A versatile high throughput deposition apparatus includes a process chamber and a workpiece platform in the process chamber. The workpiece platform can hold a plurality of workpieces around a center region and to rotate the plurality of workpieces around the center region. Each of the plurality of workpieces includes a deposition surface facing the center region. A gas distribution system can distribute a vapor gas in the center region of the process chamber to deposit a material on the deposition surfaces on the plurality of workpieces. A magnetron apparatus can form a closed-loop magnetic field near the plurality of workpieces. The plurality of workpieces can be electrically biased to produce a plasma near the deposition surfaces on the plurality of workpieces.

A versatile high throughput deposition apparatus includes a process chamber and a workpiece platform in the process chamber. The workpiece platform can hold a plurality of workpieces around a center region and to rotate the plurality of workpieces around the center region. Each of the plurality of workpieces includes a deposition surface facing the center region. A gas distribution system can distribute a vapor gas in the center region of the process chamber to deposit a material on the deposition surfaces on the plurality of workpieces. A magnetron apparatus can form a closed-loop magnetic field near the plurality of workpieces. The plurality of workpieces can be electrically biased to produce a plasma near the deposition surfaces on the plurality of workpieces.

Exemplary methods of treating a chamber may include delivering a cleaning precursor to a remote plasma unit. The methods may include forming a plasma of the cleaning precursor. The methods may include delivering plasma effluents of the cleaning precursor to a processing region of a semiconductor processing chamber. The processing region may be defined by one or more chamber components. The one or more chamber components may include an oxide coating. The methods may include halting delivery of the plasma effluents. The methods may include treating the oxide coating with a hydrogen-containing material delivered to the processing region subsequent halting delivery of the plasma effluents.

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.

Disclosed are an apparatus for and a method of manufacturing a semiconductor device. The apparatus includes a chamber, an evaporator that evaporates an organic source to provide a source gas on a substrate in the chamber, a vacuum pump that pumps the source gas and air from the chamber, an exhaust line between the vacuum pump and the chamber, and an analyzer connected to the exhaust line. The analyzer detects a derived molecule produced from the organic source and determines a replacement time of the evaporator.

Disclosed are an apparatus for and a method of manufacturing a semiconductor device. The apparatus includes a chamber, an evaporator that evaporates an organic source to provide a source gas on a substrate in the chamber, a vacuum pump that pumps the source gas and air from the chamber, an exhaust line between the vacuum pump and the chamber, and an analyzer connected to the exhaust line. The analyzer detects a derived molecule produced from the organic source and determines a replacement time of the evaporator.

A substrate fixing device according to the present invention is a substrate fixing device configured to fix a substrate so that a deposition material evaporated from at least one evaporation source is deposited on the substrate. The substrate fixing device includes a substrate temperature adjustment part configured to transfer heat to the substrate, and a substrate fixing part coupled to one side of the substrate temperature adjustment part and configured to fix the substrate, in which the substrate fixing part fixes the substrate so that a front surface of the substrate is exposed in a direction toward the evaporation source, and in which a space is formed between the substrate fixing part and a rear surface of the substrate.

A substrate fixing device according to the present invention is a substrate fixing device configured to fix a substrate so that a deposition material evaporated from at least one evaporation source is deposited on the substrate. The substrate fixing device includes a substrate temperature adjustment part configured to transfer heat to the substrate, and a substrate fixing part coupled to one side of the substrate temperature adjustment part and configured to fix the substrate, in which the substrate fixing part fixes the substrate so that a front surface of the substrate is exposed in a direction toward the evaporation source, and in which a space is formed between the substrate fixing part and a rear surface of the substrate.

Embodiments of the present disclosure generally relate to flexible substrate fabrication. In particular, embodiments described herein relate to an apparatus and methods for flexible substrate fabrication using nip rollers to improve tension uniformity. In one embodiment, a roller assembly includes a primary roller for transporting a flexible substrate, wherein the primary roller has a first end and a second end, wherein the flexible substrate has a coating disposed hereon, and wherein one or more edge regions are not covered by the coating. The roller assembly further includes a first nip roller disposed at the first end of the primary roller that contacts a first edge region of the one or more edge regions, and a second nip roller disposed at the second end of the primary roller that contacts a second edge region of the one or more edge regions.

An apparatus for contactless transportation of a device in a vacuum processing system is described. The apparatus includes: a magnetic transportation arrangement for providing a magnetic levitation force (F.sub.L) for levitating the device, the magnetic transportation arrangement comprising one or more active magnetic units; a sensor for monitoring a motion of the device, and a controller configured for controlling the one or more active magnetic units based on a signal provided by the sensor.