A film forming method for forming a film on a pattern and cleaning a space of a processing container configured to perform therein a plasma processing under a reduced pressure environment. The space is provided with a pedestal and an upper electrode configured to supply radio-frequency power. The upper electrode is disposed in the space to face the pedestal. The method includes: placing a substrate having the pattern on the pedestal provided in the space of the processing container configured to perform therein a plasma processing under a reduced pressure environment; adjusting temperature of a main surface of the substrate for each of a plurality of regions on the main surface of the substrate; and after the adjusting with the substrate on the pedestal, repeating an ordered sequence of a first step of forming a deposition film on the pattern of the substrate and on an inner surface of the processing container, wherein the inner surface includes an inner surface of the upper electrode; and a second step of supplying electric power only to the upper electrode to generate plasma in the space, thereby cleaning the space and the inner surface.

A film formation method includes: providing a substrate including a first region in which a first material is exposed and a second region in which a second material different from the first material is exposed; forming a target film selectively in the first region among the first region and the second region; and removing a product produced in the second region in the forming the target film by supplying ClF.sub.3 gas to the substrate.

A display device includes an active matrix substrate; a light-emitting element layer including a plurality of first electrodes, a function layer, and a second electrode; and a sealing layer. The light-emitting element layer further includes an edge cover layer configured to cover an end portion of each one of the plurality of first electrodes. The edge cover layer includes a plurality of openings configured to expose the plurality of first electrodes included in a plurality of pixels. The plurality of openings include a first opening with a rectangular shape. A first individual vapor deposition film with a rectangular shape is formed on the first electrode covering the first opening. In the first individual vapor deposition film, projection portions projecting from sections corresponding to at least some opposing vertices of the first opening to an opposite side to the first opening are provided on the edge cover layer.

A deposition mask includes a body portion, a pattern portion that penetrates the body portion and is configured to allow deposition material to pass through the body portion, a blocking portion disposed on the body portion, and a support portion disposed on the body portion adjacent to the blocking portion. The blocking portion contacts a display substrate, blocks the deposition material, and defines the pattern portion. The support portion contacts the display substrate.

Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.

A high throughput deposition apparatus includes a process chamber, a plurality of targets that form a first closed loop in the process chamber, wherein the first closed loop includes a long dimension defined by at least a first pair of targets and a short dimension defined by at least a second pair of targets, a first substrate carrier assembly that can hold one or more substrates and configured to receive a deposition material from the plurality of targets in the first closed loop, and a transport mechanism that can move the first substrate carrier assembly along an axial direction through the first closed loop in the first process chamber.

A masking block configured to contact a growth substrate to define a pattern of a two-dimensional material directly synthesized on the growth substrate, includes a base substrate; a gamma-alumina film that is disposed on the base substrate and that has an upper surface in which a (110) plane is dominant as being more than 50%; and a hexagonal boron nitride film that is doped with carbon and oxygen that is disposed on the gamma-alumina film, and that has reduced defects due to properties of the gamma-alumina film, wherein the hexagonal boron nitride film contains an amount of carbon ranging from 1 at % to 15 at % based on total atoms of carbon, oxygen, nitrogen and boron in the hexagonal boron nitride film and includes voids such that a coverage ratio of the hexagonal boron nitride film on the gamma-alumina film is less than 1 and equal to or more than 0.9.

There is provided a film formation method. The method comprises: preparing a substrate having a first region on which an oxide formed by oxidization of a surface of a conductive material is exposed and a second region on which an insulating material is exposed; replacing a film of the oxide with a film of boron oxide by supplying a boron halide gas to the substrate; etching the boron oxide film in the first region and forming a self-assembled monolayer film in the second region by supplying a gas of a fluorine-containing silane compound to the substrate; and forming a conductive target film selectively in the first region, from the first region and the second region, using the self-assembled monolayer film formed in the second region, the first region having the conductive material exposed thereon.

A deposition apparatus includes a chamber, a deposition source disposed in the chamber, a mask assembly, and a base substrate disposed on the mask assembly. The mask assembly includes a frame including frame openings, a mask disposed on the frame and including deposition holes, and a welding stick disposed on the mask. A welding groove is disposed along an edge of the frame and has a depth in the thickness direction of the frame. The welding stick overlaps the welding groove.

A plasma processing method including: a process of placing a work piece on a stage provided in a chamber, the work piece including a substrate and a holding member having an adhesive layer on a surface and holding the substrate via the adhesive layer, and having an exposed portion where the adhesive layer is exposed outside the substrate; and a plasma etching process of etching the substrate with a plasma generated in the chamber, with the exposed portion exposed to the plasma. In response to occurrence of an interruption in the plasma etching process, a cleaning process of exposing a surface of the substrate to a plasma containing an oxidizing gas is performed, and then the plasma etching process is resumed.