C23C14/5826

Metal oxy-flouride films based on oxidation of metal flourides

An article comprises a body having a coating. The coating comprises a Y-O-F coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.

MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR ORGANIC EL DISPLAY DEVICE
20200006658 · 2020-01-02 ·

In a manufacturing method for an organic EL display device according to an embodiment, a support substrate is mounted on a surface of a vapor deposition mask (S3) which surface faces a vapor deposition source and has been subjected to a modification treatment (S2), and a desired organic material is evaporated to the vapor deposition mask, so as to deposit an organic layer formed of multiple layers in a desired area on the support substrate (S4), and further a second electrode is formed on the organic layer (S8). An exposed surface of the vapor deposition mask or an exposed surface of the organic layer formed on the vapor deposition mask is modified at at least one timing among: before depositing the organic layer formed of the multiple layers; before or after depositing each organic layer of the multiple layers forming the organic layer; and before forming the second electrode.

Treatment of a thin film by hydrogen plasma and polarisation in order to improve the crystalline quality thereof

Methods for treating a thin film made from a conductive or semiconductive material may improve the crystalline quality thereof. Such methods may include: supplying a substrate including, on one of the faces thereof, a thin film of the material; and biased plasma treating the assembly formed by the substrate and the thin film at a given temperature and for a given time, so as to obtain a crystalline reorganization over a depth of the thin film, the biased plasma treatment including an electrical biasing of the thin film and an exposure of the film thus biased to a hydrogen plasma, the biased plasma treatment being implemented at a temperature that is below the melting points of the thin film and of the substrate.

THIN FILM PACKAGING METHOD, THIN FILM PACKAGING DEVICE, AND SOLAR CELL

The present disclosure relates to a thin film packaging method and device, a thin film packaging system, and a solar cell. The film packaging method includes: forming an inorganic barrier film on an electronic device formed with a metal oxide thin film, the inorganic barrier film being disposed on a surface of the metal oxide thin film; and performing a reduction treatment on the electronic device to cause a reduction reaction of the metal oxide thin film to obtain a corresponding molten metal, wherein the molten metal is filled and cured in a pore of the inorganic barrier film. In the technical solution, the pore in the inorganic barrier layer can be compensated, thereby improving the effect of the film packaging.

Oxidation barrier layer

A method for producing an oxidation barrier layer on a workpiece substrate in which the oxidation barrier layer is produced by means of physical deposition from the gas phase (PVD) and is an oxide that is materially related to the uncoated surface of the workpiece.

High-Refractive-Index Hydrogenated Silicon Film And Methods For Preparing The Same

A preparation method for a high-refractive index hydrogenated silicon film, a high-refractive index hydrogenated silicon film, a light filtering lamination and a light filtering piece. The method includes: (a) by magnetic controlled Si target sputtering, Si deposits on a base body, forming a silicon film, which (b) forms an oxygenic hydrogenated silicon film in environment of active hydrogen and active oxygen, the amount of active oxygen accounts for 4%-99% of the total amount of active hydrogen and active oxygen, or, a nitric hydrogenated silicon film in environment of active hydrogen and active nitrogen, the amount of active nitrogen accounts for 5%-20% of the total amount of active hydrogen and active nitrogen. Sputtering and reactions are separately conducted, Si first deposits on the base body by magnetic controlled Si target sputtering, and then plasmas of active hydrogen and active oxygen/nitrogen react with silicon for oxygenic or nitric SiH.

Flourination process to create sacrificial oxy-flouride layer

An article comprises a body having a coating. The coating comprises a YOF coating or other yttrium-based oxy-fluoride coating generated either by performing a fluorination process on a yttrium-based oxide coating or an oxidation process on a yttrium-based fluorine coating.

METHOD AND APPARATUS OF FORMING STRUCTURES BY SYMMETRIC SELECTIVE PHYSICAL VAPOR DEPOSITION

Methods and apparatus for physical vapor deposition (PVD) are provided herein. In some embodiments, a method for PVD includes providing a first stream of a first material from a first PVD source towards a surface of a substrate at a first non-perpendicular angle to the plane of the substrate surface and rotating and linearly scanning the substrate through the stream of first material to deposit the first material on all features formed on the substrate, providing a second stream of an ionized dopant species from a dopant source towards the surface of the substrate at a second non-perpendicular angle to the plane of the substrate surface, and implanting the ionized dopant species in the first material deposited only on a top portion and a portion of the first and second sidewalls of all the features on the substrate by rotating and linearly scanning the substrate via the substrate support.

HIGH-BARRIER, METAL OXIDE FILMS

This disclosure provides compositions and methods for a film, which may include a base film and a coating layer on the base film, wherein the coating layer has a surface energy of at least 30 dynes/cm and consists essentially of nylon, polyester, ethylene vinyl alcohol-based copolymer, polyvinyl alcohol-based polyethylene terephthalate, polyvinylchloride, acrylate-based polymers, methacrylate-based polymers, polyurethane, polyalkylimine, acid-modified polyolefins, polyetherester-amide block copolymer, and combinations thereof. Further, the film may include a metal oxide layer on the coating layer, wherein the metal oxide layer has an optical density of equal to or less than 0.5 and a thickness from 0.1 nm through 100 nm. Further still, the film has an oxygen transmission rate of less than 4 cm.sup.3/m.sup.2/day at 23 C. and 0% relative humidity, a water vapor transmission rate of less than 4 g/m.sup.2/day at 38 C. and 90% relative humidity, and a thickness of 5 m through 50 m.

METHOD FOR PRODUCING COATED SUBSTRATES, COATED SUBSTRATES AND USE THEREOF
20190255563 · 2019-08-22 ·

The present disclosure relates to coated non-metallic substrates and coated metallic substrates and methods for producing such coated substrates. A variant of the method is characterized in that a mat or glossy coating is underneath a metallic layer obtained in some eases by way of vapor deposition and/or sputtering. In another variant, the metallic layer is sufficiently thin so that it remains transparent or translucent to visible light. The coated substrates may include multiple layers such as metallic layers, polysiloxane layers, a color layer, a conversion layer, a primer layer, and/or a transparent or colored layer. An application system for applying a metallic layer to at least one surface of a substrate may include a plasma generator and/or a corona system for treating one or more layers by plasma treatment and/or corona treatment.