Manufacturing apparatus, systems and method of making silicon (Si) nanowires on carbon based powders, such as graphite, that may be used as anodes in lithium ion batteries are provided. In some embodiments, an inventive tumbler reactor and chemical vapor deposition (CVD) system and method for growing silicon nanowires on carbon based powders in scaled up quantities to provide production scale anodes for the battery industry are described.

Manufacturing apparatus, systems and method of making silicon (Si) nanowires on carbon based powders, such as graphite, that may be used as anodes in lithium ion batteries are provided. In some embodiments, an inventive tumbler reactor and chemical vapor deposition (CVD) system and method for growing silicon nanowires on carbon based powders in scaled up quantities to provide production scale anodes for the battery industry are described.

Implementations described herein generally relate to methods of selective deposition of metal silicides. More specifically, implementations described herein generally relate to methods of forming nickel silicide nanowires for semiconductor applications. In one implementation, a method of processing a substrate is provided. The method comprises forming a silicon-containing layer on a surface of a substrate, forming a metal-containing layer comprising a transition metal on the silicon-containing layer, forming a confinement layer on exposed surfaces of the metal-containing layer and annealing the substrate at a temperature of less than 400 degrees Celsius to form a metal silicide layer from the silicon-containing layer and the metal-containing layer, wherein the confinement layer inhibits formation of metal-rich metal silicide phases.

In various embodiments, systems, methods, and apparatus are provided for stabilizing filaments in a chemical vapor deposition (CVD) reactor system. A system includes a base plate having a plurality of electrical connections, a pair of filaments extending from the base plate, and a stabilizer connecting the pair of filaments. Each filament is in electrical contact with, and defines a conductive path between, the two electrical connections. A method of stabilizing the filaments includes providing the pair of filaments, and connecting the pair of filaments with at least one stabilizer. The stabilizer may include an electrically insulating material.

The bulk polysilicon deposition rate of a Siemens method CVD reactor system having a power supply configured for deposition on a solid rod silicon filament of a specified diameter and length is increased by installing a high surface area silicon filament in the CVD reactor in lieu of the specified solid rod filament, the high surface area filament being dimensionally configured such that it can be used in place of the solid rod filament without reconfiguring or replacing the reactor power supply. The high surface area filament can be tubular, flat, or shaped with radial fins. Existing reactors thereby require only adaptation or replacement of filament supports to be adapted for use of the high surface area filament. The high surface area filament can be grown from silicon melt using the EFG method, so as to maintain a cross-sectional shape within a tolerance of +/10%.

In various embodiments, systems, methods, and apparatus are provided for stabilizing filaments in a chemical vapor deposition (CVD) reactor system. A system includes a base plate having a plurality of electrical connections, a pair of filaments extending from the base plate, and a stabilizer connecting the pair of filaments. Each filament is in electrical contact with, and defines a conductive path between, the two electrical connections. A method of stabilizing the filaments includes providing the pair of filaments, and connecting the pair of filaments with at least one stabilizer. The stabilizer may include an electrically insulating material.

A method and process for the production of bulk polysilicon by chemical vapor deposition (CVD) where conventional silicon slim rods commonly used in Siemens-type reactors are replaced with shaped silicon filaments of similar electrical properties but larger surface areas, such as silicon tubes, ribbons, and other shaped cross sections. Silicon containing gases, such as chlorosilane or silane, are decomposed and form a silicon deposit on the hot surfaces of the filaments The larger starting surface areas of these filaments ensures a higher production rate without changing the reactor size, and without increasing the number and length of the filaments. Existing reactors need only the adaptation or replacement of filament supports to use the new filaments. The filaments are grown from silicon melt by Edge-defined, Film-fed Growth (EFG) method. This also enables the doping of the filaments and simplification of power supplies for new reactors.

The present disclosure relates to a polysilicon preparation apparatus for preventing ground fault current and having an excellent effect of removing silicon dust. The polysilicon preparation apparatus includes a chamber comprising a housing with an opened lower portion and a base plate coupled to the lower portion of the housing, and a ceramic particle layer on an upper surface of the base plate, for preventing silicon dusts generated during a process from directly contacting the base plate and to be removed together with silicon dusts after the process.

A method for preparing multi-wall carbon nanotubes comprising atomizing a precursor solution comprising an aromatic hydrocarbon and a carrier gas. The mixture is then injected through an ultrasonic atomization system to form atomized precursor droplets. Then by injecting the atomized precursor droplets from the top of a vertical chemical vapor deposition reactor, the droplets can then react with a reaction gas in the reactor vessel to form a film that adsorbs to a growth surface in the reactor vessel. Layer by layer multi-wall carbon nanotubes are formed. This method is repeated to form layers of the multi-wall carbon nanotubes. The nanotubes formed have an outer diameter of 10 nm-51 nm and a length to diameter aspect ratio of 7200-13200.

Implementations described herein generally relate to methods of selective deposition of metal silicides. More specifically, implementations described herein generally relate to methods of forming nickel silicide nanowires for semiconductor applications. In one implementation, a method of processing a substrate is provided. The method comprises forming a silicon-containing layer on a surface of a substrate, forming a metal-containing layer comprising a transition metal on the silicon-containing layer, forming a confinement layer on exposed surfaces of the metal-containing layer and annealing the substrate at a temperature of less than 400 degrees Celsius to form a metal silicide layer from the silicon-containing layer and the metal-containing layer, wherein the confinement layer inhibits formation of metal-rich metal silicide phases.