Molybdenum(0) coordination complexes comprising ligands which each coordinate to the metal center by nitrogen or phosphorous are described. Methods for depositing molybdenum-containing films on a substrate are described. The substrate is exposed to a molybdenum precursor and a reactant to form the molybdenum-containing film (e.g., elemental molybdenum, molybdenum oxide, molybdenum carbide, molybdenum silicide, molybdenum nitride). The exposures can be sequential or simultaneous.

A seamless hexagonal h-BN atomic monolayer thin film has a pseudo-single crystal structure including a plurality of h-BN grains that are seamlessly merged. Each of the h-BN grains has a dimension in a range from about 10 m to about 1,000 m. The seamless hexagonal boron nitride (h-BN) atomic monolayer thin film may be fabricated by a process including pre-annealing a metal thin film at a first temperature in a chamber while supplying hydrogen gas to the chamber; supplying nitrogen source gas and boron source gas to the chamber; and forming the seamless h-BN atomic monolayer thin film having a pseudo-single crystal atomic monolayer structure having a grain dimension in a range from about 10 m to about 1,000 m by annealing the pre-annealed metal thin film at a second temperature.

A method and system is provided for reducing surface roughness of a diesel engine component. The method and system may apply a voltage to a plasma electrolyte polishing cell. The plasma electrolyte polishing cell may include a diesel engine component and an aqueous electrolyte solution. The method and system may cause a plasma layer to form around a surface of the diesel engine component as a result of applying the voltage to the plasma electrolyte polishing cell. The method and system may terminate the voltage to the plasma electrolyte polishing cell. The method and system may apply a coating process to the diesel engine component.

The purpose of the present invention is to obtain a protective film having a segmented structure that is stable in terms of strength and that prevents the destruction or damage of a groove structure due to load deformation stress from outside and inside forces, by means of, in particular, a structure that connects a side surface of a groove to the bottom section of the groove and a structure of the bottom section of the groove. The present invention is a protective film having a segmented structure, the film being formed by depositing a film on a base material, wherein the protective film is obtained by depositing the protective film, after machining a groove in the base material, forming spaces between the segmented protective film on the base material, and the vertical cross-sectional surface of a part where the groove side surface and the groove bottom surface intersect is connected by a downward convex curve and the vertical cross-sectional surface of the bottom section of the groove is a downward convex curve or a straight line.

Technology is described for an antiwetting coating attached to a substrate (e.g., metal substate) on a liquid metal container. In one example, the liquid metal container includes a first enclosure member, a second enclosure member, liquid metal, and an antiwetting coating. The first enclosure member includes a first substrate with a first surface. The second enclosure member includes a second substrate with a second surface. The first enclosure member is positioned proximate to the second enclosure member such that a gap is formed between the first surface and the second surface. The liquid metal positioned within the gap. An antiwetting coating attached to the first surface and/or the second surface. The antiwetting coating includes chromium nitride (CrN), dichromium nitride (Cr.sub.2N), chromium (III) oxide (Cr.sub.2O.sub.3), and/or titanium aluminum nitride (TiAlN) attached to the first surface and/or the second surface.

A method of imparting electrical conductivity on an interlayer material is disclosed. In one non-limiting example the method includes forming the interlayer material from at least one layer of fabric of thermoplastic fibers. The method further includes, treating the surface of the interlayer material using an atmospheric-pressure plasma such that the surface of the interlayer material undergoes a surface activation. Additionally, the method includes depositing a layer of conductive material on the surface of the interlayer material such that the conductive material increases a conductivity of the interlayer material.

Disclosed herein is a method of treating a composite piston pin, including: preparing the piston pin of which at least surface layer includes a composite material including a reinforcing fiber and a resin; improving roughness by processing the surface layer of the piston pin; and forming a coating layer on the surface layer processed to reduce a friction coefficient of the piston pin.

The disclosed and claimed subject matter relates to the use of Ru(I) precursors in ALD or ALD-like processes for the selective deposition of Ru films.

Methods of producing an optical surface atop an exterior of a substrate that includes smoothing the exterior using an ALD process to sequentially deposit ALD layers to produce one or more ALD films that fill spaces between spaced-apart asperities existing on the exterior, and thereafter depositing a reflective material on the smoothed exterior of the substrate to produce the optical surface. The smoothing resulting from depositing the ALD film on the exterior of the substrate causes the grain size of the reflective material to be reduced in comparison to the grain size that would exists without having deposited the ALD film on the exterior of the substrate. The smoothing is sufficient to cause a reduction in grain size that results in a reduction in plasmon absorption in the optical surface in comparison to the plasmon absorption that would otherwise exist without having reduced the grain size of the reflective material.

The present invention realizes a polymer substrate with hard coating layer comprising a high level of environmental resistance and a high level of abrasion resistance. A polymer substrate with hard coating layer is provided that comprises a polymer substrate (60) having a thickness of 1 mm to 20 mm and a hard coating layer (70,80) on the surface thereof. Here, in this polymer substrate with hard coating layer, the hard coating layer (70,80) is laminated on the surface of the polymer substrate, contains as a main component thereof a hydrolysis-condensation product of an organic silicon compound, has a thickness of 0.1 m to 20 m, makes direct contact with a cured underlayer on the opposite side of the polymer substrate, is formed from an organic silicon compound by PE-CVD, and satisfies all of the following requirements (a) to (c): (a) film thickness of the silicon oxide layer is within the range of 3.5 m to 9.0 m, (b) maximum indentation depth of the surface of the silicon oxide layer as determined by measuring nanoindentation under conditions of a maximum load of 1 mN is 150 nm or less, and (c) the value of critical compression ratio K of the silicon oxide layer, as defined by formula (1) in a 3-point bending test of the polymer substrate with hard coating layer that imparts indentation displacement in which the surface laminated with the silicon oxide layer becomes concave, is 0.975 or less.