includes a processing chamber where a substrate support on which a substrate is placed and a target holder configured to hold a target are disposed, a freezing device disposed with a gap with respect to a bottom surface of the substrate support and having a chiller and a cold heat medium laminated on the chiller, and a rotating device configured to rotate the substrate support. The substrate processing apparatus further includes a first elevating device configured to raise and lower the substrate support, a coolant channel formed in the chiller to supply a coolant to the gap, and a cold heat transfer material disposed in the gap and being in contact with the substrate support and the cold heat medium so as to transfer heat therebetween.

Certain examples described herein relate to a sputter deposition apparatus including a guiding member to guide a substrate in a conveyance direction, a plasma source to generate a plasma, and a magnet arrangement. The magnet arrangement is configured to confine the plasma within the apparatus to a pre-treatment zone, within which the substrate is exposed to the plasma in use. The magnet arrangement is also configured to confine the plasma within the apparatus to a sputter deposition zone, located after the pre-treatment zone in the conveyance direction, to provide for sputter deposition of a target material to the substrate in use. The pre-treatment and sputter deposition zones are disposed about the guiding member.

Certain examples described herein relate to a sputter deposition apparatus including a guiding member to guide a substrate in a conveyance direction, a plasma source to generate a plasma, and a magnet arrangement. The magnet arrangement is configured to confine the plasma within the apparatus to a pre-treatment zone, within which the substrate is exposed to the plasma in use. The magnet arrangement is also configured to confine the plasma within the apparatus to a sputter deposition zone, located after the pre-treatment zone in the conveyance direction, to provide for sputter deposition of a target material to the substrate in use. The pre-treatment and sputter deposition zones are disposed about the guiding member.

A sputter deposition apparatus including: a plasma generation arrangement arranged to provide single plasma for sputter deposition of target material within a sputter deposition zone; a conveyor system arranged to convey a substrate through the sputter deposition zone in a conveyance direction; and one or more target support assemblies arranged to support one or more targets in the sputter deposition zone so as to provide for sputter deposition of the target material on the substrate utilising the plasma such that as the substrate is conveyed through the sputter deposition zone in use there is deposited: a first stripe on the substrate; and a second stripe on the substrate. The first stripe includes at least one of: a different density of the target material or a different composition of the target material than the second stripe.

A method for operating a coating system for producing layer systems includes the steps of: (i) coating a layer system in a coating facility; (ii) determining a spectral actual measuring plot for the layer system in an optical measuring system; (iii) determining an actual data set by fitting a simulation target measuring plot to the actual measuring plot; (iv) determining actual layer parameters as computed actual layer parameters from the simulation target measuring plot by simulation of the layer system using the actual data set; (v) outputting the actual data set and the computed actual layer parameters at least to a decision system; (vi) providing quality requirement data; and (vii) deciding on an approval of the layer system in the decision system on the basis of a comparison of at least the actual data set, the computed actual layer parameters and. the quality requirement data. A coating system for producing layer systems is also disclosed.

A method for operating a coating system for producing layer systems includes the steps of: (i) coating a layer system in a coating facility; (ii) determining a spectral actual measuring plot for the layer system in an optical measuring system; (iii) determining an actual data set by fitting a simulation target measuring plot to the actual measuring plot; (iv) determining actual layer parameters as computed actual layer parameters from the simulation target measuring plot by simulation of the layer system using the actual data set; (v) outputting the actual data set and the computed actual layer parameters at least to a decision system; (vi) providing quality requirement data; and (vii) deciding on an approval of the layer system in the decision system on the basis of a comparison of at least the actual data set, the computed actual layer parameters and. the quality requirement data. A coating system for producing layer systems is also disclosed.