C23C16/042

METHOD FOR PRODUCING BASE FOR METAL MASKS, METHOD FOR PRODUCING METAL MASK FOR VAPOR DEPOSITION, BASE FOR METAL MASKS, AND METAL MASK FOR VAPOR DEPOSITION

A rolled metal sheet includes an obverse surface and a reverse surface that is a surface located opposite to the obverse surface. At least either one of the obverse surface and the reverse surface is a processing object. A method for manufacturing a metal mask substrate includes reducing a thickness of the rolled metal sheet to 10 μm or less by etching the processing object by 3 μm or more by use of an acidic etching liquid, and roughening the processing object so that the processing object becomes a resist formation surface that has a surface roughness Rz of 0.2 μm or more, thereby obtaining a metal mask sheet.

Fixture for coating of double-ended tools

Fixture (1) for exposing two opposite ends of an object to be coated (6) to a vapor deposition while masking an intermediate portion (8) of the object against being coated, comprising an object holding device (OHD), whereas the object holding device (OHD) consists of at least one battery (3) of hole plate strips (2) which are designed and arranged that way that each single hole (retaining hole; H) is formed by a pair of hole plate strips (2) that way that the first segment (4) of the hole (H) is embodied by the preceding hole plate strip (2) and that the second segment (5) of the hole (H) is embodied by the subsequent hole plate strip (2).

Directional Deposition for Semiconductor Fabrication

A method of depositing a material on one of two, but not both, sidewalls of a raised structure formed on a substrate includes tilting a normal of the substrate away from a source of the deposition material or tilting the source of the deposition material away from the normal of the substrate. The method may be implemented by a plasma-enhanced chemical vapor deposition (PECVD) technique.

ALIGNMENT MASK, METAL MASK ASSEMBLY, AND PREPARATION METHOD THEREFOR
20220013396 · 2022-01-13 ·

Disclosed are an alignment mask, a metal mask assembly, and a preparation method therefor. The alignment mask includes a mask body. The mask body includes: multiple alignment holes; and, separating parts surrounding at least some alignment holes and used for separating the areas at where the at least some alignment holes are located from other areas, where the separation parts include at least one semi-etched line.

FILM FORMING METHOD AND SEMICONDUCTOR PRODUCTION APPARATUS

A film forming method is provided. In the film forming method, a mask is prepared based on a measurement result of a surface state of a substrate. The mask is transferred into a process chamber and the substrate is transferred into the process chamber. Then, a film is formed on a back surface of the substrate while the mask is disposed onto the back surface of the substrate.

TEXTURED REGION OF A SUBSTRATE TO REDUCE SPECULAR REFLECTANCE INCORPORATING SURFACE FEATURES WITH AN ELLIPTICAL PERIMETER OR SEGMENTS THEREOF, AND METHOD OF MAKING THE SAME

A substrate for a display article includes: a primary surface; a textured region on at least a portion of the primary surface, the textured region comprising surface features that reflect a random distribution, each of the surface features comprising a perimeter that is parallel to a base-plane extending through a thickness of the substrate below the textured region, wherein the perimeter is elliptical. The textured region can further include (i) one or more higher surfaces residing at a higher mean elevation from the base-plane and (ii) one or more lower surfaces residing at a lower mean elevation from the base-plane that is closer to the base-plane than the higher mean elevation. The higher mean elevation can differ from the lower mean elevation by a distance within a range of 0.05 μm to 0.70 μm.

Low temperature lift-off patterning for glassy carbon films

A method of fabricating a glassy carbon film is described. The method includes forming a soluble layer on a substrate, forming a lift-off stack that includes a lift-off mask layer and a hard-mask layer, and forming a pattern in the lift-off stack to expose a portion of the soluble layer. The exposed portions of the soluble layer are removed to expose a portion of the substrate. A carbon material is over the exposed portion of the substrate. The soluble layer is dissolved in a solvent, and the lift-off stack is lifted-off.

Multicolor Fixture Finishes
20210346910 · 2021-11-11 · ·

A plumbing fixture having a multi-color appearance includes a first portion including a first finish having a first appearance and a second portion including a second portion having a second appearance that differs from the first appearance. The plumbing fixture further includes a transition region between the first portion and the second portion, wherein the appearance of the third region is graduated from the first appearance to the second appearance between a first end of the transition region adjacent the first portion and a second end of the transition region adjacent the second portion. The plumbing fixture has an ombré appearance as a result of the graduated transition between the first portion and the second portion.

DEPOSITION APPARATUS INCLUDING AN OFF-AXIS LIFT-AND-ROTATION UNIT AND METHODS FOR OPERATING THE SAME

A deposition chamber includes a vacuum enclosure, an electrostatic chuck having a flat top surface located within a vacuum enclosure, a lift-and-rotation unit extending through or laterally surrounding the electrostatic chuck at a position that is laterally offset from a vertical axis passing through a geometrical center of the electrostatic chuck, a gas supply manifold configured to provide influx of gas into the vacuum enclosure, and a pumping port connected to the vacuum enclosure.

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM

There is provided a technique that includes: (a) supplying an adsorption suppressor to a substrate having a surface on which a first base and a second base are exposed under a first temperature to adsorb the adsorption suppressor on a surface of one base of the first base and the second base; (b) thermally annealing the substrate under a second temperature higher than the first temperature after adsorbing the adsorption suppressor on the surface of the one base; and (c) forming a film on a surface of the other base different from the one base of the first base and the second base by supplying a film-forming gas to the thermally-annealed substrate under a third temperature lower than the second temperature.